FPC制程簡(jiǎn)介課件

FPC製程簡(jiǎn)介1.ProductIntroduction2.FPC產(chǎn)品系列應(yīng)用介紹1.1NOTEBOOK1.2LCDPANEL1.3PDA1.4CELLULARPHONE3.原材料介紹2.1銅箔2.2Coverlay2.3Stiffener2.4Adhesive2.5相關(guān)測(cè)試規(guī)範(fàn)4.FPC標(biāo)準(zhǔn)製造作業(yè)流程介紹3.1單面板/雙面板3.2單面板雙層作法3.3浮雕線路3.4多層線路目錄ProductIntroduction

Advantage體積小

SmallSize重量輕

LightWeight可折疊做3D立體安裝

Flex-for-Installation可做動(dòng)態(tài)撓屈

DynamicFlexibility

ApplicationNote-BookDigitalCameraDVD/CD-ROMHDDPrinterScannerPDACellularPhoneLCDAuto-MobileApplicationForNootbookHingeCableDouble-sidedFPCImpedance50

5

60,000CyclesFlexureLifeEMIStrategyApplicationHingeCableDouble-sidedFPCImpedance50

5

60,000CyclesFlexureLifeCardbusDouble-sidedFPC100MHzTransferSpeedTouchPadDouble-sidedFPCSMTMountingApplicationForNootbook–CD/DVDROMDouble-sidedFPCStandardIDEInterfaceGroundingStrategyApplicationSingle-sidedFPCSpindleControlUnitSwitch&PhotoSensorAppliedonFPCSingle-sidedFPC60,000CyclesFlexureLifeUltraThinMaterialDesignApplicationForLcdPanelLCMCableDouble-sidedFPCSMCMountingEMINoiseDepressionLCMCableDouble-sidedFPCSMCMountingACFLaminatingonFPCLCMCableDouble-sidedFPCFinePattern(L/S=1.6/1.8mil)ACFLaminatingonFPCHDDCableDouble-sidedFPCApplicationForPDASwitchBoardDouble-sidedFPCSMTMountingBatteryBoardSingle-sidedFPCSMCMountingHighCurrent-carriyngCapacityApplicationForCELLULARPHONEDouble-sidedFPC100,000CyclesFlexureLifeACFLaminatingonFPCDouble-sidedFPCBatteryRawMaterial-CCL相關(guān)名詞:CopperCladLaminates(銅薄基材)Single-Sided(單面銅薄基材)Double-Sided(雙面銅薄基材)CopperFoil:銅箔，銅皮

RA銅:壓延銅箔,輾壓方式。ED銅:電解銅箔,電鍍方式(Electrodeposited)

。Polyimide(PI)聚亞醯胺:是一種由Bismaleimide與AromaticDiamine所共同聚合而成的優(yōu)良樹(shù)脂,杜邦公司將之做成片材，稱為Katpon。AdhesiveConductorDielectricSubstrateAdhesiveConductorDielectricSubstrateDielectricSubstrateAdhesiveMylarAdhesiveKaptonRawMaterial-CVL用途:1.補(bