QS-JMME-115A(ProfilingWI)回流焊爐測(cè)溫作業(yè)指導(dǎo)書(shū)

1、.orld FairReflow Oven Profiling Work Instruction文件編號(hào)QS-JMME-115回流焊爐測(cè)溫作業(yè)指導(dǎo)書(shū)版本號(hào)A編制Ken Chen核準(zhǔn)Dick Lee日期17 Feb, 2006Page 8 of 7版本號(hào)Revision修改內(nèi)容Description / Changes文件發(fā)放/變更編號(hào)Document Release/Change No.日期DateA首次發(fā)行 First ReleaseJMQS06021702317 Feb, 20061. 目的 PURPOSE1.1 確保機(jī)器及設(shè)備保持良好狀態(tài)。2. 適用范圍 SCOPE2.1 此程序適用于所

2、有回流焊爐。This document covers activity of all Reflow oven.3. 定義 DEFINITION3.1 PCB Printed Circuit Board 印刷線(xiàn)路板3.2 MI Manufacturing Instruction 生產(chǎn)作業(yè)指導(dǎo)書(shū)4. 參考文件 REFERENCE DOCUMENT4.1 生產(chǎn)作業(yè)指導(dǎo)書(shū)Manufacturing Instruction4.2 Profiler 溫度測(cè)試儀作業(yè)指導(dǎo)書(shū) (QS-JMME-114)Profiler Temperature Checker Work Instruction (QS-JMME-

3、114)5. 職責(zé) RESPONSIBILITY5.1 工程師及技術(shù)員。Engineer and Technician.5.1.1 當(dāng)有新產(chǎn)品將要生產(chǎn)前, 必須設(shè)定回流焊爐爐溫, 速度及進(jìn)行測(cè)溫。When a new product before production, the Reflow oven must be setup temperature, speed setting and temperature testing.5.1.2 確保每次轉(zhuǎn)變回流焊爐爐溫及等待至爐溫穩(wěn)定后, 于1小時(shí)內(nèi)執(zhí)行測(cè)溫。Ensure checked temperature profile within 1

4、hour after temperature stable per change reflow temperature.6. 設(shè)備及物料 EQUIPMENT AND MATERIAL6.1 回流焊測(cè)試儀 Profile Checker6.2 高溫錫線(xiàn) High Activity Type Solder Wire6.3 印刷線(xiàn)路板 PCB6.4 鉻鐵 Iron Tip7. 程序 PROCEDURE7.1 回流焊溫區(qū)分預(yù)熱、浸潤(rùn)、回焊和冷卻四個(gè)部份, 詳細(xì)如圖1。Reflow temperature to divide pre-heat, soak, reflow and cooling 4 pa

5、rts. Detail see figure 1.圖1Figure 17.2 回流焊測(cè)溫圖規(guī)格(適合一般含鉛錫漿, 如Alpha LR591 / OL107E等)。Specification of reflow profiling(For general Leaded Solder Paste, such as Alpha LR591 / OL107E etc).7.2.1 預(yù)熱升溫速度少于或等于3每秒。(由室溫至120)Heat ramp of pre-heat ambient up 3 / sec. (Start from room temp. to 120)7.2.2 浸潤(rùn)溫度達(dá)至120

6、140, 時(shí)間為20120秒。Soak ambient to 120140for 20120sec.7.2.3 回焊溫度達(dá)至高于183, 最高溫度為210 ±5, 時(shí)間為1分鐘 ±15秒。Reflow ambient to above 183and peak temperature 210 ±5 for 1 min ±15sec.7.2.4 每次測(cè)溫須至少有3條測(cè)溫曲線(xiàn), 并其中至少有1條測(cè)溫曲線(xiàn)表示IC / 連接器溫度(如有)。At least 3 channel s to present in profile, and at least 1 chan

7、nel for IC / Connector (If Mounted).7.3 回流焊溫區(qū)規(guī)格(適合一般無(wú)鉛錫漿, 如Alpha OMNIX 310 / OM-338等)。Specification of reflow profiling(For general Lead Free Solder Paste, such as Alpha OMNIX 310 / OM-338 etc).7.3.1 預(yù)熱升溫速度少于或等于3每秒。(由室溫至150)Heat ramp of pre-heat ambient up 3 / sec. (Start from room temp. to 150)7.3.

