PCBA檢驗規(guī)范

1、v1.0 可編輯可修改PCBA檢驗規(guī)范編 號：版 本：生效日期：v1.0 可編輯可修改1修訂情況表修訂歷史版本說明作者審核批準(zhǔn)生效日期2術(shù)語表術(shù)語表名稱說明文檔說明頁v1.0 可編輯可修改No tableof contents目錄entries found. 6.作 業(yè) 流 程 及 內(nèi) 容 (Flow chart and.1content) 7. 修訂權(quán)限 (AUTHORITY OF MODIFICATION)8. 附件 (ATTACHMENT).2附件一 (PCBA).4附件二 ( 機(jī)構(gòu)類 ) .4 2附件三 ( 其它) .52目錄- 0 - 深圳國人通信有限公司v1.0 可編輯可修改PCB

2、A檢驗規(guī)范1 目的 (Purpose)建立產(chǎn)品外觀目視檢驗標(biāo)準(zhǔn) , 使產(chǎn)品檢驗之判定有所依循 , 同時藉由檢驗資料的回饋分析建 立良好的 workmanship, 防止不良之發(fā)生 .To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document to void failure.2 范圍 (Scope)本規(guī)范適用于所有產(chǎn)品 ( 含半成品及

3、成品 PCBA)的外觀目視檢驗 , 包含自行生產(chǎn)制造之 PCBA, 委托外包生產(chǎn)制造之 PCBA, 以及外購入廠組立或單獨包裝出貨之PCBA等 .It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.3 名詞解釋 (Words explanation)無(None)4 參考文件 (Reference document)ANS/IPC-A-610D5 職責(zé) (Responsibility)5.

4、1 生產(chǎn)單位 (Production unit):5.2 負(fù)責(zé)產(chǎn)品檢驗之執(zhí)行 .5.3 Be responsible for doing product inspection5.4 質(zhì)量管理部 (Quality unit):5.5 負(fù)責(zé)產(chǎn)品規(guī)格之制定及產(chǎn)品品質(zhì)之抽樣檢驗管制v1.0 可編輯可修改5.6 Be responsible for making product specification and controlling the spot checkof product quality6 作業(yè)流程及內(nèi)容 (Flow chart and content )檢驗前的準(zhǔn)備 (preparati

5、on for inspecting):檢驗前須先確認(rèn)所使用的工具 , 材料, 膠, 清潔劑等 , 是否合乎規(guī)定 . 檢驗 PCBA 時必 須配戴防靜電手套或防靜電手環(huán) , 而成品有外殼部分則不在此限 .Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operatorshould have wrist strap or electrostatic glove for prevention ESD(Electronic staticDischarge ), but the finished good wi

6、th。若有檢驗標(biāo)準(zhǔn)未規(guī)范的異?，F(xiàn)象發(fā)生時，不代表該產(chǎn)品允收或拒收，應(yīng)向值班工程師詢問。It is not means the product accept or reject that the standard ofinspection have someabnormal , but should feed back to engineer to confirm.檢驗環(huán)境要求光線充足 , 以目視為主 , 輔以放大鏡和卡尺外觀檢驗項目基準(zhǔn)參見附件一 三。The item of cosmetic inspection standard reference Appendix 1 to 3.7 修訂權(quán)

7、限 (Authority of modification)本規(guī)范由質(zhì)量管理部工程師撰寫 , 經(jīng)研發(fā)單位及生產(chǎn)單位會簽 , 由質(zhì)量管理部最高主管核準(zhǔn) 后實施 , 修改程序亦同 .This criteria is prepared by Quality unit engineer and signed off with R&D(Researchand Develop department )and Production unit, and then approve by Quality manager.Modify procedure as the same above.v1.0 可編輯可修改8

8、附件 Attachment ( 含記錄表單 )附件一： PCBAAppendix 1: PCBA 附件二：機(jī)構(gòu)類Appendix 2: Mechanical 附件三：其它Appendix 3: Other附件預(yù)覽總表附件一: PCBA類附件二 : 機(jī)構(gòu)類(Mechanical)附件三 : 其它(Other)1 SMT零件 (SMT component)1-1 焊點規(guī)格 (SolderingSPEC)1-2 焊點異常 (Soldering abnormal)1-3 零件損壞 (Component damage)1-4 點膠 (Staking adhesivegluing)1 外殼 (Housin

9、g)1 標(biāo)簽 (Label)2 托架 , 承座 (Chassis)2 Barcode3 銘板 (Overlay)3 包裝袋 (PE bag)4 散熱片 (Heat sink)4 外箱 (Carton)5 絕緣片 (Insulator)5 Housing6 螺絲 , 螺帽 , 墊片 (Screw nut)7 DC series converter系列成品外觀檢驗標(biāo)準(zhǔn)2 Dip 零件 (DIP component)2-1 焊點規(guī)格 (DIP SPEC)2-2 引 腳 突 出 (Leadprotrusion)8 Transformer9 Shielding cover 外觀檢驗標(biāo) 準(zhǔn)- 3 -v1.

