KLA缺陷檢查培訓(xùn)學(xué)習(xí)教案

1、會計學(xué)1KLA缺陷缺陷(quxin)檢查培訓(xùn)檢查培訓(xùn)第一頁，共25頁。21xx Capabilities2第1頁/共24頁第二頁，共25頁。3第2頁/共24頁第三頁，共25頁。Run Overview4第3頁/共24頁第四頁，共25頁。Run one waferInspection Queue5第4頁/共24頁第五頁，共25頁。6第5頁/共24頁第六頁，共25頁。7第6頁/共24頁第七頁，共25頁。8第7頁/共24頁第八頁，共25頁。9第8頁/共24頁第九頁，共25頁。Stopping the Inspection10第9頁/共24頁第十頁，共25頁。Defect Overview To im

2、prove production yields, defects need to be monitored and statistically analyzed at each stage of wafer production.11第10頁/共24頁第十一頁，共25頁。Defect Sort1.False : Found nothing after review with inspection data.2.Unkown : Defects were found but there is no suitable defect code to assign.3.Fall on particle

3、 : Particle on surface of patten. 4.In film particle : Particle was contained in film, such as poly, HDP, metal and so on.HDPPoly12第11頁/共24頁第十二頁，共25頁。5.Scratch : Especially for scratch caused by robot , other tool parts or man-made. Defect map :Defect iamge:MicroMacro13第12頁/共24頁第十三頁，共25頁。6.Discolor

4、: Color difference7.Masking ：Should be etched but still remian(poly,SiN,spacer,metal and so on). Some connect more than two lines,its bridge(killer).14第13頁/共24頁第十四頁，共25頁。8.Ring like defect: Such as defects caused by ARC splash, usually related to PHOTO.PolyMetal9.Grape like defect:Induces by PHOTO P

5、U.15第14頁/共24頁第十五頁，共25頁。10.Residue ：Always happen after wet station clean.11.Patten abnormal : Roughness,Defocus,Patten shift and so on.RoughnessDefocusPatten shiftPatten Abnormal16第15頁/共24頁第十六頁，共25頁。12.Concave: COP（ Crystal oriented pits ）, Oxide Loss，Pits.13.Peeling : Pattern shift or missing（W plu

6、g is one of peeling,always appear at wafer edge.） 17第16頁/共24頁第十七頁，共25頁。14.Blind : CT or Via have not been opened.15.Patten damage : Metal damagePoly broken is patten damage too,always happen during High Imp.18第17頁/共24頁第十八頁，共25頁。16.W Residue : 1). Caused by Oxide Loss; 2). Caused by CMP.NORMAL ABNORM

7、AL17.Under_Pat ：Under layer pattern fail issue.19第18頁/共24頁第十九頁，共25頁。18. Salicide_abnormal:Salicide poor formation.19.Grain : Including poly or metal grain.20第19頁/共24頁第二十頁，共25頁。20.Slurry: 21.PR /Polymer_remain :PR has not been stripped completely, typically contains Carbon21第20頁/共24頁第二十一頁，共25頁。22.Arcing:23.Line open:22第21頁/共24頁第二十二頁，共25頁。24.Corrosion : Caused by etch strip chamber or bad environment. This type defect is 100% killer defect.23第22頁/共24頁第二十三頁，共25頁。24第23頁/共24頁第二十四頁，共25頁。NoImage內(nèi)容(nirng)總結(jié)會計學(xué)。Defect map :。6.Discolor : Color difference。Some connect more than two lines,its bridge