中國集成電路設(shè)計(jì)業(yè)會(huì)暨

/14中國集成電路設(shè)計(jì)業(yè) 2015年會(huì)暨天津集成電路產(chǎn)業(yè)創(chuàng)新發(fā)展高峰論壇CSIA-ICCAD2015AnnualConference&TianjinICIndustryInnovationandDevelopmentSummitb5E2RGbCAP會(huì)議日程Agenda2015年12月10日，星期四December10,Thursday,2015地點(diǎn)：天津梅江會(huì)展中心一樓 N4多功能廳Venue:Multiple-functionhallN4,1/F,TianjinMeijiangConvention&ExhibitionCenterp1EanqFDPw時(shí)間Time內(nèi)容Contents開幕式OpeningCeremony主持人：天津市科委Moderator:08:30-08:55天津市政府領(lǐng)導(dǎo)致開幕詞Address,TianjinMunicipalGovernment中國半導(dǎo)體行業(yè)協(xié)會(huì)執(zhí)行副理事長徐小田先生致詞Mr.XuXiaotian,ExecutiveViceGeneralDirector,CSIA國家發(fā)改委領(lǐng)導(dǎo)致詞Address,NDRC科學(xué)技術(shù)部領(lǐng)導(dǎo)致詞Address,MOST工業(yè)和信息化部領(lǐng)導(dǎo)致詞Address,MIIT高峰論壇TopForum主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)秘書長 程晉格先生Moderator:Mr.ChengJinge,GeneralSecretary,CSIA-ICCAD08:55-09:25主旨報(bào)告一 中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)理事長 魏少軍教授一Prof.WeiShaojun,GeneralDirector,CSIA-ICCAD09:25-09:55主旨報(bào)告—天津市科委

09:55-10:20向向物聯(lián)網(wǎng)、汽車電子、云計(jì)舁的完整工2平百一TSMC中國業(yè)務(wù)發(fā)展副總經(jīng)理 羅鎮(zhèn)球先生TechnologyPlatformforFutureApplications一Mr.RogerLuo,VicePresident,BusinessDevelopment,TSMC10:20-10:45萬物互聯(lián)，質(zhì)量為先”-物聯(lián)網(wǎng)時(shí)代半導(dǎo)體企業(yè)的致勝關(guān)鍵MentorGraphics全球副總裁，亞太區(qū)總裁 彭啟煌先生TimetoQualityandQuantity"-TheEssenceofSuccessintheIoTEraDannyPerng,Corp.VicePresident,PacRimManagingDirector,MentorGraphics10:45-11:10面向物聯(lián)網(wǎng)的芯片設(shè)計(jì)平臺(tái)即服務(wù)( SiPaaS一 芯原股份有限公司董事長，總裁兼首席執(zhí)行官 戴偉民博士SiliconPlatformasaService(SiPaaS)forIoT一Dr.WayneDai,Chairman,PresidentandCEO,VeriSiliconHoldingsCo.,Ltd.11:10-11:35Cadence在新時(shí)代助您領(lǐng)先,技— Cadence公司全球副總裁，亞太區(qū)總裁方豐瑜先生AsLeaderinIntelligenceWorldwithCadence-Mr.MichaelShih,CorporateVicePresident,AsiaPacificRegion,CadenceDesignSystems,Inc.11:35-12:00物聯(lián)網(wǎng)：從芯片到軟件的新要求一 新思科技總裁兼聯(lián)合首席執(zhí)行官 陳志寬博士IoT:NewRequirementsfromSilicontoSoftware一Dr.Chi-FoonChan,President&co-CEO,Synopsys12:00-13:25自助午餐BuffetLunch主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)IC設(shè)計(jì)分會(huì)第一副理事長 