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Thermal-awareSEBMethodologyforFinfetdesignEM
signoffStatisticalEMBudgeting(SEB)
Introduction2?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017HistoricallydesignershavecomparedinterconnectDCaveragecurrenttoaconservativefixedlimitas,S=Jdesign/
JmaxSoifS<=1,the“design”isreliable,whileanyinterconnectwithS>1needstoberedesigned.Fromtheprocessreliabilityperspective,EMdegradationisinherentlystatistical.Thereisalwaysobservedawidedispersioninthetimesobservedforidenticallysizedandstressedsegmentsofinterconnecttoprogressto
failure.Whenreliabilitydesignisdesignedtomean“achievingachip-levelreliabilitygoal,fixedcurrentdensitydesignlimitsbecomemathematicallyarbitrary.Onlythetotalstatisticalrisktothechipisthemeaningful.TheniftheEMreliabilityimpactofeachsegmentofinterconnectateachstresslevelcanbeaccountedfor,thechip-levelEMreliabilitygoalcanbebudgetedamongclassesofinterconnectorchipdesignsubdivisionstominimizetheperformance
limitations.SEB
MethodologyStatisticalEMBudgeting(SEB)isadesign-specificEMreliabilityevaluationmethodwhichcombinesdesigninputswithEMperformanceforeachinterconnectwiretocomputeatotalfailureratefortheproduct.A“pass”isascertainedifthedesignstaywithinthefailure
budget.SEBgivesthedesignerssomeflexibilityindesignwithoutimposingahardEMlimitforthewholeproduct,thusenablinghigherperformancewithoutcompromising
reliability.3?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017FailureinTime(FIT)Calculation
perWireLT=lifetimeeg5or10
years.
=stdnormalcumulativedistribution
probabilitySdc=severityratioofIdc,
I/Imax:I->from
design,Imax->definedindesignrule
manual.n=currentdensityexponent(from
foundry)MTF=mediantimeto
failureMTF(Tfit)=MTF(Tamb)*exp(Ea/Kb*(1/(Tfit+273)-1/(Tamb+273)))Tamb=AmbientTemperature;Tfit=Tamb+?Tfrom
self-heating
=sigma,spreadinlifetimedistribution(from
foundry)FITi
=(-10)9*
ln 1-
ln(SDCn
*(LT/MTF))LT
4?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017Why
SEB5?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017q EMchallengeonadvancedFinFet
processq EMissignificantlyimpactonFEOLthermalcouplingand
self-heatingq Verydifficulttosign-offEMduetoEMlimitdegraded
significantly.q Life
Timeq EMspecdefinitioninDRMarebasedon10Ylifetime.Howabout5Ylife
time?q Realapplication:5%xLifetime125c+95%xLifetime
85cq Fromonenettoa
designq IfeverynetsatisfyEMspec,thedesignhavehighreliability?
NO!For
example:Condition:TSMCN10,10Ylife
timeSdc(I/Imax)=0.8,failrate=0.15%(1500PPM).IftherearemanynetswithSdcmorethan0.8,thetotalfailrateismore
high.Usually,SOCfailrate<
0.1%FIT
calculationStatistical EM Budgetingevaluation method whichis a design-specific EM reliabilitycombines design inputs with EMperformanceforeachinterconnectwiretocomputeatotalfailureratefortheproduct.A“pass”isascertainedifthedesignstaywithinthefailure
budget.FITtotal∑i∑j∑
kFIT(i,j,k)Sub-divisions6?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017classeswiresThermal-AwareSEB
FlowRedHawkTotemTechfile/LIB
/Dev
ModelsLEF/DEF/GDSDSPFw/Signal
RCFoundrySH
InputP/GwireIrms
infoSignalwireIrms
infoSelf-heatcalculationincludingthermalcouplingWireSelf-heat
ReportInstSelf-heat
ReportThermalProfile
/Back-annotationPowerEM
RunSignalEM
RunPre-ThermalThermalFITComputation
EngineFIT
reportFIT
MapFIT
calculation7?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017Self-heatingimpacton
EMEM@105w/oSH150010005000>100 >110 >120 >130 >140 >150 >160 >170 >180 >1908?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017EM@105w/
SH150010005000>100 >110 >120 >130 >140 >150 >160 >170 >180 >190@105Cw/o
Self-heating@105w/
Self-heatingNumberofEM
violations25812664MaxEM
violation168%197%Total
FIT23416Self-heatingResult:instancedelta
TThemaxdeltaTis
11.8C9?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017InstanceDeltaT
MapWireTemperature:Maxtemperature
116.5CWireTemperatureMap:
M110?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017FIT
correlation11?2017ANSYS,
Inc.July31,
2017ANSYSUGM
2017EMsign-offbythermal-aware
SEBDesignershouldfix2664EMviolationsbytraditionalEM
sign-offmethod.
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