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第頁(yè)首席代表英文簡(jiǎn)歷表格??樣也是在求職中的重要優(yōu)勢(shì)之一。人們求職的過程中也是競(jìng)爭(zhēng)的過程,在競(jìng)爭(zhēng)中必須要靠自身的實(shí)力優(yōu)勢(shì),才能取得競(jìng)爭(zhēng)的有利地位。相對(duì)來說,硬技能的優(yōu)勢(shì)要大于軟技能。
既然硬技能在求職者中所起到的作用如此大,那么在編寫個(gè)人簡(jiǎn)歷的時(shí)候要如何來寫呢?首先要注意的是哪些技能屬于硬技能,諸如計(jì)算機(jī)技能、英語(yǔ)能力這種就是典型硬技能。其次,就是技能與求職職位的相符合性。
Name:Hukou:
Residency:ShanghaiWorkExperience:
CurrentSalary:
Tel:
E-mail:CareerObjectiveDesiredIndustry:Electronics/Semiconductor/IC,Science/Research,Government,Others,Testing,CertificationDesiredPosition:SeniorHardwareEngineer,SemiconductorTechnology,BranchOfficeManager,ChiefRepresentative,ResearchSpecialistStaffDesiredaddress:Shanghai,Hongkong,Beijing,Taiwan,MacaoDesiredSalary:NegotiableWorkExperience2006/06—Present***Company
Industry:Electronics/Semiconductor/ICIntelFlashEngineeringDepartmentIndividualContributorResponsibilities:IhavebeenworkinginIntelFlashAssembly&TestEngineeringDepartmentasanIndividualContributorsinceJuneof2006.BeingLeaderofATEYieldteam,Ihavebeenworkingwiththeteammemberstoimprovetheproductsyield.Oureffortsarepaidoff:1.
Theyieldofyear2006hasbeendramaticallyincreasedthanthatofyear2005.2.
Theyieldofallproducts,consecutivelymeetsthegoal.3.
Thetotalamountofcostsavingduetoyieldimprovementismorethan$1millioncomparedwithyear2005.BeingtheLeaderofBoardRepairTeaminATE,Iworkedwithmyteammembers,setupasetofnewproceduretoreplacethecurrentone,Idefinedtheschedule,dividedtheroles&responsibilitiesamongteammembers,followuptheprogress.Finally,theteamhasmadeagreatcostsavingof$2.5Min2007.ReportDirectlyto:DepartmentManagerNumberofSubordinate:14Reference:BaoPowelAchievements:BeingLeaderofATEYieldteam,Ihavebeenworkingwiththeteammemberstoimprovetheproductsyield.Oureffortsarepaidoff:1.
Theyieldofyear2006hasbeendramaticallyincreasedthanthatofyear2005.2.
Theyieldofallproducts,consecutivelymeetsthegoal.3.
Thetotalamountofcostsavingduetoyieldimprovementismorethan$1millioncomparedwithyear2005.BeingtheLeaderofBoardRepairTeaminATE,Iworkedwithmyteammembers,setupasetofnewproceduretoreplacethecurrentone,Idefinedtheschedule,dividedtheroles&responsibilitiesamongteammembers,followuptheprogress.Finally,theteamhasmadeagreatcostsavingof$2.5Min2007.2006/01—2006/05Intel(Shanghai)TechnologyDevelopmentLtd.Company
Industry:Electronics/Semiconductor/ICIntelSTTD-ChinaDepartmentElectronicsDevelopmentEngineerResponsibilities:1.
IhadbeenworkinginSTTD-ChinasinceJan2006toMay2006asaseniormoduleengineer.2.
