半導(dǎo)體刻蝕設(shè)備LAM TCP 9400 PM SOP.doc

PM SOP TCP 9400SE PTX POLY ALLIANCE ETCHER 1 0 Safety Highlights All PM and corrective maintenance are only allowed to be perform by trained personnel or under strict guidance of the trained personnel for trainees 1 1Before start of PM use SMS SMM06TJ1 or SMM17TJ1 put the correct chamber to PM state Input the reason for wet clean 1 2Place a Man at work Plasma sign at working area throughout the whole PM 1 3Remember to purge the chm for 5 10 minutes with the in house vacuum immediately when the chamber is vented for wet clean or corrective maintenance 1 4Remember to wear facemask with acid gas filter cartridge during dismantling and while cleaning the dirty chamber or parts 1 5Please remember to wear SK gloves chemical goggles glove while using 100 IPA 1 6Remember to use AK gloves chemical goggles while using HF acid nitric acid and H2O2 1 7Remember to use SK gloves chemical goggles while using ethylene glycol galden or brine 1 8Use SK gloves and handle sharp edges with care ESC chuck and turbopump from IPA Cover with cleanroom wipes and ESC covers for ESC chuck protection Do not wipe ESC with DIW only ipa is allowed if ESC was not remove for cleaning Use fluorescent light while doing wet clean to ensure all polymers are completely removed and clean Chamber Cleaning 4 1Use soft scrotch brite to scrub lightly the chmb wall with 100 IPA until all stain is removed 4 2Thorough clean all exposed surfaces in main chamber Wipe the chamber hardware until the wipes come out clean showing no remaining etch residue Scrub the wall lightly with scotch brite if required Pay special attention to the window and gate valve port 4 3Remove the eight screws that secure the middle chamber 4 4Remove the middle chamber o ring and RF gasket 4 5Clean the transition manifold thoroughly VAT valve must be in close position while cleaning the manifold area to avoid contamination of the turbo pump 4 6Final wipe all surface with 100 IPA Wipe down the ESC chuck and chamber wall with IPA until no discoloration on the wipes Inspect the ESC chuck to check for any scratches and exposed aluminum Protect the ESC chuck with ESC cover to prevent accidentally damage on the ESC chuck 4 7Flush the gas ring ceramic insert ring and chamber quartz disk under flowing DI water then baked the parts in oven at 110c for 30 mins TM Slot valve Inner Door Cleaning 4 8Vent the TM to ATM Vacuum and clean the TM cover before opening the TM cover 4 9Clean the polymer and particles trapped at the edge of the chmb side with scrotch brite and IPA 4 10Scrotch brite and clean the inner door and install back Inspect the chemraz door o ring replace if the chemraz o ring is crack or worn out 4 11Exercise the door up down few times to ensure that the alignment is correct and door is fully close properly 4 12Clean and vacuum the TM and robot assembly with DI water and final wipe with 100 IPA 4 13Pump down the TM and follow by pump purge with 3 cycles VAT Valve Cleaning 4 14Remove the pendulum valve and locking ring to replace the locking ring O ring 4 15Scotch brite clean the pendulum plate locking ring and pendulum plate and bake the parts in oven at 110c for 30 mins ESC cleaning procedure Apply to when chmb down due to AL ball Type A defects lifter pin lifter bellows replacement Be careful of the ESC RF rod and protect the ESC surface form damage at all time when cleaning 1 Remove the ESC chuck and clean and flush under running DI water 2 Use N2 to blow dry the ESC Pay extra attentation to the groove of the ESC He feed thru hole lifter pinhole and coolant inlet outlet hole Make sure no particles or water trapped at the above areas 3 Cover the ESC surface with hard Teflon protective cover and bake in the oven at 110 deg for 1 hr Do not scratch the ESC surface 4 Use N2 to clean and final wipe down the ESC with 100 IPA before install back to chmb 5 Proceed with normal ESC installation procedure and lifter pin chk 5 0Chamber Process kit and parts hardware Installation 5 2Clean the VAT valve and change out the o ring 5 3Install back the pendulum plate locking ring Exercise the vate gate by opening closing it check for smooth operation 5 4Install the transition manifold service cover with new o ring 5 5Install endpoint plate assembly and replace with new o ring Install 4 strips of RF EMI type gasket 5 6Install the RF EMI type gasket and o rings 2pcs on the 100MT manometer and penning gauge ports 5 7Install back 100MT manometer weldment and penning gauge