smt專業(yè)術(shù)語我這里有一些關(guān)于SMT和大家

SMT我這里有一些關(guān)于SMT的專業(yè)術(shù)語，和大家SMTsurfacemounttechnology表面黏著技AI:Auto-InsertionAQL:acceptablequalitylevel允收水平ATE:automatictestequipment自動(dòng)測(cè)試ATM:atmosphere氣壓BGA:ballgridarrayCCD:chargecoupleddevice監(jiān)視連接組件(攝影機(jī))CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具COB:chip-on-board直接貼附在電路板上cps:centipoises(黏度單位)百分之CSB:chipscaleballgridarray尺寸BGACSP:chipscalepackage尺寸構(gòu)裝CTE:coefficientofthermalexpansion熱膨脹系數(shù)DIP:dualin-linepackage雙內(nèi)線包裝(泛指手插組件)FPT:finepitchtechnology微間距技術(shù)FR-4flame-retardantsubstrate玻璃纖維膠片(用?硌u作PCB材質(zhì))IC:integratecircuit集成電路IR:infra-red紅外Kpa:kilopascals(壓力單位LCC:leadlesschipcarrier引腳式承載器MCM:multi-chipmodule多層模塊MELF:metalelectrodeface二極管MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElectronicPackageandProductionConference國際電子包裝及生產(chǎn)會(huì)議PBGAlasticballgridarray塑料球形矩陣PCBrintedcircuitboardPFColymerflipPLCClasticleadlesschipcarrier塑料式有引腳承載Polyurethane聚?啺孵?刮刀材質(zhì)ppmartspermillionPAD(點(diǎn))有多少個(gè)不良PAD(點(diǎn))psiounds/inch2磅/2PWBrintedwiringboard電路板QFP:quadflatpackage四邊平坦封裝SIP:singlein-linepackageSIR:surfaceinsulation絕緣阻抗SMCSurfaceMountComponent表面黏著組件SMD:SurfaceMountDevice表面黏著組件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏著設(shè)備制造SMT:surfacemounttechnology表面黏著技術(shù)SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedSOPsmallout-linepackageSOTsmalloutlinetransistor晶體SPCstatisticalprocesscontrolSSOPshrinksmalloutlinepackage automaticedbondingTCE:thermalcoefficientofexpansion膨脹(因熱)Tg:glasstransitiontemperatureTHD:Throughholedevice須穿過洞之組件(貫穿孔)TQFP:t quadflatpackage帶狀四方平坦封裝UV:ultraviolet紫外線uBGA:microBGA微小球型矩陣cBGA:ceramicBGA陶瓷球型矩陣PTH:PlatedThruHole導(dǎo)通孔IAInformationAppliance資?MESH網(wǎng)目OXIDE氧化物FLUX助焊劑LGALandGridArry)封裝技術(shù)LGA封裝不需植球，適合輕薄短小產(chǎn)品TCP(TCarrierACFAnisotropicConductiveFilm方性導(dǎo)電膠膜制程Soldermask防焊漆SolderingIron烙鐵Solderballs錫球SolderSplash錫渣SolderSkips漏焊Throughhole貫穿孔Touchup補(bǔ)焊Briding穚接(短路)SolderWires焊錫線SolderBars錫棒GreenStrength未?姸?紅膠)TransterPressure轉(zhuǎn)印壓力(印刷)ScreenPrinting刮刀式印刷SolderPowder錫顆粒Wettengability衲芰?Viscosity黏度Solderability焊錫性Applicability使用性Flipchip覆晶DepanelingMachine組裝電路板切割機(jī)SolderRecoverySystem錫料回收再使用系統(tǒng)WireWelder主機(jī)板補(bǔ)線機(jī)X-RayMulti-layerInspectionSystemX-Ray孔偏檢查BGAOpen/ShortX-RayInspectionMachineBGAX-Ray檢測(cè)PrepregCopperFoilSheeterP.P.銅箔裁切機(jī)FlexCircuitConnections軟性排線焊接機(jī)LCDReworkStation液晶顯示器修護(hù)機(jī)BatteryElectroWelder電池電極焊接機(jī)PCMCIACardWelderPCMCIA卡連接器焊接LaserDiode半導(dǎo)體雷射IonLasersNd:YAGLaserDPSSLasers半導(dǎo)體激發(fā)固態(tài)雷射UltrafastLaserSystem超快雷射系統(tǒng)MLCCEquipment積層組件生產(chǎn)設(shè)備GreenTCaster,Coater薄帶成型機(jī)ISOStaticLaminator積層組件均壓機(jī)GreenTCutter組件切割機(jī)ChipTerminatorMLCCTester積層電容測(cè)試ComponentsVisionInspectionSystem1片組件外觀檢查機(jī)高壓?a溫?a?y試機(jī)HighVoltageBurn-InLifeTester電容漏電流測(cè)試機(jī)CapacitorLifeTestwithLeakage打帶包裝機(jī)TaSurfaceMountingSilverElectrodeCoatingMachineTFT-LCD(薄膜晶體管液晶顯示器)筆記型用STN-LCD(中小尺寸超扭轉(zhuǎn)向液晶顯示器行動(dòng)CompactFlashMemoryCard(簡稱CF卡)MP3、PDA、數(shù)位相機(jī)DataplayDisk(微光盤)。交換式電源供應(yīng)器專業(yè)電子制造服務(wù)高密度連結(jié)板（HDIboard指線寬／線距4／4mil）微小孔板（Micro-viaboardEffectDepanelingMachineSupportpin＝支撐柱F.M.＝光學(xué)點(diǎn)4ENTEK銅板上涂一層化學(xué)藥劑使PCB的pad比較不會(huì)生ORT：持續(xù)性測(cè)試TFT-LCD(薄膜晶體管液晶顯示器)(Liquid-CrystalDisplaysAddressedThin-Film導(dǎo)線（LeadF/r