10、0 可編輯可修改2-3 通孔 (PTH)2-4 插件外觀 (Appearance)2-5 點膠 (Adhesive gluing)2-6 DIP 高翹 (DIP component lifted)3 PCB3-1 marking3-2 外觀 (Surfaceappearance)3-3 焊錫性 (Solderability)4Connector, PIN & 金手指 (Golden finger)5 其它 (Other)5-1 螺絲 (Screw)5-2 跳線 (Jump)附件一: PCBA類1 SMT零件 (SMT component)1-1 焊點規(guī)格 (Soldering SPEC)1-1

11、-1 Chip 零件 (Chip component)v1.0 可編輯可修改DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less零件偏移 D50% W 或 D50% P 拒收DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less零件偏移 D50%

12、 W 或 D50% P 拒收DefectAny end overhang (B)零件超出 pad 拒收DefectComponent in reserved to lacquer to go to circuit to form a short circuit 零件在有保護(hù)漆之線路上造成短路拒收AcceptableEnd joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less零件焊點寬度 C50%W or C50% P 允收v1.0 可編輯

13、可修改AcceptableMaximum fillet height (E) may overhang the lend orextend onto the of the end cap metallization, but notextend further onto the component body錫高超過金屬端 , 但未延伸至零件本體允收DefectSolder fillet extends onto the component body 錫延伸到零件本體上拒收DefectMinimum fillet high (F) is less than 25% termination hig

14、h (H), or fillet high (F) is less than 0.5mmHigh voltage capacitance minimum fillet high (F) is less than 50% termination high (H), or fillet high (F) is less than 0.75mm 爬錫高度 F25% H 或 F0.5mm 拒收 高壓電容爬錫高度 F50% H 或 F50% W or 50% P. 拒收AcceptableDefectAny end overhang (B) 零件超出 pad 拒收End joint width (C)

15、is minimum 50% component diameter (W) or land width (P),whichever is less 零件連接直徑寬度 C50% W or 50% P 允收v1.0 可編輯可修改AcceptableSide joint length(D) is minimum 50% length of component termination(T) or land length(S), whichever is less側(cè)面焊點長度 D50%T or 50%S 允收DefectSolder fillet extends onto the component b

16、ody 錫延伸到零件本體上拒收AcceptableMinimum fillet heitht(F) is solder thickness(G)plus 25% diameter(W) of the component end cap焊錫高度 F25%(G+W) 允收AcceptableEnd overlap(J) between the component terminationand the land is minimum 50% the length of thecomponent termination(T)零件末端與 PAD重疊部分 J 50%T 允收v1.0 可編輯可修改Defec

17、tEnd overlap(J) is less than 50% of the length of component零件末端與 PAD重疊部分 J50% W 拒收End joint width (C) is less than 50% castellationwidth (W)零件末端焊點寬度 C50% W 拒收DefectMinimum side joint length (D) is less than 50% minimum filletheight (F) or land length external topackage (S),whichever is less零件末端焊點長度

18、D50% S 或 50% F 拒收DefectMinimum fillet height (F) is 25% castellation(H)焊錫高度 F25% H 拒收heightv1.0 可編輯可修改DefectAny end overhang (B)零件超出 pad 拒收DefectheightMinimum fillet height (F) is 25% castellation(H)焊錫高度 F50% W 拒收- 10 -v1.0 可編輯可修改DefectMinimum end joint width (C) is less 50%l ead Width (W) 焊點寬度 C50%

19、 W 拒收DefectSide joint length(D) is less than 80% of lead length(L)焊錫長度 D4/5 L 拒收DefectSolder touches the body or end seal of high-lead configuration component焊錫延伸至零件本體上或封裝末端 拒收Solder touches package body 錫延伸到零件本體上 拒收Acceptable爬錫高度 : Fillet 接觸到正面吃錫面 允收Defect- 11 -v1.0 可編輯可修改AcceptableTransformer high

20、 voltage pincorner portions solder is over the A,but ex no functionpin (for allinverters, except special case）變壓器高壓 Pin 吃錫度已達(dá)到 A 處（ 第一彎角處 ） 允收AcceptableSolder is over the B portion(for all inverters, except special case)吃錫度超出 B 處 允收DefectSolder is already over the B portion, and bobbin hadBeen damag

21、ed by iron .Bobbin 被烙鐵燙傷 拒收DefectMinimum heel fillet height (F) is less than 25% lead thickness (T)焊錫高度 F50% W 拒收DefectMinimum end joint width (C) is less than 50% lead width/diameter (W)焊錫寬度 C50% W 拒收DefectSide joint length (D) is less than 80% lead length焊錫長度 D 小于 4/5 引腳長度拒收DefectSolder touches th

