PCB工藝流程演示文稿

PCB工藝流程演示文稿目前一頁\總數(shù)三十七頁\編于十五點(diǎn)優(yōu)選PCB工藝流程目前二頁\總數(shù)三十七頁\編于十五點(diǎn)一、多層板內(nèi)層制作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.顯影DEVELOPING曝光EXPOSURE壓膜LAMINATION去膜STRIPPING

蝕刻銅ETCHING黑化處理

BLACKOXIDE烘烤BAKINGLAY-UP預(yù)疊及疊板后處理

POSTTREATMENT壓合LAMINATION內(nèi)層圖形轉(zhuǎn)移INNERLAYERIMAGE預(yù)疊及疊板LAY-UP蝕刻I/LETCHING鉆孔DRILLING壓合LAMINATION內(nèi)層制作流程

INNERLAYERPRODUCTMLPCBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLE

SIDE目前三頁\總數(shù)三十七頁\編于十五點(diǎn)二、多層板外層制作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.孔金屬化P.T.H.鉆孔DRILLING外層圖形轉(zhuǎn)移OUTERLAYERIMAGE圖形電鍍銅/錫PATTERNPLATING檢查INSPECTION

前處理

PRELIMINARYTREATMENT圖形電鍍銅PATTERNPLATING蝕刻

ETCHING全板鍍銅PANELPLATING外層制作OUTER-LAYERO/LETCHING蝕刻TENTINGPROCESSDESMER除膠渣

E-LESSCU孔金屬化

前處理PRELIMINARYTREATMENT退錫

T/LSTRIPPING去膜STRIPPING

壓干膜LAMINATION鍍錫T/LPLATING曝光EXPOSURE目前四頁\總數(shù)三十七頁\編于十五點(diǎn)三、外形制作和成品檢查流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.阻焊印制LIQUIDS/M

外觀檢查VISUALINSPECTION

成形FINALSHAPING檢查

INSPECTION

測試ELECTRICALTEST出貨檢查OQC成品PACKING&SHIPPING印制阻焊油

S/MCOATING前處理

PRELIMINARY

TREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE后烘烤預(yù)干燥

PRE-CURE熱風(fēng)整平HOTAIRLEVELINGOSP表面防氧化處理OSP(EntekCu106A)HOTAIRLEVELING

G/FPLATING鍍金手指化學(xué)鎳/金E-lessNi/AuForO.S.P.字符印制SCREENLEGEND選擇性鍍鎳/金SELECTIVEGOLD目前五頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.附件：典型多層板制作流程1.內(nèi)層開料2.內(nèi)層線路壓膜目前六頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.4.內(nèi)層線路顯影3.內(nèi)層線路曝光目前七頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.5.內(nèi)層線路蝕刻6.內(nèi)層線路去膜目前八頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.7.疊板8.層壓LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6目前九頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.9.鉆孔10.孔金屬化目前十頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.11.外層線路壓膜12.外層線路曝光目前十一頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.13.外層線路顯影14.圖形電鍍銅/錫目前十二頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.15.外層去膜16.外層蝕刻銅目前十三頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.17.退錫18.阻焊印制目前十四頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.19.浸金或熱風(fēng)整平目前十五頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.四、PCB各制程物料消耗COPPERFOILEpoxyGlass1、下料裁板物料消耗：2、拼板廢棄的覆銅板1、成品加工板料消耗目前十六頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist2、內(nèi)層圖形轉(zhuǎn)移物料消耗：1、干膜或濕膜（光致油墨）目前十七頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.Artwork(底片)Artwork(底片)光源3、曝光物料消耗：PhotoResist曝光后1、菲林2、UV燈管目前十八頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist4、內(nèi)層顯影物料消耗：1、顯影液（碳酸鉀等）目前十九頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist5、內(nèi)層蝕刻物料消耗：1、蝕刻液2、蝕刻含銅廢液目前二十頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.6、去膜物料消耗：1、NaOH目前二十一頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.7、黑化/棕化處理物料消耗：1、目前二十二頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayer8、疊板和層壓物料消耗：1、半固化片（PP料）2、層壓墊紙（墊膜）3、邊/廢料（PP料和墊膜等）目前二十三頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.墊木板鋁板10、鉆孔物料消耗：1、鉆咀2、鋁板3、墊板目前二十四頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.11、孔金屬化與全板鍍銅物料消耗：1、凹蝕（除膠渣）液2、整孔劑3、中和劑、預(yù)浸劑4、活化劑、加速劑5、沉銅液6、鍍銅液7、廢槽液的回收目前二十五頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist12、外層圖形轉(zhuǎn)移物料消耗：1、干膜或濕膜（光致油墨）2、網(wǎng)版3、膠帶及校正紙張目前二十六頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：13、外層曝光曝光后1、黃/黑菲林2、UV燈管目前二十七頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.14、外層顯影物料消耗：1、顯影液（碳酸鉀等）目前二十八頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：15、圖形電鍍銅/錫1、除油劑2、粗化液3、鍍銅液4、鍍錫液5、銅球和錫條6、添加劑目前二十九頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：16、去膜1、NaOH目前三十頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：17、外層蝕刻銅1、蝕刻液2、蝕刻含銅廢液目前三十一頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：18、退錫1、退錫液目前三十二頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：19、阻焊印制1、阻焊綠油2、網(wǎng)版3、膠帶及校正紙張目前三十三頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.S/MA/W光源物料消耗：20、阻焊曝光1、菲林2、UV燈管目前三十四頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：21、阻焊顯影1、顯影液（碳酸鉀等）目前三十五頁\總數(shù)三十七頁\編于十五點(diǎn)BROADTECHOLOGYI