SMT術(shù)語英語Word版

1、傳播優(yōu)秀Word版文檔 ，希望對您有幫助，可雙擊去除！Smt屬于轉(zhuǎn)換英語THT（ThroughHoleTechnology）：通孔安裝技術(shù)SMT（Surface Mounted Technology）：表面安裝技術(shù)PTH （PinThroughthe Hole）：通孔安裝THT(ThroughHoleComponent) ：通孔插裝元件SMB(SurfaceMountPrintedCircuitBoard)：表面安裝PCB板SMC(SurfaceMountComponent)：表面安裝元件SMD(SurfaceMountDevice)：表面安裝器件SMA(SurfaceMountAssembl

2、y)：表面安裝組件Component：元件Device：器件Assembly：組件CTE（coefficient of thermal expansion）：熱膨脹系數(shù)In-circuit test：在線測試Lead configuration：引腳外形Placement equipment：貼裝設(shè)備Reflow soldering：回流焊接Repair：修理Rework：返工Solderability：可焊性Soldermask：阻焊Yield：產(chǎn)出率Packaging density：裝配密度Chip：片狀元件melf：圓柱形元件PCB（Printed circuit board）：印刷電

3、路板DIP：雙列直插SIP：單列直插SOT（SmallOutlineTransistor）：小外形晶體管SOIC（SmalloutlineIC）：小外形集成電路，SOP(SmalloutlinePackage)：小外型封裝PLCC（PlasticLeadedChipCarrier）：塑型有引腳芯片載體LCCC（LeadlessCeramicChipCarrier）：無引腳陶瓷芯片載體QFP（QuadFlatPackage）：多引腳方形扁平封裝BGA（ Ball grid array）球柵列陣CSP（ChipScalePackage）：芯片規(guī)模的封裝BareChip：裸芯片Accuracy：精度

4、ATE（Automated test equipment）：自動測試設(shè)備AOI（Automatic optical inspection）：自動光學(xué)檢查Blind via：盲孔Buried via：埋孔through via：通孔Bridge：錫橋Circuit tester：電路測試機CTE（Coefficient of the thermal expansion）：溫度膨脹系數(shù)Cold solder joint：冷焊錫點Component density：元件密度Copper foil：銅箔Copper mirror test：銅鏡測試Cure：烘焙固化Cycle rate：循環(huán)速率Def

5、ect：缺陷Desoldering：卸焊Downtime：停機時間FPT（Fine-pitch technology）：密腳距技術(shù)Flip chip：倒裝芯片F(xiàn)CT（Functional test）：功能測試Golden boy：金樣ICT（In-circuit test）：在線測試JIT（Just-in-time）：剛好準(zhǔn)時Lead configuration：引腳外形Packaging density：裝配密度Pick-and-place：拾取-貼裝設(shè)備Placement equipment：貼裝設(shè)備Reflow soldering：回流焊接Repair：修理Rework：返工Defect

6、 SoldeR少錫Schematic：原理圖Solder bump：焊錫球Solderability：可焊性Soldermask：阻焊Tape-and-reel：帶和盤Tombstoning：元件立起Ultra-fine-pitch：超密腳距Yield：產(chǎn)出率solder mask：阻焊漆silk screen：絲印面via：導(dǎo)孔Copper Clad Laminates：覆銅箔層壓板past mask：焊膏膜(漏板）solder mask：焊接掩摸(阻焊膜）SoldingPasts：焊錫膏Stencils：模板、漏板、鋼板Bridging：搭錫Cursting：發(fā)生皮層ExcessivePa

7、ste：膏量太多Insufficient Paste：膏量不足Poor Tack Retention：粘著力不足Slumping：坍塌Smearing：模糊Dpm（defects per million）：百萬缺陷率Flexibility：柔性Modularity：模塊化Component Pick-Up：元件拾取Component Check：元件檢查Component Transport：元件傳送Placement Procedure：元件放置Chamber System：爐膛系統(tǒng)Blowholes：吹孔Voids：空洞Movement：移位Misalignment：偏斜Dewetting