嚴(yán)曉浪教授Moderator:Prof.YanXiaolang,ChiefViceGeneralDirector,CSIA-ICCAD13:25-13:30幸運(yùn)抽獎(jiǎng)LuckyDraw13:30-13:55晶圓專工在物聯(lián)網(wǎng)世界的角色一 聯(lián)華電子股份有限公司市場(chǎng)營銷暨特殊制程研發(fā)副總經(jīng)理 簡山綠先生I.O.T.Foundry一Mr.Chien,ShanChieh,VPOfCorporateMarketing&SpecialtyTechnologyDevelopment,UMC13:55-14:20合作共贏大數(shù)據(jù)時(shí)代— 中芯國際集成電路制造有限公司全球市場(chǎng)部資深副總裁 許天粢先生CollaboratetoWininBigDataEra一Mr.SunnyHui,SeniorVicePresident,WorldwideMarketing,SMIC

14:20-14:45芯系中國夢(mèng)，共建創(chuàng)新生態(tài)與中國產(chǎn)業(yè)共成長一ARM全球執(zhí)行副總裁兼大中華區(qū)總裁 吳雄昂先生Core”ofChinaDream-GrowwithChinaandEnableOpenInnovation一Mr.AllenWu,EVPandPresidentofGreaterChina,ARM14:45-15:10科創(chuàng)引領(lǐng)智造— 上海華力微電子有限公司市場(chǎng)部總監(jiān) 劉子明先生ScientificandTechnologicalInnovationLeadsIntelligentManufacturing一Mr.HenryLiu,SeniorDirector,Marketing,ShanghaiHLMC15:10-15:25茶歇，交流CoffeeBreak15:25-15:30幸運(yùn)抽獎(jiǎng)LuckyDraw15:30-15:55先進(jìn)制程介紹為您所需一 格羅方德半導(dǎo)體科技（上海）有限公司 MichaelMendicino先生AdvancedNodeTechnologies-MakingtheRightChoice一Mr.MichaelMendicino,SeniorDirector,CMOSPlatformsBusinessUnit,GLOBALFOUNDRIES15:55-16:20新產(chǎn)業(yè)環(huán)”的本土 EDA— 北京華大九天軟件有限公司運(yùn)營副總 楊曉東先生DomesticEDAinnewindustryenvironment—Mr.SteveYang,OperationVP,HuadaEmpyreanSoftwareCo.,Ltd.16:20-16:45先進(jìn)封裝助力智能硬件發(fā)展— 蘇州晶方半導(dǎo)體科技股份有限公司副總經(jīng)理 劉宏鈞先生Advancedpackagingtogiveyoubettervision,senseandsecurity一Mr.RussellLiu,VP,ChinaWaferLevelCSPCo.,Ltd.16:45-17:10搭載中國制造2025”，打造領(lǐng)先的汽車 中國芯”一 大唐恩智浦半導(dǎo)體有限公司首席執(zhí)行官，總經(jīng)理 張鵬崗先生ConformtoMadeinChina2025tobuildintoworld 'sleadingautomotivesemiconductorcompany一Mr.PaulZhang,CEO,DatangNXPSemiconductorsCo.,Ltd.17:10-17:35集成電路設(shè)計(jì)產(chǎn)業(yè)并購整合討論一 飛思卡爾強(qiáng)芯（天津）集成電路設(shè)計(jì)有限公司總經(jīng)理 仇雨菁女士ICDesignIndustryMerger&IntegrationDiscussion-MaggieQiu,GeneralManager,FreescaleQiangxin（Tianjin）ICDesignCo.,Ltd.17:35-17:40幸運(yùn)抽獎(jiǎng)LuckyDraw18:30-20:30歡迎晚宴(北京華大九天軟件有限公司贊助)WelcomeDinnerBanquet(SponsoredbyEmpyrean)地點(diǎn)：力麗大津賓館大宴會(huì)廳Site:RenaissanceTianjinLakeviewHotel