assembly 5 8Install endpoint view port and o ring Change out the endpoint view port at every 2 wetclean or the endpoint view port is badly etched blurr 5 9Install the window screen and retainer 5 10Install all clean chamber parts baked from oven and inspect them again 5 11Clean the lifter pin and up down the lifter pin few time to inspect for any rubbing speed of lifter pin Inform EE if suspect lifter rubbing or speed problem Lifter pin rubbing and speed problem will cause AL ball defects and HE clamp flow problem 5 12Did a final wipe down of the chamber with IPA before pump down the chamber 5 13Replace the top mid chamber o ring and final wipe down on top window quartz disk Clean and install the window clear lid to prepare for wfr handsoff chk 6 0 Post PM Procedure Chamber Pump Down Procedure 6 1Install back the pneumatics air tubing for rough ISO valve manually pumpdown the chamber through rough ISO valve using clear lid 6 2Once the chamber pressure falls below 100mt plug in the pneumatics air tubing for turbo ISO valve and wind up the turbo pump 6 3Put the VAT controller to remote mode when turbo pump fully wind up to full speed and put the chmb back to auto mode 6 4Turn on the PRK Wafer Handsoff HE Clamp Flow Check 6 3Verify the wafer handoff in chamber Ensure wafer is not wobbling when it was resting on chamber 4 pins lifter 6 4Perform a HE clamp flow check by cycling with 5 dummy wafers with HE pressure set to 8 or 10 torr according to process recipe Inspect and ensure that wafer is seated properly on ESC chuck and no wobbling 6 5Go to IO diagnose sub page Temp Macro ensure the following setpoint are correct Turbo temperature setpt 65 c Gate valve temperature setpt 80 c Chamber temperature setpt 60 c Main temperature tols 10 c 6 6Using the maintain schedule PM page vent the chamber 6 7Remove the top clear lid and perform a final wipe down chamber with IPA 6 8Clean and install back the top quartz disk When installing the quartz disk ensure that the same surface facing the chamber is facing down and correct orientation according to the top TCP coil Changes the new quartz disk on every 2 wet clean or top qtz lifetime exceed 700 RF hr 6 9Using the Maintain Schedule PM page Inactive chamber vent to pump down the chamber 6 10Perform a HE clamp flow check with a dummy wafer with b s he pressure after pump down 8 torr for 52 poly etcher 10 torr for 20 poly etcher 6 11Wait for chamber leakrate 6 12Perform a chamber leakrate check at tm vacuum and tm atm Chamber leakback must be 2 0 mtorr min 6 13Perform chmb auto zero to zero the chmb base pressure 6 14Perform an MFC gas calibration and chamber partial pressure gas balance check once chamber leakrate come within specification according to respective prod recp setpt Note chamber volume setpoint at 32000 Chamber temperature at 60c ESC temperature at 70c All gas calibration error must be within SPC specification If failed please notify EE and change the MFC configuration with EE advise All chamber partial pressure must be within SPC specification 7 0PM Recovery For 100 Series 20 etch chamber Run 2 5 dummy using recipe for qtz conditioning Alliance Recipe WAC TOP QTZ X x chamber number Season chmb with 1st lot of dummy wafers using Alliance Recipe PM 20 SEASON X x chamber number Season with 2nd lot of dummy wafers using Alliance Recipe T16 20season X x chamber number Use only 20 etch dummy wafers 7 1 Change m c state to pc qual state run gas on pc with Sequence PC Check X x represent the chm 7 2 Perform an etchrate qual Refer to sms for qual procedure and specification Reqe20qual 20 etch qual procedures 7 3 Rls to start t w when all qual in spec and inform M E For 100 Series 52 etch chamber Run 2 5 dummy using recipe for qtz conditioning Alliance Recipe WAC TOP QTZ X x chamber number TCP 9400 Recipe 300 Season with 1st lot of dummy wafers using Alliance Recipe 55 SEASON X x chamber number TCP 9400 Recipe N A Season with 2nd lot of dummy wafers using Alliance Recipe T16 52season X x chamber number TCP 9400 Recipe 2222 Use only 52 etch dummy wafers 7 3Change m c state to pc qual state run gas on pc with Sequence PC Check X x represent the chm 7 4Perform an etchrate qual Refer to sms for qual procedure And specification Reqe52qual 52 etch qual procedures 8Key in all pre post PM data into engineering template attached below when release the machine The template ID o ET49PM for 20 etch ET491 o ET45PM for 52 etch ET451 o 2ET45PM for 2ET451 52 etch 2ET452 20 etch o ET51PM for 52 etch ET514 9 0