FPC專業(yè)詞匯中英文對(duì)照

1、FPC 名詞中英對(duì)照1. 目的通過對(duì)行業(yè)標(biāo)準(zhǔn)的 FPC工程名詞引用及我司標(biāo)準(zhǔn)的整合，旨在為我司 FPC名詞的中英用語實(shí)現(xiàn)使用上的統(tǒng)一化2. 適用范圍規(guī)范 FPC相關(guān)工程上出現(xiàn)之不良項(xiàng)目，生產(chǎn)使用之材料、 設(shè)備、治具以及可靠性試驗(yàn)等中英文名詞3. 定義無類別一： FPC不良項(xiàng)目名詞工程類別導(dǎo)線VisualInspection ofConductors基底薄膜VisualInspection ofBase Film覆蓋層和覆蓋涂層VisualInspection ofCoverlay andCovercoat外來物不良名稱中文英文導(dǎo)線Conductors開路Open短路Short缺口Nicks針孔

2、Pinholes額外銅刺Extraneous Copper Between Conductors毛刺Spurs結(jié)瘤Nodules蝕刻凹痕Etched Concave導(dǎo)線分層Conductor Delamination裂紋Cracks導(dǎo)線劃痕Scratches on Conductor凹坑Dents變色Discoloration凹坑Dents劃痕Scratches on Base Film凹坑Dents on Coverlay and Covercoat劃痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalign毛刺Coverlay

3、 Burrs導(dǎo)電性異物Conductive Foreign MattersForeign Matters電鍍金屬或焊錫的表面條件SurfaceCondition of Plated Mentaland Solder外形和孔邊緣VisualInspection ofEdges of Outlineand Holes增強(qiáng)板VisualImperfectionsRelated toStiffenerBonding表面附著物AffixedSubstances on非電性異物Non-conductive Foreign Matters起泡和分層Blistering and Delamination覆蓋層

4、粘結(jié)劑擠出Squeeze-out of Adhesive of Coverlay覆蓋涂層滲出Ooze-out of Covercoat覆蓋涂層跳漏Skipping of Convercoat鍍金Gold Plating鍍金層缺陷Gold Plating Defects鍍錫Tin Plating電鍍金屬或焊料的Penetration of Plated Metal or Solder滲透變暗（變黑）Darkened Appearance (BlackeningDiscoloration)鍍銅孔內(nèi)鍍層空洞Plating Voids in Plated-though Hole鍍金粗糙Rough Go

5、ld鍍金白霧Gold Discoloration鍍金變色Gold Discoloration鍍金層龜裂Gold Crack鍍金針孔Gold Pinhole電鍍露銅Plated Expose Wetting剝離Plated Peeled Off電鍍滲入Plated Wicking漏鍍No Plating表面?zhèn)跴lating Scratch電鍍粗糙Rough Plated藥水滲入Wicking撕裂和缺口Tears and Nicks毛刺Burrs絲狀毛刺Thready Burrs彎曲、變形Warpage微連筋不良Poor Micro-joint外形偏移Outline Misalign外形漏沖No

6、 Outline反折偏位Bending Line MisalignFPC與增強(qiáng)板之間Foreign Matter Between Flexible Printed Board的外來物and StiffenerFPC與增強(qiáng)板之間Voids Between Flexible Printed Board and的空洞Stiffener裂紋Cracks缺角Chip-off劃痕Scratches變形Deformation增強(qiáng)板貼偏移Stiffener Misalign熱固膠Thermosetting Adhesive焊劑殘?jiān)麱lux Residues金屬粉末殘?jiān)黂esidue of Metal Powd

7、ersthe Surface標(biāo)記 Marking定位精度PositionalAccuracy增強(qiáng)板與 FPC的重合性Registration of Stiffener to FPC其它 Other粘結(jié)劑殘?jiān)黂esidue of Adhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist尺寸檢驗(yàn)Dimensional Inspections尺寸測(cè)量Measurement of Dimensions外部尺寸External Dimensions厚度Thickness孔Holes元件孔Component Holes導(dǎo)通孔Via Holes導(dǎo)通孔偏移Via Hole Misali

8、gn安裝孔Mounting Holes導(dǎo)線寬度Conductor Widths導(dǎo)線之間的間距Clearances Between Conductors孔中心間距Distance Between Hole Centers板邊和導(dǎo)線之間的Minimum Distance Between Board Edges and最小距離Conductors標(biāo)記錯(cuò)誤Wrong Marking字符不清晰Unclear Letter孔的定位精度Positional Accuracy of Holes孔與焊盤的重合性Registration of Hole to Land覆蓋層與焊盤的重Registration of

9、 Coverlay (or Covercoat) to合性Land孔的重合性Registration of Holes外形的重合性Registration of Outlines沖外形與導(dǎo)線圖形Registration of Punched Outline to Conductor的重合性Patterns壓敏膠或熱固膠與Registration of Pressure Sensitive or HeatFPC和增強(qiáng)板的重Activated Adhesives to FPC and Stiffener合性鍍通孔的鍍銅層厚Plating Thickness of Copper Panted-thr

10、ough度Holes短裝Shortage混裝Mixed Stowage/Packing離型紙脫落Released Paper Peeled off材料錯(cuò)誤Wrong Material類別二： PFC工程用語工程類別中文英文板單面板Single Sided Flex CircuitsBoard Type單面雙接觸Double Access or Back-bared Flex Circuits雙面板Double Sided Flex Circuits軟硬結(jié)合板Rigid-flex Circuits模具圖紙Die Drawing量產(chǎn)模具M(jìn)ass Production Die樣品模具Prototyp