2015年12月11日，星期五Dec11,Friday,2015專題論壇(一)SubjectForum(I)地點(diǎn)：天津梅江會(huì)展中心二樓 213會(huì)議室Venue:MeetingRoom213,2/F,TianjinMeijiangConvention&ExhibitionCenterDXDiTa9E3d時(shí)間Time內(nèi)容Contents演講人LecturerEDA、IP與IC設(shè)計(jì)服務(wù)EDA,IPandICDesignService主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)副理事長，周生明先生Moderator:Mr.ZhouShengming,ViceGeneralDirector,CSIA-ICCAD08:40-09:05新一代光通信前端智能化光收發(fā)集成電路系列的發(fā)展TheDevelopmentonNewgenerationofOpticalTransceiverASIC廈門優(yōu)迅高速芯片有限公司首席科學(xué)家，黃以明HuangYiming,ChiefScientist,XIAMENUXHIGH-SPEEDICCO.,LT09:05-09:30新思科技公司09:30-09:55迎接16nm時(shí)代SoC時(shí)鐘、時(shí)序和功耗挑戰(zhàn)TheClock,TimingandPowerOptimizationSolutionsatthe16nmnode北京華大九天軟件有限公司物理設(shè)計(jì)事業(yè)部經(jīng)理，董森華Senhua,Dong,DepartmentManager,PhysicalDesignBU,HuadaEmpyreanSoftwareCo.,Ltd.09:55-10:20企業(yè)級(jí)硬件仿真平臺(tái) PalldiumZ1帶來卜一代數(shù)據(jù)中心級(jí)仿真解決方案NewEraofDatacenter-classEmulationwithPalladiumZ1EnterpriseEmulationPlatformCadence公司亞太區(qū)系統(tǒng)解決方案暨驗(yàn)證平臺(tái)總監(jiān)，張永專SimonChan,DirectorofSystemSolutionandVerificationPlatform,AsiaPacific,Cadence10:20-10:45FD-SOI—適用于物聯(lián)網(wǎng)的低功耗技術(shù)FD-SOI—LowEnergyTechnologyforIoT芯原微電子(上海)有限公司基礎(chǔ)IP及版圖設(shè)計(jì)資深總監(jiān)，金小衛(wèi)ShirleyJin,Sr.Director,FoundationIPandLayout,VeriSiliconMicroelectronics(Shanghai)Co.,Ltd.10:45-11:10從現(xiàn)實(shí)到虛擬，和Veloce一起改變你的驗(yàn)證流程Real2Virtual,gowithVelocechangeyourverificationflowMentorGraphics仿真部門技術(shù)經(jīng)理，張俊JustinZhang,TechnicalManager,EmulationDivision,MentorGraphics

11:10-11:35仿真驅(qū)動(dòng)智能物聯(lián)網(wǎng)產(chǎn)品設(shè)計(jì)SimulationDrivensmartInternetofThings(IoT)ProductDevelopmentANSY鏤司主任應(yīng)用工程師， 趙常ZhaoChang,LeadApplicationEngineer,ANSYSInc.11:35-12:00先進(jìn)存儲(chǔ)器設(shè)計(jì)的高精度電路仿真和驗(yàn)證Highaccuratecircuitverificationandsignoffforadvancedmemorydesigns概倫電子科技有限公司市場(chǎng)副總裁，楊廉峰LianfengYang,MarketingVP,ProPlusDesignSolutions,Inc.12:00-12:05幸運(yùn)抽獎(jiǎng)LuckyDraw12:05-13:00自助午餐BuffetLunch主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)副理事長，張力天先生Moderator:Mr.ZhangLitian,ViceGeneralDirector,CSIA-ICCAD13:00-13:25從工藝建模、設(shè)計(jì)仿真到電路測(cè)試-是德科技提供IC全面解決方案FromModeling,simulationtotest-FullICsolutionfromKeysight是德科技（中國）有限公司大中華區(qū)市場(chǎng)部經(jīng)理，任彥楠RenYannan,Marketingdevelopmentmanager,KeysightTechnologies13:25-13:50壹晶半導(dǎo)體設(shè)計(jì)和制造服務(wù)eSiliconSemiconductorDesign&ManufacturingSolutions壹晶半導(dǎo)體資深客戶市場(chǎng)經(jīng)理，羅志華ElwinLuo,Sr.ClientMarketingManager,eSilicon13:50-14:15面向物聯(lián)網(wǎng)(IOT)應(yīng)用的高能效嵌入式CPUPowerefficientembeddedprocessorforIoTapplications杭州中天微系統(tǒng)有限公司首席技術(shù)官，孟建熠MengJianyi,CTO,C-SKYMicrosystemsCO.,LTD14:15-14:30茶歇，交流CoffeeBreak14:30-14:55物聯(lián)網(wǎng)時(shí)代的智能硬件TheSmarthardwareinInternetofthings中國科學(xué)院EDA中心主任，陳嵐ChenLan,Director,EDACenterofChineseAcademyofSciences14:55-15:20Robei可視化芯片設(shè)計(jì)軟件和自適應(yīng)心片RobeiVisualChipDesignSoftwareandAdaptiveChip青島若貝電子有限公司總裁，吳國盛WuGuosheng,CEO,RobeiLLC15:20-15:50未來物聯(lián)網(wǎng)創(chuàng)新平臺(tái)解決方案InnovationPlatformSolutionfortheFutureIoT燦芯半導(dǎo)體（上海）有限公司首席技術(shù)官，莊志青JohnZhuang,CTO,BriteSemiconductor（Shanghai）Corporation15:50-16:15定制您自己的芯”CustomBuildYourChips北京芯詣世紀(jì)科技有限公司銷售總監(jiān)，李偉AndrewLi,SalesDirector,BeijingStarChipTechnologies,Inc.

16:15-16:40快速實(shí)現(xiàn)系統(tǒng)開發(fā)的基帶芯片設(shè)計(jì)套件BasebandICDesignKitsforRapidSystemRealization展訊通信（上海）有限公司硬件部高級(jí)副總裁，羅強(qiáng)JohnRowland,SVPofHardwareEngineering,Spreadtrum16:40-16:45幸運(yùn)抽獎(jiǎng)LuckyDraw18:00-20:00閉幕招待晚宴ClosingReceptionBanquet地點(diǎn)：天津賽象酒店Site:TianjinSaixiangHotel2015年12月11日，星期五Dec11,Friday,2015專題論壇(二)SubjectForum(n)地點(diǎn)：天津梅江會(huì)展中心二樓 214會(huì)議室Venue:MeetingRoom214,2/F,TianjinMeijiangConvention&ExhibitionCenterRTCrpUDGiT時(shí)間Time內(nèi)容Contents演講人LecturerIP與IC設(shè)計(jì)IPandICDesign主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)副理事長，高松濤先生Moderator:Mr.GaoSongtao,ViceGeneralDirector,CSIA-ICCAD08:40-09:05物聯(lián)網(wǎng)應(yīng)用：可靠、/賴與安全的內(nèi)嵌式 NVM解決方案TrustworthyLogicNVMSolutionsforVariousIoTApplications力旺電子營銷副處長，享K余政SteveKuo,MarketingDeputyDirector,eMemory09:05-09:30視頻編解碼發(fā)展趨勢(shì)VideoCodecTrend芯媒半導(dǎo)體（上海）有限公司中國區(qū)銷售總經(jīng)理，王田WangTian,ChinaCountryManager,Chips&Media,Inc.09:30-09:55ArterisNoCAdoptioninAutomotiveandIoT美國安通思控股有限公司技術(shù)支持，曾品翰WilliamTseng,SolutionsArchitect,ArterisInc.09:55-10:20IC技術(shù)創(chuàng)新實(shí)現(xiàn)智能生活I(lǐng)CInnovationsEnableNewSmartLife安謀電子科技（上海）有限公司中國區(qū)FAE總監(jiān)，劉潮WilliamLiu,FAEDirector,ARMChina

