新能源項(xiàng)目工程部SPC手冊手冊

SPC手冊整合版

新能源項(xiàng)目工程部

SPC工作手冊

編寫：PRJSPCTeam

終審：SimonLi

制定日期：2009/6/5

刖百

自從PRJSPC成立以來，SPC小組的員，與，程師在這方面做了大量的JJ乍。為了更好

的把有關(guān)的知識系統(tǒng)化，并對所積存的知識沉淀，特編寫此手冊。本手冊的內(nèi)容要緊包含下列

幾個(gè)方面：

1：SPC來源，作用與有關(guān)的理論知識;

2：SPC的運(yùn)作流程與管理制度；

3：SPC監(jiān)控各工序簡單介紹；

4：SPCOOC的特殊處理方法。

目錄

前言..........................................................................0

A錄..........................................................................1

第一章：SPC介紹..........................................................12

1.1SPC來源............................................................12

12spe原理.............................................................12

1.2.1SPC的基本原理.................................錯(cuò)誤!未定義書簽。

1.2.2正常波動(dòng)與特殊波動(dòng)............................................13

1.3SPC目的............................................................13

第二章：SPC系統(tǒng)運(yùn)作流程....................................................14

2.1.SPC系統(tǒng)建立流程....................................................14

2.1.1建立操縱計(jì)劃...................................................14

2.1.2確定測量系統(tǒng)...................................................14

2.1.3SPC操縱圖建立................................................14

2.1.4數(shù)據(jù)收集流程...................................................14

2.1.500C處理程序.................................................14

2.1.6SPC系統(tǒng)建立流程圖............................................15

2.2.MSA操作流程.......................................................15

2.2.1測量系統(tǒng)確定...................................................15

2.2.2提供GRR樣品.................................................15

2.2.3GRR分析.....................................................15

2.2.4定期做GRR并存檔.............................................16

2.3MGA工作流程.......................................................16

2.4OOC處理流程.......................................................16

2.4.1通常特殊處理...................................................16

2.4.2重大特殊處理...................................................16

243追溯與記錄.....................................................17

2.4.4OOC處理流程圖...............................................17

第三章:SPC內(nèi)部管理流程.....................................................18

3.1.SPC組織架構(gòu)與職責(zé).................................................18

3.2.SPC內(nèi)部管理?xiàng)l例...................................................18

3.3.SPC績效評估........................................................19

331基本知識包含...................................................19

332專業(yè)技能包含...................................................19

333工作技巧包含...................................................19

3.3.4工作紀(jì)律包含...................................................19

3.3.4.SPC內(nèi)部培訓(xùn)制度.............................................19

第四章：攪拌工序介紹........................................................21

4.1Mixing工序簡介......................................................21

4.1.1Mixing定義....................................................21

4.1.2Mixing作用....................................................21

4.1.3Mixing_E作原理................................................21

4.2Mixing設(shè)備.匚藝介紹..................................................22

421設(shè)備形貌.......................................................22

422設(shè)備技術(shù)參數(shù)...................................................22

4.2.3Mixing流程圖...................................................23

424Mixing工藝流程介紹（漿料）....................................24

4.3監(jiān)控品質(zhì)參數(shù)........................................................24

4.3.1黏度...........................................................24

4.3.2顆粒度.........................................................24

4.3.4固含量.........................................................24

4.4魚骨圖..............................................................25

第五章：涂膜工序...........................................................25

5.1工序簡介............................................................25

5.1.1工序目的與原理.................................................25

5.1.2涂布工藝流程圖.................................................26

5.1.3涂布材料介紹...................................................26

5.1.4涂布方式.......................................................27

5.1.5產(chǎn)品關(guān)鍵參數(shù)...................................................28

5.2機(jī)器介紹............................................................30

5.2.1常見涂布機(jī)劃分.................................................30

5.2.2涂布機(jī)參數(shù)....................................................31

5.2.3涂布機(jī)構(gòu)成....................................................31

5.3SPC操作流程.........................................................34

5.3.1測量工具檢查...................................................34

5.3.2取樣方式介紹...................................................34

5.3.3特殊處理流程...................................................35

534預(yù)報(bào)警.........................................................35

5.4魚骨圖分析...........................................................36

5.4.1涂布魚骨圖框架.................................................37

5.4.2常見問題及解決方法.............................................37

5.5經(jīng)典8D案例.........................................................38

第六章：冷壓工序.............................................................39

6.1工序介紹............................................................39

6.1.1工序目的與原理.................................................39

6.1.2工序流程.......................................................39

6.1.3軋輻工藝介紹...................................................40

6.1.4關(guān)鍵監(jiān)控參數(shù)...................................................41