11、e Die鋼模Steel Die刀模Die上模Top Die下模Bottom Die模具線切割Wire Cut外形模具Outline CutDie保護(hù)膜模具Coverlay Die膠紙模具Pressure Sensitive Adhesive Die補(bǔ)強(qiáng)模具Stiffener Die銀漿模具Silver Die導(dǎo)柱Post沖頭Punch分割刀模Cutting Steel Rule Die銷釘Pin貼合治具Lamination Jig治具電測(cè)治具Electrical Check Jig假貼治具Tacking JigJig( Fixture)曝光治具Exposure Jig絲印網(wǎng)框Screen P

12、rinting Frame曝光定位孔Guide Hole for Exposure模具定位孔Guide Hole for Die假貼定位孔Guide Hole for Tacking孔貼合定位孔Guide Hole for AdhesiveHole電測(cè)定位孔Guide Hole for Electrical Test絲印定位孔Guide Hole for Screen Printing孔環(huán)Lifted Land滲錫孔Stannize Hole裝配孔Fitting Hole下料Material Preparation鉆孔Drilling鍍銅Copper Plating化學(xué)銅le Eletcrol

13、ess Plating Copper貼干膜Sensitive Dry Film絲印阻焊油墨Liquid Photosensitive Soldermask制程曝光ExposureManufacture顯影DevelopingProcedure蝕刻Etching脫膜Stripping貼保護(hù)膜Tacking Coverlay粗化Abrade層壓Lamination固化 ( 烘烤）Curing黑孔Black Hole表面處理Surface Treatment循環(huán)水洗Cascade Rinse微蝕Micro-etch酸洗Acid Cleaning水洗Water Cleaning防銹處理Anti-cor

14、rosion Treatment前處理Pre-treatment刷板Brushing干燥Dry up電鍍（金、錫、(Gold 、Solder 、Nickel) Plating鎳）閃鍍(Gold ) Flash Plating/Strike Plating局部電鍍Pattern Plate化學(xué)鎳金Immersion Gold有機(jī)保焊膜Organic Solderability Preservatives (OSP)絲印字符Printing of Legend貼補(bǔ)強(qiáng)板Back Board Lamination電性能測(cè)試Electrical Inspection貼膠紙Double Faced Adh

15、esive Tape打孔Punching雷射切割Laser Cut自動(dòng)光學(xué)檢驗(yàn)Automatic Optical Inspection（ AOI）表面貼裝Surface Mounting Technology（SMT）外形沖切Punching沖孔Punching外觀檢查Final Inspection目視檢查Visual Inspection （ Final Inspection)線路顯微鏡檢Conductor Microscope Inspection驗(yàn)（鏡檢）性能測(cè)試Reliability Test包裝Packing銅箔Copper Foil (CU)電解銅Electro-deposite

16、d Copper Foil (ED)壓延銅Rolled Annealed Copper Foil (RA)保護(hù)膜Coverlay (CVL)基材Base Material撓性覆銅板Flexible Copper Clad Laminate (FCCL)無膠基材Adhesiveless FCCL粘接劑（膠）Adhesives (Ad)原材料 MaterialAcrylic壓克力頂層補(bǔ)強(qiáng)Top Stiffener底層補(bǔ)強(qiáng)Bottom Stiffener頂層銀漿膜Top Silver Paste底層銀漿膜Bottom Silver Paste銀漿油墨Sliver Ink頂層線路Top Circuit

17、s/Conductors底層線路Bottom Circuits/Conductors半固化片Bonding Film (BOD)聚酰亞胺Polyimide(PI)聚酯Polyester Film (PET)鋼片Sheet Steel玻璃纖維布Woven Glass ClothFR4補(bǔ)強(qiáng)板Fiberboard液態(tài)感光油墨Liquid Photoimageable Resist Ink壓敏膠Pressure Sensitive Adhesive（PSA）離型膜Release Paper導(dǎo)電膠Conducting Resin導(dǎo)電布Electric Fabric泡棉Foam導(dǎo)向?qū)щ娔zAnisotrop

18、ic Conductive Film（ACF）導(dǎo)電泡棉Conductive/Electric Foam屏蔽膜Shield Film(金屬)薄膜開Metal Dome （ DOME）關(guān)連接器Connector電容Capacitance( C )電阻Resistance( R )集成電路Integrated Circuit（IC）二極管Diode (D)靜電Electro-Static Discharge（ESD）機(jī)械方向Machine Direction（MD）垂直方向Transverse Direction（TD）進(jìn)刀Feed進(jìn)刀量Chip Load轉(zhuǎn)速Speed焊接Soldering手工焊接

19、Hand Soldering波焊Wave Soldering品質(zhì)允收標(biāo)準(zhǔn)Acceptable Quality Level（ AQL）其菲林Film它Legend字符OthersOven烘箱溫度Temperature濕度Humidity速度Speed壓力Pressure噴淋壓力Spouting Pressure濃度Concentration原理圖紙Schematic Diagram線寬Line Space線距Line Width線路間距Pitch類別三：FPC可靠性測(cè)試項(xiàng)目中文英文電氣性能Testing of Electrical Performance導(dǎo)線電阻Conductor Resistance表面層絕緣電阻Surface Insulation Resistance (SIR)表面介質(zhì)層耐電壓強(qiáng)度Dielectric Withstanding Voltage of Surface Layers機(jī)械性能測(cè)試Testing of Mechanical Property剝離強(qiáng)度Peel Strength孔和焊墊的拉脫強(qiáng)度Pull-out Strength