10:20-10:45高速接口及超低功耗IP應(yīng)用解決方案TheHighSpeedInterfaceandULPIPSolutions北京華大九天軟件有限公司IP與設(shè)計(jì)服務(wù)事業(yè)部總監(jiān)，劉寅LiuYin,SeniorDirector,IP&DesignServiceBU,HuadaEmpyreanSoftwareCo.,Ltd.10:45-11:10如何在28/14納米工^上輕松集成芯動(dòng)高速接口 IPSmoothIntegrationofInnosiliconInterfaceIPat28/14nm芯動(dòng)科技有限公司 CEO,敖海GordonAo,CEO,InnosiliconTechnologyLtd.11:10-11:35物聯(lián)網(wǎng)的低功耗設(shè)計(jì)挑戰(zhàn)LowPowerChallengesofIoT創(chuàng)意電子股份有限公司資深副總經(jīng)理，梁景哲CJLian,R&DSeniorVicePresident,GUC11:35-12:00嵌入晶心核，萬物皆聯(lián)網(wǎng)EmbeddingAndes,ConnectingEverything晶心科技股份有限公司部經(jīng)理，謝幼齡AmandaHsieh,DeputyManager,AndesTechnologyCorporation12:00-12:05幸運(yùn)抽獎(jiǎng)LuckyDraw12:05-13:00自助午餐BuffetLunch主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)副秘書長，王志華教授Moderator:Prof.WangZhihua,ViceGeneralSecretary,CSIA-ICCAD13:00-13:25M31物聯(lián)網(wǎng)硅智財(cái)解決方案Ultra-LowPowerIPSolutionsforIoT內(nèi)星科技副總經(jīng)理，石維強(qiáng)WillisShih,VicePresident,M31Technology13:25-13:50從IoT到網(wǎng)通應(yīng)用，智原經(jīng)驗(yàn)與方案，加速您的產(chǎn)品問世FromIoTtoNetworking,FaradayExperienceandSolutionsEnableYourFastTimetoMarket智原科技股份有限公司業(yè)務(wù)行銷副總經(jīng)理，于德洵RemiYu,VicepresidentofBusinessandMarketing,FaradayTechnologyCorporation13:50-14:15ImaginationIP助力下一波創(chuàng)新Newthinkingforthenextwaveofinnovation進(jìn)想科技（上海）有限公司中國銷售總監(jiān)，溫宵愷WalterWen,ChinaSalesDirector,ImaginationTechnologies14:15-14:30茶歇，交流CoffeeBreak

14:30-14:55在晶圓代工業(yè)內(nèi)領(lǐng)先的嵌入式閃存方案Leadingedgeembeddedflashsolutioninfoundryindustry常憶科技股份有限公司資深協(xié)理，林志光JKLin,SeniorDirecto,ChingisTechnologyCorporation14:55-15:20射頻模擬無源系統(tǒng)芯片化技術(shù) 一IPDChipLevelIntegratedPassiveSystemDesign-IPD蘇州芯禾電子科技有限公司創(chuàng)始人、工程副總裁，代文亮DaiWenliang,Founder&VPEngineering,XpeedicTechnology15:20-15:50物聯(lián)網(wǎng)時(shí)代系統(tǒng)芯片的設(shè)計(jì)需求DesignneedsofSoCinIoT無錫華大國奇科技有限公司總裁，谷建余JianyuGu,President,QualchipTechnologies,Inc.15:50-16:15智能互聯(lián)世界的IP解決方案IPsolutionsforconnectedsmartworld美國思華科技有限公司高級(jí)技術(shù)支持經(jīng)理，陳昊ChenHao,Sr.FAEManager,CEVA16:15-16:40低功耗小面積的16/32位處理器助力物聯(lián)網(wǎng)應(yīng)用ChoosingtheRightCPUCoreforIoTandWearableSensorNodes宏太科技股份有限公司業(yè)務(wù)經(jīng)理，黃孝衡Norman,SalesManager,AvantTechnologyInc.16:40-17:05PowerManagementinIoTKilopassTechnology市場(chǎng)戰(zhàn)略總監(jiān)，居禮LeeChu,VPofStrategicAccounts,KilopassTechnology17:05-17:10幸運(yùn)抽獎(jiǎng)LuckyDraw18:00-20:00閉幕招待晚宴ClosingReceptionBanquet地點(diǎn)：天津賽象酒店Site:TianjinSaixiangHotel2015年12月11日，星期五Dec11,Friday,2015專題論壇(三)SubjectForum(.)地點(diǎn)：天津梅江會(huì)展中心二樓 215會(huì)議室Venue:MeetingRoom215,2/F,TianjinMeijiangConvention&ExhibitionCenter5PCzVD7HxA

時(shí)間Time內(nèi)容Contents演講人LecturerFOUNDRY與工藝技術(shù)FoundryandManufacturingProcessTechnology主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)副秘書長，何曉寧先生Moderator:Mr.HeXiaoning,ViceGeneralSecretary,CSIA-ICCAD08:40-09:05TSMC先進(jìn)工藝技術(shù)方案TSMCAdvancedProcessTechnologySolutionTSMC中國業(yè)務(wù)發(fā)展客戶經(jīng)理， 林錦瑜SarahLin,AccountManager,BusinessDevelopment,TSMC09:05-09:30晶圓專工在物聯(lián)網(wǎng)上的特殊工藝平臺(tái)IoTDriveSpecialtyTechnology聯(lián)華電子股份有限公司中國銷售資深處長，林偉圣WSLin,SeniorDirector,ChinaSales,UMC09:30-09:55手機(jī)電源管理相關(guān)晶片最佳解決力殺HowtoPicktheBestSiliconTechnologyforYour"Mobile-to-Wall"PowerDesigns格羅方德半導(dǎo)體科技（上海）有限公司，MichaelSunMichaelSun,Sr.Director,Analog/PowerProductLineManagement,GLOBALFOUNDRIES09:55-10:20助力IC設(shè)計(jì)-中芯國際工藝技術(shù)分享EnablingYourDesignPossibility-SMICTechnologyIntroduction中芯國際集成電路制造有限公司先進(jìn)，幺及傳感市場(chǎng)總監(jiān)，吳耿源KYWu,DirectorofAdvancedTechnology&CVS3DApplicationMarketing,SMIC10:20-10:45華力微電子平臺(tái)技術(shù)及差異化特色上2技術(shù)HLMCPlatformTechnologyandDifferentiatedSpecialtyTechnology上海華力微電子有限公司研發(fā)一部總監(jiān)，邵華ChrisShao,SeniorDirector,TDDivision1,ShanghaiHuaLiMicroelectronicsCorporation10:45-11:10針對(duì)超低功耗應(yīng)用的 DeeplyDepletedChannel設(shè)備的性能設(shè)計(jì)CharacteristicDesignofDeeplyDepletedChannelDeviceforUltra-Low-PowerApplications二重富士通半導(dǎo)體股份有限公司工藝開發(fā)統(tǒng)括部A集成技術(shù)部部長，二澤信裕NobuhiroMisawa,DirectorofProcessIntegrationDepart-I,ProcessTechnologyDivision,MIEFujitsuSemiconductorLimited11:10-11:35深耕特色創(chuàng)新，助力物聯(lián)網(wǎng)智能硬件市場(chǎng)騰飛InnovationinSpecialtyTechnologiestoBoostIoTHardwareMarket上海華虹宏力半導(dǎo)體制造有限公司銷售與客戶支持副總裁，陳衛(wèi)TonyChen,VicePresidentofSalesandCustomerSupport,ShanghaiHuahongGraceSemiconductorManufacturingCorporation