8、：縮錫Dull Joint：焊點灰暗Non-Dewetting：不沾錫Accuracy：精度Additive Process：加成工藝Adhesion：附著力Aerosol：氣溶劑Angle of attack：迎角Anisotropic adhesive：各異向性膠Annular ring：環(huán)狀圈Application specific integrated circuit ：ASIC特殊應(yīng)用集成電路Array：列陣Artwork：布線圖Automated test equipment：ATE自動測試設(shè)備Bond lift-off：焊接升離Bonding agent：粘合劑CAD/CAM s

9、ystem：計算機輔助設(shè)計與制造系統(tǒng)Capillary action：毛細(xì)管作用Chip on board ：COB板面芯片Circuit tester：電路測試機Cladding：覆蓋層Cold cleaning：冷清洗Cold solder joint：冷焊錫點Conductive epoxy：導(dǎo)電性環(huán)氧樹脂Conductive ink：導(dǎo)電墨水Conformal coating：共形涂層Copper foil：銅箔Copper mirror test：銅鏡測試Cure：烘焙固化nought materiel 無料Cycle rate：循環(huán)速率Data recorder：數(shù)據(jù)記錄器Defe

10、ct：缺陷Delamination：分層Desoldering：卸焊Dewetting：去濕DFM：為制造著想的設(shè)計Dispersant：分散劑Documentation：文件編制Downtime：停機時間Durometer：硬度計Environmental test：環(huán)境測試Eutectic solders：共晶焊錫Fiducial：基準(zhǔn)點Fillet：焊角Fine-pitch technology ：FPT密腳距技術(shù)Fixture：夾具Full liquidus temperature：完全液化溫度Golden boy：金樣Halides：鹵化物Hard water：硬水Hardener：

11、硬化劑Line certification：生產(chǎn)線確認(rèn)Machine vision：機器視覺Mean time between failure ：MTBF平均故障間隔時間Nonwetting：不熔濕的Organic activated ：OA有機活性的Packaging density：裝配密度Photoploter：相片繪圖儀Placement equipment：貼裝設(shè)備Repeatability：可重復(fù)性Rheology：流變學(xué)Schematic：原理圖Semi-aqueous cleaning：不完全水清洗Shadowing：陰影Silver chromate test：鉻酸銀測試Sl

12、ump：坍落Solder bump：焊錫球Solderability：可焊性Soldermask：阻焊Solids：固體Solidus：固相線Statistical process control ：SPC統(tǒng)計過程控制Storage life：儲存壽命Subtractive process：負(fù)過程Surfactant：表面活性劑Syringe：注射器Tape-and-reel：帶和盤Thermocouple：熱電偶Tombstoning：元件立起Vapor degreaser：汽相去油器paste working 1ife：焊膏工作壽命paste shelf life：焊膏貯存壽命slump：

13、塌落no-clean solder paste：免清洗焊膏l(xiāng)ow temperature paste：低溫焊膏screen printing：絲網(wǎng)印刷screen printing plate：網(wǎng)版squeegee：刮板screen printer：絲網(wǎng)印刷機stencil printing：漏版印刷metal stencil：金屬漏版flexible stencil：柔性金屬漏版feeders：供料器tape feeder：帶式供料器stick feeder：桿式供料器tray feeder：盤式供料器bulk feeder：散裝式供料器feeder holder：供料器架placement

14、 accuracy：貼裝精度shifting deviation：平移偏差rotating deviation：旋轉(zhuǎn)偏差resolution：分辨率repeatability：重復(fù)性placement speed：貼裝速度low speed placement equipment：低速貼裝機general placement equipment：中速貼裝機high speed placement equipment：高速貼裝機precise placement equipment：精密貼裝機optic correction system ：光學(xué)校準(zhǔn)系統(tǒng)sequential placement：

15、順序貼裝placement pressure：貼裝壓力placement direction：貼裝方位flying：飛片flux bubbles：焊劑氣泡dual wave soldering：雙波峰焊self alignment：自定位skewing：偏移tomb stone effect：墓碑現(xiàn)象Manhattan effect：曼哈頓現(xiàn)象hot air reflow soldering：熱風(fēng)再流焊convection reflow soldering：熱對流再流焊laser reflow soldering：激光再流焊vapor phase soldering(VPS)： 氣相再流焊lo

16、cated soldering：局部軟釬焊cleaning after soldering：焊后清洗AI :Auto-Insertion 自動插件AQL :acceptable quality level 允收水準(zhǔn)ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監(jiān)視連接元件(攝影機)CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-on-board 晶片直接貼附在電路板上cps :c