22、e package or end seal焊錫延伸至零件本體上或封裝末端拒收DefectMinimum side joint height (Q) is less than solderthickness (G) plus 50% diameter (W) of round lead or50% thickness of lead at joint side (T) for coined lead 焊錫高度 QG+50% W or Q50% W 拒收AcceptableMinimum end joint width (C) is 50% lead width (W)焊錫寬度 C 50%W 允收

23、DefectSide joint fillet (D) less than 150% lead width焊錫寬度 (D) 小于 150% 引腳寬度 (W) 拒收DefectSolder fillet touches package body焊錫延伸至零件本體上 拒收1-1-7 I 形引腳 (Butt/I Joints)- 14 -v1.0 可編輯可修改DefectAny toe overhang (B)側(cè)邊突出 拒收DefectEnd joint width (C) is less than 75% lead width (W)焊錫寬度 C75%W 拒收DefectSolder touche

24、s package body焊錫延伸至零件本體上 拒收DefectFillet height (F) is less than 0.5mm焊錫高度 (F) 小于 0.5mm 拒收1-1-8 向內(nèi) L 型引腳 (Inward formed L-shaped ribbon leads)DefectEnd joint width(C) is less than 50% lead with(W)Side overhang(A) is greater than 50%WMinimum fillet height(F) is less than 25%焊錫寬度 C50%W 拒收- 15 -v1.0 可編輯

25、可修改焊錫高度 F25% 拒收with(W)焊錫寬度 C 50%W 允收Acceptable1-1-9 BGA 零件 (Area array/Ball grid array )DefectMore than 50% overhang偏移 50% 拒收- 16 -Minimum end joint width(C) is greater than 50% leadv1.0 可編輯可修改DefectSolder bridge錫橋 拒收Dark spots in X-Ray view the bridge between solderjoints在 X-Ray 下焊點間橋接或 拒收Solder op

26、en錫散開 拒收Missing solder漏錫 拒收Solder ball(S) that bridge more than 25% of the distance between the leads錫珠超出焊點間距 25% 拒收DefectFracture solder connection錫裂 拒收- 17 -v1.0 可編輯可修改1-2 焊點異常 (Soldering abnormal)1-2-1 側(cè)立 (Mounting on side)DefectChip resistance mounting on side電阻側(cè)立 拒收AcceptableChip capacitance &

27、Inductance minimum type is lessthan 1206, mounting on side and no more than five(5) chip on each assembly are mounted side ways電容 ,電感類零件小于 1206（ 含）以下, 且單面少于 5pcs1-2-2 翻件 (Mounting upside down)AcceptableElement of chip component with exposed deposited electrical Element is mounted toward board 能導(dǎo)通 允收

28、1-2-3 墓碑 (Tombstone)- 18 -允收v1.0 可編輯可修改DefectChip component standing end(Tombstone) 墓碑 拒收on their terminal1-2-4 共平面 (Coplanarity)Defect1-2-5 錫未完全熔化 (Reflow not complete)DefectIncomplete reflow of solder paste 錫未完全熔化 拒收- 19 -One lead or series of leads on component is out alignment and fails to make

29、proper contact with the land 零件的一個或多個引腳變形，不能與 pad 正常接觸 拒收v1.0 可編輯可修改1-2-6 空焊 (Nonwetting)DefectSolder has not wetted to the land or termination 空焊 拒收1-2-7 冷焊 (Dewetting, Disturbed solder)DefectCharacterized by stress lines from movement in the connection while solidifying 冷焊 拒收- 20 -v1.0 可編輯可修改1-2-8

30、 錫裂 (Fractured solder)DefectFractured or crack solder 焊錫斷裂或破裂 拒收1-2-9 針孔 / 吹孔 (Pinholes/Blowholes)DefectBlowholes, pinholes, voids, etc 焊錫連接出現(xiàn)氣泡 ,氣泡 ,空白 ,流出物等 拒收- 21 -v1.0 可編輯可修改Acceptable 焊點上緊臨零件腳的氣孔/ 針孔 , 一個焊點只允許有一個 , 且其大小須小于零 件腳面積的 1/4 允收Acceptable 焊點上未緊臨零件腳的氣孔 / 針孔 , 一 個焊點容許有不超過兩個 （ 含）, 且其大 小須小于

31、零件腳面積的 1/4 允收1-2-10 錫橋 ( 短路 )Solder bridge(short)DefectA solder connection across conductors that should not be joined錫橋 ( 短路 ) 拒收AcceptableOn the same PAD, solder bridge(short) acrossconductors同 PAD上兩焊點短路允收On the same trace(Visualization) but not same PAD,solder bridge(short) across conductors目視同線路