11:35-12:00日本質(zhì)量服務(wù)中國市場(chǎng)一來自日本的3座純foundry工廠JapaneseQualityServesChinaMarket,fromthreefabswithpurefoundryserviceinJapanTowerJazz,同出直榭NaokiOkada,ManagerofDesignEnablementTeam,TowerJazz12:00-12:05幸運(yùn)抽獎(jiǎng)LuckyDraw12:05-13:00自助午餐BuffetLunch13:00-13:25物聯(lián)網(wǎng)產(chǎn)品設(shè)計(jì)所需要的啟動(dòng)組件DesignEnablementForIoTEra聯(lián)華電子股份有限公司市場(chǎng)行銷處長，莊學(xué)亮ChuangBill,DirectorCorporateMarketing,UMC13:25-13:50用傳感器技術(shù)打造更加美好的世界SharpingTheWorldWithAMSSenorsTechnology奧地利微電子市場(chǎng)部經(jīng)理，周之琦ZhouZhiqi,MarketingManager,AMSAG13:50-14:15MOSIS流片服務(wù)為中國集成電路創(chuàng)新事業(yè)推波助瀾MOSISTapeoutServiceCustomizedforICInnovationinChinaMOSIS專業(yè)流片服務(wù)機(jī)構(gòu)業(yè)務(wù)拓展經(jīng)理，袁泉YuanQuan,BusinessDevelopmentManager,TheMOSISService14:15-14:30茶歇，交流CoffeeBreakTSMC專場(chǎng)-智能物聯(lián)網(wǎng)的全方位工藝解決方案TSMCSession-CompleteProcessTechnologySolutionsforSmartloT主持人：TSMC中國業(yè)務(wù)發(fā)展資深經(jīng)理，韋浩先生Moderator:Mr.HarryWei,SeniorManager,BusinessDevelopment,TSMC14:30-14:45引言O(shè)peningIntroductionTSMC中國業(yè)務(wù)發(fā)展資深總監(jiān)，陳平博士Dr.PeterChen,SeniorDirector,BusinessDevelopment,TSMC14:45-15:15超高速工藝與應(yīng)用High-performanceTechnology&ApplicationsTSMC中國業(yè)務(wù)發(fā)展客戶經(jīng)理，孔玲YoyoKong,AccountManager,BusinessDevelopment,TSMC15:15-15:45TSMC超低功耗工藝與應(yīng)用TSMCApplicationDrivenUltra-lowPowerTechnologyTSMC中國業(yè)務(wù)發(fā)展技術(shù)經(jīng)理，郭婷TinaWu,TechnicalManager,BusinessDevelopment,TSMC15:45-16:15TSMC安全和聯(lián)接芯片專用工藝TSMCTechnologyforSecurityandConnectivityTSMC中國業(yè)務(wù)發(fā)展技術(shù)經(jīng)理, 何瑞靈RayHe,TechnicalManager,BusinessDevelopment,TSMC16:15-16:45設(shè)計(jì)環(huán)境和支持EcosystemforDesignEnablementTSMC中國業(yè)務(wù)發(fā)展技術(shù)經(jīng)理，卓銘MingZhuo,TechnicalManager,BusinessDevelopment,TSMC