Atthattime,asamaincontributorofthisproject,wesucceededindevelopingasetofMASSIVELYPARALLELCLASSTESTequipment,whichisabletotestmorethan6700unitsinonetime.ReportDirectlyto:HopmanMark
NumberofSubordinate:14Reference:BaoPowelReasonforLeaving:IwastransferredtoIntel(Shanghai)ProductsLtd.Companyduetotheinternalre-organizationinJuneof2006.Achievements:AsamaincontributorofSTTD-Chinadepartment,Ico-workwithmycolleaguestosucceedindevelopingasetofMASSIVELYPARALLELCLASSTESTequipment,whichisabletotestmorethan6700unitsinonecycle.2005/05—2006/01NanyangUniversityofScience&Technology
Industry:Electronics/Semiconductor/ICElectronics&ElectricalEngineeringDepartmentResearchFellowResponsibilities:1.
IworkinElectronics&ElectricalEngineeringDepartmentofNanyangUniversityofScience&TechnologyasaResearchFellow.2.
ImajoredatGateOxideReliabilityResearchintheduration.ReportDirectlyto:ProfessorPeyKinLeoh
Subordinate:3Reference:PatrickLowReasonforLeaving:IcompletedtheprojectwhichIundertookbymyself,andwanttodomorechallengingjob.Achievements:Inlessthanoneyear,Imadealotofexperimentsandacquiredthewonderfuldatafortheprojectbymyself.ProjectExperience2023/01—PresentAssemblyNPI(NewProductIntroduction)
ProjectDescription:TointroducemoreproductsintoIntelFlashAssemblyfactory,IjoinAssemblyNPIteamandworkastheteamleader.IcoordinatewithIE,Planner,MarketingguyandEngineertoselectnewproductitems,dodemoinfactory,andthenqualifyit.Responsibility:IamworkingasNPITeamleaderandcoordinateallteammembers,definetheNPIcandidate,makeAssemblybuildplan,followuptheprogress.2007/01—2007/12MarginalElectricalBoardsRescue
ProjectDescription:Torescuesomeelectricalboardsoftestingequipment,aTaskForceteamwasbuiltupandledbyme.Wecategorizedeachkindofboard,madehistoricalfailureanalysisoneachkindofboardandaround&2.5milliondollarswassavedfinally.Responsibility:Beingtheteamleader,Itookthejobofdataanalysis,defineeachmember'srole,makeprogramplan,coordinateeachteammemberandfollowuptheprogress.2006/10—2007/05OptimizationthecurrentTestProcessOrderforFlashMemory
ProjectDescription:TosimplifythecurrentTestprocedureandenhancetheworkingefficiency,aTaskForceteamhasbeencalledandstartedbyme.Responsibility:BeingtheProjectleader,Itakethemainresponsibility,suchas,design,plan,organizeandimplement.2006/05—2006/12TestYieldofFlashmemoryImprovement
ProjectDescription:Toimprovethetestyieldofdifferentproducts,aTaskForceteamwasbuiltupandledbyme.Beingtheteamleader,Iworkedwithallteammemberstodigoutthefailurerootcauseforeachproduct,definedactiontakenplanforeachemergencycase,coordinatedeachteammemberandmakepro-activeplantoavoidedunexpectedthingshappen.Responsibility:BeingtheteamleaderofImprovingTestYield,coordinateeachteammember,makeprogramplanandfollowup.EducationandTraining2005/05—2006/01NanyangUniversityofScience&TechnologyMicroelectronicsDoctorate
IworkedinNanyangUniversityofScience&TechnologyasaResearchFellow.ImajoratGateoxideReliabilityresearchintheduration.2004/03—2005/03SeoulNationalUniversityofKoreaMicroelectronicsOthers
IhadbeenworkinginNationalPhysicalLabofSeoulNationalUniversityinKoreasinceMarchof2004toMarchof2005asaPost-doctor.WhereIunhooktheprojectofresearch&developmentofCarbon-NantubeBiosensor.Andonlyafteroneyear,anEISsensorbasedonCMOStechnologyhasbeensuccessfullyproduced.AndoneSCIpaperaboutithasbeenpublishedinSemiconductorScienceandTechnology.2001/03—2004/03ShanghaiInstituteofMicrosystems
andInformationTechnology,ChineseAcademyofSciencesInformation
TechnologyDoctorate11018/09—2001/03NanjingUniversityofScience&TechnologyMaterialScienceandEngineeringMaster
Beingamasterstu
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