8、2 浸潤(rùn)溫度達(dá)至150180, 時(shí)間為20120秒。Soak ambient to 150180for 20120sec.7.3.3 回焊溫度達(dá)至高于217, 最高溫度為230245, 時(shí)間為1分鐘 ±15秒。Reflow ambient to above 217and peak temperature 230245 for 1 min ±15sec.7.3.4 每次測(cè)溫須至少有3條測(cè)溫曲線(xiàn), 并其中至少有1條測(cè)溫曲線(xiàn)表示IC / 連接器溫度(如有)。At least 3 channel s to present in profile, and at least 1 cha

9、nnel for IC / Connector (If Mounted).7.4 AWG含鉛產(chǎn)品回流焊溫區(qū)規(guī)格。Specification of reflow profiling for AWG Leaded Product.7.4.1 Alphametal OMNIX 6106錫漿規(guī)格。Alphametal OMNIX 6106 solder paste specification.7.4.1.1 預(yù)熱升溫速度少于或等于3每秒。(由室溫至145)Heat ramp of pre-heat ambient up 3 / sec. (Start from room temp. to 145)7.

10、4.1.2 浸潤(rùn)溫度達(dá)至145160, 時(shí)間為20120秒。Soak ambient to 145160for 20120sec.7.4.1.3 回焊溫度達(dá)至高于183, 最高溫度為210220, 時(shí)間為1分鐘 ±30秒。Reflow ambient to above 183and peak temperature 210220 for 1 min ±30sec.7.4.2 Tamura RMA-012-FP錫漿規(guī)格。Tamura RMA-012-FP solder paste specification.7.4.2.1 預(yù)熱升溫速度少于或等于3每秒。(由室溫至150)He

11、at ramp of pre-heat ambient up 3 / sec. (Start from room temp. to 150)7.4.2.2 浸潤(rùn)溫度達(dá)至150170, 時(shí)間為20120秒。Soak ambient to 150170for 20120sec.7.4.2.3 回焊溫度達(dá)至高于183, 最高溫度為210220, 時(shí)間為1分鐘 ±30秒。Reflow ambient to above 183and peak temperature 210220 for 1 min ±30sec.7.5 ECHELON回流焊溫區(qū)規(guī)格。Specification of

12、 reflow profiling for ECHELON Product.7.5.1 適合ECHELON含鉛產(chǎn)品For ECHELON Leaded Product7.5.1.1 預(yù)熱升溫速度少于或等于3 每秒。(由室溫至140)Heat ramp of pre-heat ambient up 3 / sec. (Start from room temp. to 140)7.5.1.2 浸潤(rùn)溫度達(dá)至140165, 時(shí)間為12 分鐘。Soak ambient to 140165 for 12 mins.7.5.1.3 回焊溫度達(dá)至高于183, 時(shí)間為 5090秒; 溫度在210以上, 時(shí)間為

13、2040秒。Reflow ambient to above 183 for 5090sec Above 210 for 2040sec.7.5.1.4 最高溫度不可高于225, 降溫速度少于或等于4 每秒。Max. temp. 225 and cooling ramp down 4 / sec.7.5.2 適合ECHELON無(wú)鉛產(chǎn)品(使用Tamura TLF-204-93無(wú)鉛錫漿)For ECHELON Lead Free Product (Use Tamura TLF-204-93 lead free solder paste)7.5.2.1 預(yù)熱升溫速度少于或等于3 每秒。(由室溫至160