6.2機(jī)器工作原理簡單介紹...............................................41

6.2.1類型介紹.......................................................41

6.2.2設(shè)備參數(shù).......................................................42

6.3冷壓失效模式........................................................42

6.3.1失效損耗形式...................................................42

632失效模式的成因.................................................43

6.4SPC操作流程........................................................43

6.4.1測量工具檢查...................................................43

6.4.2取樣方式介紹...................................................43

6.4.3SPC特殊處理流程..............................................44

6.5魚骨圖分析..........................................................45

6.6典型8D案例.........................................................45

第七章：分條工序.............................................................47

7.1工序介紹............................................................47

7.1.1工序目的與原理.................................................47

7.1.2工序流程.......................................................48

7.1.3關(guān)鍵監(jiān)控參數(shù)...................................................48

7.2分條機(jī)器簡單介紹...................................................48

7.2.1設(shè)備介紹.......................................................48

722設(shè)備參數(shù).......................................................49

7.3SPC操作流程........................................................50

7.3.1測量工具檢查...................................................50

7.3.2取樣方式測量..................................................50

7.4魚骨圖分析..........................................................51

7.5典型8D案例.........................................................52

第八章：M6s焊接工序........................................................53

8.1Tab焊接工序介紹....................................................53

8.1.1焊接作用.......................................................53

8.1.2焊接模式......................................................54

8.1.3SPC監(jiān)控參數(shù)..................................................54

8.1.4焊接工序SPC操作流程..........................................54

8.1.5焊接操縱要點(diǎn)...................................................55

8.2焊接機(jī)器介紹........................................................55

8.2.1焊接機(jī)原理.....................................................55

8.2.2超聲波焊接結(jié)構(gòu)................................................55

8.2.3超聲波焊接的機(jī)理..............................................56

8.2.4設(shè)備參數(shù)設(shè)置...................................................56

8.3魚骨圖..............................................................56

8.4注意事項(xiàng)............................................................57

8.5經(jīng)典案例............................................................57

第九章：M6s卷繞工序.........................................................59

9.1卷繞介紹.............................................................59

9.1.1卷繞定義.......................................................59

9.1.3卷繞圖.........................................................59

9.2卷繞參數(shù)............................................................60

9.2.1CTQ參數(shù)......................................................60

9.2.2SPC監(jiān)控參數(shù)..................................................60

9.3卷繞工作原理........................................................60

9.3.1卷繞工作原理...................................................60

9.3.2機(jī)器布局.......................................................60

9.4卷繞設(shè)備現(xiàn)狀........................................................61

9.4.1機(jī)器現(xiàn)狀......................................................61

9.4.2機(jī)器技術(shù)參數(shù)..................................................62

9.5陰陽極錯(cuò)位魚骨圖分析................................................62

9.6注意事項(xiàng)............................................................63

9.6.1卷繞Overhang操縱.............................................63

9.6.2卷繞收尾檢查..................................................63

9.6.3X-RAY測試....................................................63

9.7經(jīng)典案例分析........................................................63

第十章:M6s注液工序.........................................................66

10.1注液工序簡介.......................................................66

10.1.1注液的定義及作用..............................................66

10.1.2注液的工作原理...............................................66

10/1.3自動(dòng)注液工序流程..............................................67

10.2注液參數(shù)...........................................................67

10.2.1SPC監(jiān)控參數(shù)..................................................67

1022CTQ參數(shù)......................................................67

10.2.3質(zhì)量操縱要點(diǎn)..................................................68

10.4自動(dòng)灌注電解液SPC取樣.............................................68

10.4.1SPC取樣操作指示.............................................68

10.4.2SPC注意事項(xiàng).................................................69

10.4.3SPC特殊追溯.................................................69

10.5設(shè)備參數(shù)與現(xiàn)狀.....................................................69