17、entipoises(黏度單位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構(gòu)裝CTE :coefficient of thermal expansion 熱膨脹系數(shù)DIP :dual in-line package 雙內(nèi)線包裝(泛指手插元件)FPT :fine pitch technology 微間距技術(shù)FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質(zhì))IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa

18、:kilopascals(壓力單位)LCC :leadless chip carrier 引腳式晶片承載器MCM :multi-chip module 多層晶片模組MELF :metal electrode face 二極體MQFP :metalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產(chǎn)會議PBGA:plastic ball grid array 塑膠球形矩陣PCB:printed circuit board 印刷電路板PFC :polymer flip chip

19、PLCC:plastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯(刮刀材質(zhì))ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 電路板QFP :quad flat package 四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD :

20、Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設(shè)備製造協(xié)會SMT :surface mount technology 表面黏著技術(shù)SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封裝SOT :small outline transistor 電晶體SPC :statistical process contro

21、l 統(tǒng)計過程控制SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bonding 帶狀自動結(jié)合TCE :thermal coefficient of expansion 膨脹(因熱)係數(shù)Tg :glass transition temperature 玻璃轉(zhuǎn)換溫度THD :Through hole device 須穿過洞之元件(貫穿孔)TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA :ceramic

22、 BGA 陶瓷球型矩陣PTH :Plated Thru Hole 導(dǎo)通孔IA Information Appliance 資訊家電產(chǎn)品MESH 網(wǎng)目OXIDE 氧化物FLUX 助焊劑LGA (Land Grid Arry)封裝技術(shù) LGA封裝不需植球，適合輕薄短小產(chǎn)品應(yīng)用。TCP (Tape Carrier Package)ACF Anisotropic Conductive Film 異方性導(dǎo)電膠膜製程Solder mask 防焊漆Soldering Iron 烙鐵Solder balls 錫球Solder Splash 錫渣Solder Skips 漏焊Through hole 貫穿孔To

23、uch up 補焊Briding 穚接(短路)Solder Wires 焊錫線Solder Bars 錫棒Green Strength 未固化強度(紅膠)Transter Pressure 轉(zhuǎn)印壓力(印刷)Screen Printing 刮刀式印刷Solder Powder 錫顆粒Wetteng ability 潤濕能力Viscosity 黏度Solderability 焊錫性Applicability 使用性Flip chip 覆晶Depaneling Machine 組裝電路板切割機Solder Recovery System 錫料回收再使用系統(tǒng)Wire Welder 主機板補線機X-Ra

24、y Multi-layer Inspection System X-Ray孔偏檢查機BGA Open/Short X-Ray Inspection Machine BGA X-Ray檢測機Prepreg Copper Foil Sheeter P.P. 銅箔裁切機Flex Circuit Connections 軟性排線焊接機LCD Rework Station 液晶顯示器修護(hù)機Battery Electro Welder 電池電極焊接機PCMCIA Card Welder PCMCIA卡連接器焊接Laser Diode 半導(dǎo)體雷射Ion Lasers 離子雷射Nd: YAG Laser 石榴

25、石雷射DPSS Lasers 半導(dǎo)體激發(fā)固態(tài)雷射Ultrafast Laser System 超快雷射系統(tǒng)MLCC Equipment 積層元件生產(chǎn)設(shè)備Green Tape Caster, Coater 薄帶成型機ISO Static Laminator 積層元件均壓機Green Tape Cutter 元件切割機Chip Terminator 積層元件端銀機MLCC Tester 積層電容測試機Components Vision Inspection System晶片元件外觀檢查機高壓恆溫恆濕壽命測試機 High Voltage Burn-In Life Tester電容漏電流壽命測試機 Capacitor Life Test with Leakage Current晶片打帶包裝機 Taping Machine元件表面黏著設(shè)備 Surface Mounting Equipment電阻銀電極沾附機 Silver Electrode Coating MachineTFT-LCD(薄膜電晶體液晶顯示器) 筆記型用STN-LCD(中小尺寸超扭轉(zhuǎn)向液晶顯示器 行動電話用PDA(個人數(shù)位助理器)CMP(化學(xué)機械研磨)製程研磨液(Slurry)，Compa