16:45-17:00問答時(shí)間&抽獎(jiǎng)Q&AandLuckyDraw18:00-20:00閉幕招待晚宴ClosingReceptionBanquet地點(diǎn)：天津賽象酒店Site:TianjinSaixiangHotel2015年12月11日，星期五Dec11,Friday,2015專題論壇(四)SubjectForum(IV)地點(diǎn)：天津梅江會(huì)展中心二樓 216會(huì)議室Venue:MeetingRoom216,2/F,TianjinMeijiangConvention&ExhibitionCenterjLBHrnAILg時(shí)間Time內(nèi)容Contents演講人LecturerIC設(shè)計(jì)與封裝測(cè)試ICDesignandPackaging&Testing主持人：中國半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)計(jì)分會(huì)副秘書長，趙建忠先生Moderator:Mr.ZhaoJianzhong,ViceGeneralSecretary,CSIA-ICCAD08:40-09:05先進(jìn)MIS封裝技術(shù)AdvancedMISpackagingtechnology江蘇長電科技股份有限公司技術(shù)資深總監(jiān)，林煜斌YBLin,SeniorDirectorofTechnology,JCET09:05-09:30因應(yīng)新興應(yīng)用的高集成封裝方案HighIntegrationPackagingSolutionsforEmergingApplications南通富士通微電子股份有限公司技術(shù)中心主任，林仲瑯VictorLin,DirectorofTechnologyCenter,NantongFujitsuMicroelectronicsCo.,Ltd.09:30-09:55R&S先進(jìn)的IC測(cè)試方案，讓設(shè)計(jì)變得更簡單R&SAdvancedICTestSolution-MakingtheDesignMoreSimple羅德與施瓦茨(中國)科技有限公司業(yè)務(wù)發(fā)展主管，楊洪文YangHongwen,BusinessDevelopmentSupervisor,Rohde&Schwarz(China)TechnologyCo.,Ltd.09:55-10:20晶圓級(jí)先進(jìn)封裝技術(shù)及市場(chǎng)趨勢(shì)WaferLevelPackageTechnologyandMarkettrends寧波芯健半導(dǎo)體有限公司常務(wù)副總經(jīng)理，謝皆雷JerryXie,ExecutiveViceGeneralManager,NINGBOCHIPEXSEMICONDUCTORCO.,LTD

10:20-10:45物聯(lián)網(wǎng)與無線裝置的系統(tǒng)級(jí)封裝解決力殺SiPforConnectivity&IoT日月光集團(tuán)研發(fā)中心技術(shù)副處長，鄭民耀EddieCheng,DeputyDirector,CorporateR&D,ASEGroup10:45-11:10蘇州晶方半導(dǎo)體科技股份有限公司11:10-11:35物聯(lián)網(wǎng)測(cè)試的挑戰(zhàn)與方案IoTtestchallengesandsolutions愛德萬測(cè)試(中國)管理有限公司專家工程師，胡佳明HuJiaming,ExpertEngineer,Advantest(China)Co.,Ltd.11:35-12:00消費(fèi)電子的低成本封裝方案TheLowCostPackageSolutionforConsumerElectronics江陰長電先進(jìn)封裝有限公司市場(chǎng)業(yè)務(wù)經(jīng)理，繆志翰GeminiMiao,Sales&MarketingManager,JiangyinChangdianAdvancedPackagingCo.,LTD12:00-12:05幸運(yùn)抽獎(jiǎng)LuckyDraw12:05-13:00自助午餐BuffetLunch13:00-13:253DWLCSP市場(chǎng)與技術(shù)發(fā)展動(dòng)態(tài)華天科技(西安)有限公司技術(shù)總監(jiān)，于大全YuDaquan,TechnicalDirector,HuaTianTechnology(Xi'an)Co.,Ltd.13:25-13:50國產(chǎn)塑封料的現(xiàn)狀與未來PresentandFutureofDomesticEMC江蘇華海誠科新材料有限公司總經(jīng)理，韓江龍HanJianglong,CEO,JiangsuHHCKAdvancedMaterialsCo.,Ltd.13:50-14:15安靠sip?在物聯(lián)網(wǎng)中的應(yīng)用AmkorSiPtechnologyforIoTAmkor中華區(qū)市場(chǎng)部總監(jiān)，李呂祝JohnLee,Amkor14:15-14:30茶歇，交流CoffeeBreak資本與IC設(shè)計(jì)業(yè)CapitalandICDesignIn