10.5.1海霸泵........................................................69

10.5.2電動(dòng)泵........................................................70

10.5.3設(shè)備技術(shù)參數(shù)..................................................70

10.6注意事項(xiàng)...........................................................71

10.7經(jīng)典案例...........................................................72

第十一章：頂封工序...........................................................74

11.1頂封工序介紹.......................................................74

11.1.1頂封的定義....................................................74

11.1.2頂封的作用...................................................74

11.1.3頂封L作原理................................................74

11.3設(shè)備參數(shù)及現(xiàn)狀.....................................................75

11.3.1設(shè)備形貌......................................................75

11.3.2頂封工序流程..................................................75

11.3.3封頭的選擇....................................................75

11.3.4夾具的選擇....................................................76

11.3.5工藝參數(shù)的選擇................................................77

11.4頂封參數(shù)...........................................................77

11.4.1頂封品質(zhì)參數(shù)..................................................77

11.4.2頂封SPC監(jiān)控參數(shù).............................................78

11.4.3頂封CTQ參數(shù).................................................78

11.5常見失效分析.......................................................79

11.6魚骨圖.............................................................79

1L7經(jīng)典案例分析........................................................80

第十二章:Degassing工序.....................................................82

12.1Degassing工序簡介..................................................82

12.1.1Degassing定義................................................82

12.1.2Degassing作用................................................82

12.1.3SPC監(jiān)控參數(shù).................................................82

12.1.4CTQ參數(shù)....................................................82

12.1.5機(jī)器設(shè)定參數(shù)..................................................83

12.2機(jī)器設(shè)備介紹.......................................................83

12.2.1機(jī)器形貌......................................................83

12.2.2Degassing系統(tǒng)構(gòu)成............................................83

123封裝原理介紹.......................................................84

12.3.1封裝材料的結(jié)構(gòu)................................................84

12.3.2封裝機(jī)理介紹.................................................84

12.3.4封裝時(shí)間，溫度，氣壓有關(guān)性介紹..................................84

12.3.5溫度、時(shí)間參數(shù)的選擇.........................................85

12.3.6壓力參數(shù)......................................................85

12.3.7真空度........................................................85

12.4魚骨圖.............................................................85

12.5注意事項(xiàng)...........................................................86

12.5.1機(jī)器操作注意事項(xiàng)..............................................86

12.5.2SPC操作注意事項(xiàng).............................................87

第十三章：M6CKaido卷繞...................................................88

13.1Kaido工序簡介......................................................88

13.2Kaido工作原理......................................................88

1321超聲波焊接....................................................88

13.2.2貼膠..........................................................89

13.2.3裁片..........................................................89

13.2.4卷繞..........................................................90

13.2.5擴(kuò)孔..........................................................90

1326短路測試......................................................90

13.3設(shè)備參數(shù)及現(xiàn)狀.....................................................91

13.3.1設(shè)備參數(shù)及操縱要點(diǎn)...........................................91

13.3.2SPC監(jiān)控參數(shù).................................................92

13.3.3CTQ參數(shù).....................................................92

13.4常見故障及處理方法.................................................92

13.4.1SPC監(jiān)控參數(shù)工序操作5OP..........................................................................93

13.4.2SPC預(yù)報(bào)警措施及注意事項(xiàng).....................................95

13.5魚骨圖.............................................................96

13.5.1Tab焊接拉力..................................................96

13.5.2Kaido陰陽極錯(cuò)位..............................................96

13.5.3裸電芯直徑....................................................97

13.6經(jīng)典案例...........................................................97

13.6.1焊接工序......................................................97

13.6.2卷繞工序......................................................99

13.6.3裸電芯直徑...................................................100

第十四章：點(diǎn)底焊...........................................................102

14.1工序介紹...........................................................102

14.1.1工作原理.....................................................102

14.1.2點(diǎn)底焊功能...................................................102

14.2工序品質(zhì)參數(shù)......................................................103

14.2.1SPC監(jiān)控參數(shù).................................................103

14.2.2CTQ參數(shù)....................................................103

14.3機(jī)器設(shè)備參數(shù)及現(xiàn)狀................................................103

14.4工序SOP.....................................................................................................................103