14、)Heat ramp of pre-heat ambient up 3 / sec. (Start from room temp. to 160)7.5.2.2 浸潤(rùn)溫度達(dá)至160190, 時(shí)間為12 分鐘。Soak ambient to 160190 for 12 mins.7.5.2.3 回焊溫度達(dá)至高于220, 時(shí)間為 2040秒。Reflow ambient to above 220 for 2040sec.7.5.2.4 最高溫度在于230240之間, 降溫速度少于或等于4 每秒。Max. temp. between 230240 and cooling ramp down 4 /

15、sec.7.6 設(shè)定回流焊爐爐溫, 速度及進(jìn)行測(cè)溫。Setup temperature, speed setting and temperature testing for Reflow oven.7.6.1 根據(jù)PCB型號(hào), 找出PCB及在測(cè)溫點(diǎn)上焊上測(cè)溫線(xiàn)。Base on PCB model, found out the PCB and mounted thermo-couple on check points.7.6.2 在回流焊爐上, 復(fù)制一個(gè)已存在的程序作為新程序, 或選取需要調(diào)溫的程序。In the Reflow oven, copy a current used program

16、to be a new program, or select the program which need to adjust.7.6.3 開(kāi)始升溫, 直至到達(dá)預(yù)定溫度及保持穩(wěn)定。Startup the program to the set point temperature and keep stable.7.6.4 使用回流焊測(cè)試儀測(cè)出實(shí)際溫度。Use the Profile Checker to check the actual temperature.7.6.5 如不符合規(guī)格, 調(diào)整焊爐溫區(qū)設(shè)定或輸送鏈速度, 再重復(fù)7.6.3及7.6.4步驟, 直至符合規(guī)格。If the result

17、 is not within specification, adjust the temperature set point or conveyor speed of the Reflow oven. And then repeat the step 7.6.3 and 7.6.4 until to conform to specification.7.6.6 完成后, 整理清潔機(jī)器及所用物品, 并放回原處。When finish, to clean the machine and all of material, then place all tools back.7.6.7 將焊爐溫區(qū)設(shè)定

18、及輸送鏈速度, 記錄于生產(chǎn)作業(yè)指導(dǎo)書(shū)。Record the temperature and conveyor speed set point of Reflow oven to MI.7.7 每日早班首一小時(shí)及每次轉(zhuǎn)變生產(chǎn)型號(hào)須進(jìn)行測(cè)溫, 并于投產(chǎn)后一小時(shí)內(nèi)完成測(cè)溫。Profiling check at first hour of morning shift every day and each change model, this should be finished within one hour after setting-up.7.7.1 根據(jù)產(chǎn)品型號(hào), 找出生產(chǎn)作業(yè)指導(dǎo)書(shū)內(nèi)的回流焊測(cè)

19、溫報(bào)告圖作參考。Base on product model, found out Reflow Profile from MI for refer.7.7.1.1 Profiler測(cè)溫報(bào)告圖的簡(jiǎn)易說(shuō)明如下:The simple illustration of Profiler report as below:7.7.1.2 A項(xiàng)為各測(cè)溫點(diǎn)的最高溫度。Item A is the maximum temperature of each profiling channels.7.7.1.3 B項(xiàng)為各測(cè)溫點(diǎn)在此溫度范圍的停留時(shí)間, 此區(qū)可在軟件中調(diào)整溫度范圍。Item B is the total t

20、ime of each channels in this area, this area can adjust the range of temperature in the software.7.7.1.4 C項(xiàng)為各測(cè)溫點(diǎn)在此溫度以上的停留時(shí)間, 此區(qū)可在軟件中調(diào)整溫度。Item C is the total time of each channels above this temperature, this temperature can adjust in the software.7.7.1.5 D項(xiàng)為測(cè)溫的時(shí)間及日期。Item D is the time and date of profiling.7.7.2 使用回流焊測(cè)試儀測(cè)出實(shí)際溫度, 檢查溫度是否超出規(guī)格(參考7.27.5項(xiàng), 如有個(gè)別的規(guī)格要求