32、不同 PAD短路 允收- 22 -v1.0 可編輯可修改1-2-11 錫珠 (Solder ball)DefectSolder ball dislodge 非附著性錫珠 拒收Entrapped or encapsulated solder balls that are exceed 0.2mm in diameter 附著性錫珠但錫珠直徑大小為 0.2mm (含)以上 變壓器高壓端及高壓電容旁有附著性錫珠 拒收 Solder ball attached on high voltage side of transformer or around high voltage capacitorMor

33、e than 5 solder balls (diameter less than20.2mm) per 600mm錫珠直徑大小為 0.2mm 以下但錫珠數(shù)量多于 5 顆/ 6 平方公分（含） 拒收PS:錫珠以靜電毛刷刷不掉者 , 判為附著性錫珠1-2-12 錫渣 (Solder splash)- 23 -v1.0 可編輯可修改DefectSolder splashes that are exceed 0.2mm in length 錫渣長度最長邊 0.2mm(含)以上 拒收Solder splashes attached on high voltage side of transformer

34、 or around high voltage capacitor 變壓器高壓端及高壓電容旁有錫渣 拒收More than 5 solder splashes (diameter less than 20.2mm) per 600mm 2 錫渣直徑大小為 0.2mm 以下但錫渣數(shù)量多于 5 顆 / 6平方公分（含） 拒收PCB 銅箔 PAD 沾錫直徑大于 0.7MM 拒收1-3 零件損壞 (Component damage)1-3-1 裂縫與缺口 (Cracks and chip-outs)- 24 -v1.0 可編輯可修改AcceptableCracks or chip-outs not g

35、reater than dimensions L50%, W25%, T25%缺口的尺寸 L50%, W25%, T1.6mm or H2.1mm零件浮起 D1.6mm 或 H2.1mm 拒收DefectPolarized component is mounted backwards 零件極性反 拒收AcceptableThe height of the component body above the H is 0.4mm to 3.2mm零件高度 H不得超出 3.2mm 拒收The angle of the component lead does not greater the 45 o零

36、件傾斜度不大于 45 度 允收2-4-3 DIP & SIPDefectTitle of the component exceeds max component height limits or lead protrusion does not meet acceptance requirement組件傾斜超出高度上限或引腳未出 拒收2-4-4 引腳跨越導(dǎo)線 (Leads crossing conductors)- 31 -v1.0 可編輯可修改AcceptableSleeve does not extend into solder connection絕緣套管不可碰到焊點DefectSpli

37、tting and/or unraveling of sleeving絕緣套管裂開或斷裂 拒收A component lead crossing an electrically noncommonconductor with a clearance of less than 0.5mm withno separating insulator (lead sleeving or surfacecoating)零件腳與線路距離小于 0.5mm 拒收2-4-5 引腳成形 (Leads forming)AcceptableLeads for through-hole mounting extend a

38、t least onelead diameter or thickness but not less than 0.8mm form the body, solder bead, or lead weld零件本體、 球狀連接部分或引腳焊接部分到零件引腳折彎Defect處的距離 L 0.8mm 允收Lead forming as a right angle引腳成形成直角 拒收- 32 -v1.0 可編輯可修改DefectDamage or fracture of component body to lead seal零件的本體或引腳封裝處有損傷或裂痕 拒收DefectLead is damage

39、d more than 10% of the lead diameterLead deformed零件引腳損傷超過引腳半徑 10% 或引腳變形 拒收Defect2-4-6 IC 損傷 (IC damage)Chip out enters into the seal密封處有缺口 拒收Chip out exposes the lead in an area not normally exposedIC 腳連接處破損 拒收There are cracks leading from the chip out.缺口造成芯片外露 拒收2-4-7 軸向引腳和玻璃封裝體損傷 (Axial lead and g

40、lass body/seal damage)AcceptableVisible chip in surface coating of component body and internal functional element is not exposed 組件表面有損傷 , 但未暴露出組件內(nèi)部材質(zhì) 允收- 33 -v1.0 可編輯可修改DefectThe insulating cover is damaged to the extent that the internal functional element is exposed or the component shape is defo

41、rmed,或組件表面的絕緣層受到損傷 , 造成組件內(nèi)部材質(zhì)外露組件嚴(yán)重形變 拒收DefectCrack in glass insulator/seal玻璃封裝上的殘缺引起的裂痕延伸至引腳的密封處收Cracked or damaged glass bead玻璃體破裂 拒收DefectFractured lead weld, solder bead or component body lead零件焊接處裂縫或錫珠 拒收2-4-8 徑向又引腳損傷 Radial (two lead) damageAcceptableMinor surface scratches, cuts or chips that do not expose the component substrate or active area 零件表面有損傷但未暴露出零件內(nèi)部材質(zhì) 拒收Structural integrity is not compromised零件的結(jié)構(gòu)完整性未受到破壞 允收- 34 -v