14.5預(yù)報(bào)警措施及注意事項(xiàng)..............................................104

14.5.1預(yù)報(bào)警措施...................................................104

14.5.2注意事項(xiàng).....................................................105

14.6魚骨圖.............................................................105

第十五章：滾槽.............................................................105

15.1工序介紹..........................................................105

15.1.1滾槽作用.....................................................105

15.1.2滾槽工作原理.................................................106

15.1.3滾槽關(guān)鍵參數(shù)調(diào)節(jié).............................................107

15.2設(shè)備參數(shù)及現(xiàn)狀....................................................108

15.2.1滾槽機(jī)現(xiàn)狀...................................................108

15.2.2SPC監(jiān)控參數(shù).................................................109

1523CTQ參數(shù).....................................................109

15.3常見故障及處理方法................................................110

15.4預(yù)報(bào)警措施及注意事項(xiàng)..............................................110

15.4.1預(yù)報(bào)警措施...................................................110

1542注意事項(xiàng)......................................................111

15.5魚骨圖..........................................................111

15.6經(jīng)典案例-8D報(bào)告...................................................111

第十六章：自動(dòng)注液.........................................................114

16.1注液介紹..........................................................114

16.1.1注液作用....................................................114

16.1.2環(huán)境要求....................................................114

16.1.3注液原理....................................................114

16.1.4注液流程....................................................115

16.2設(shè)備參數(shù)及現(xiàn)狀....................................................115

16.2.1監(jiān)控參數(shù).....................................................115

16.2.2SPC預(yù)警措施.................................................115

16.3重點(diǎn)參數(shù)..........................................................116

16.3.1CTQ參數(shù)....................................................116

16.3.2CTS參數(shù).....................................................117

16.4取樣測量注意事項(xiàng)..................................................117

16.5魚骨圖.............................................................117

16.6經(jīng)典案例..........................................................118

第十七章：CID焊接.........................................................119

17.1工序介紹..........................................................119

17.1.1CID焊接作用.................................................119

17.1.2機(jī)器各部分功能介紹..........................................119

17.2監(jiān)控參數(shù)..........................................................120

17.2.1預(yù)警措施.........................................................120

17.2.2蓋帽五組件介紹...............................................120

17.2CTQ/CTS參數(shù).....................................................120

1721設(shè)備有關(guān)設(shè)置（CTQ）...................................................................................120

17.2.2設(shè)備有關(guān)配置（CTS）....................................................................................121

17.3工作原理..........................................................121

17.3.1脈沖激光焊接影響參數(shù).........................................121

17.4常見故障排除方法..................................................122

17.5注意事項(xiàng)..........................................................123

17.5.1測量時(shí)注意事項(xiàng)...............................................123

17.7.2取樣時(shí)注意事項(xiàng)...............................................123

17.8經(jīng)典案例...........................................................123

第十八章：封口.............................................................124

18.1工序介紹...........................................................124

18.1.1封口作用.....................................................124

18.1.2封口步驟.....................................................124

18.1.2封口原理.....................................................125

18.2設(shè)備參數(shù)及現(xiàn)狀....................................................125

1821監(jiān)控參數(shù)......................................................125

1822監(jiān)控意義......................................................126

18.2.318650E電池對沖壓封口的要求...................................126

18.3SPC預(yù)警措施......................................................126

18.3.1總高預(yù)警實(shí)例.................................................126

1832小高..........................................................127

18.4CTQ&CTS...................................................................................................................127

18.4.2設(shè)備有關(guān)配置（CTS）.......................................127

18.5常見故障現(xiàn)象及排除法..............................................128

18.6.魚骨圖............................................................129

18.7注意事項(xiàng)..........................................................129

18.8經(jīng)典案例..........................................................129

18.8.1案例1................................................................................................................129

18.8.1案例2................................................................................................................129

第十九章：SPC量具GRR報(bào)告................................................131

第二十章：SPC操作SOP匯總...............................................132

第二十一章：參考文獻(xiàn).......................................................133

21.1QSI-075SPC程序手冊...............................................133

21.2WI-498SPC工作手冊...............................................133

第一章:SPC介紹

1.1SPC來源

1.2.SPC原理

SPC是一種用來分析數(shù)據(jù)的科學(xué)方法，同時(shí)利用分析結(jié)果來解決實(shí)際的問題。只要問題能

以數(shù)字表示，就能夠應(yīng)用SPC來分析。通常收集的資料都會(huì)有變動(dòng)的現(xiàn)象，將這些數(shù)據(jù)畫在

圖上（如下標(biāo)準(zhǔn)之SPC圖），抽樣值在某個(gè)范圍中上下變動(dòng)，為何會(huì)有這些波動(dòng)發(fā)生？其原因

可能是原料、設(shè)備、氣壓、操作員生理、心理不一致所造成。

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圖1-1SPC操縱圖

a＞被量測出的產(chǎn)品品質(zhì)特性均是由于某些偶然因素所造成的結(jié)果。

C＞在這固有之〃一致現(xiàn)象〃的狀態(tài)下的變動(dòng)將無法找到原因。

d＞在該狀態(tài)外的變動(dòng)原因，則是可被發(fā)現(xiàn)而加以改正的。

122正常波動(dòng)與特殊波動(dòng)

休哈特博士將影響產(chǎn)品品質(zhì)的變異分為特殊波動(dòng)與正常波動(dòng)等兩類因素：

a＞特殊波動(dòng)在過程中隨時(shí)都有可能影響到產(chǎn)品的品質(zhì)。

b＞正常波動(dòng)則在某種特定的條件下的制程中才會(huì)影響產(chǎn)品的品質(zhì)。

假如某一制程只受到正常變異因素影響，則該制程稱之穩(wěn)固制程，即是產(chǎn)品品質(zhì)特性的變

異是在可預(yù)測的統(tǒng)計(jì)操縱范圍之內(nèi)；

另一方面，假如某一制程同時(shí)被正常與特殊兩個(gè)變異因素所影響，則該制程是不穩(wěn)固的，

如今產(chǎn)品品質(zhì)特性的變異將無法以統(tǒng)計(jì)方法來預(yù)測。SPC圖(SPCCharts)正是為了推斷制程

是否穩(wěn)固，或者是區(qū)分制程畢竟是被特殊波動(dòng)因素或者正常變異因素所影響的一種統(tǒng)計(jì)技術(shù)。

1.3SPC目的

提高客戶滿意度。

減少重工與停工的缺失。

節(jié)約大量的時(shí)間與金錢，高品質(zhì)能夠大大提升企業(yè)的竟?fàn)巸?yōu)勢。

S

第二章:SPC系統(tǒng)運(yùn)作流程

2.1.SPC系統(tǒng)建立流程

2.1.1建立操縱計(jì)劃

PRJmodel工程師根據(jù)客戶要求提出SPC監(jiān)控要求，與QA/PRJ/PRD有關(guān)部門討論確定

關(guān)鍵參數(shù)，并出MI/PMP文件支持SPC監(jiān)控，建立完整的監(jiān)控計(jì)劃。

2.1.2確定測量系統(tǒng)

SPC工程師根據(jù)實(shí)際監(jiān)控參數(shù)確定測量系統(tǒng)，

2.1.3SPC操縱圖建立

QASPC人員根據(jù)Model工程師提供的監(jiān)控計(jì)劃表建立SPC操縱圖，SPC人員開始收集

數(shù)據(jù)。

2.1.4數(shù)據(jù)收集流程

PRJSPC工程師負(fù)責(zé)制訂取樣計(jì)劃，與取樣標(biāo)準(zhǔn)操作的SOP文件。

SPC人員嚴(yán)格按照SOP操作，記錄測量數(shù)據(jù)，并做好備份紙板/電子版記錄，有樣品的務(wù)

必保留。

PRJ改善工程師負(fù)責(zé)工序能力CPK提升。

數(shù)據(jù)收集過程中，關(guān)于工序能力CPK不足1.0的工序進(jìn)行持續(xù)改善，直到CPK達(dá)到1.33,

特殊工序（coating）需要達(dá)到1.0以上。

PRJSPCL程師主導(dǎo)SPC監(jiān)控工序能力的評估與改善行動(dòng)。

2.1.5OOC處理程序

收集25個(gè)數(shù)據(jù)后，QA建立操縱線，建圖之后出現(xiàn)OOC,SPC人員務(wù)必按照2.300C

處理流程作業(yè)。

2.1.6SPC系統(tǒng)建立流程圖

SPC控制圖作業(yè)流程

流程圖HR主導(dǎo)"n支憐*口記承/我京記承保存

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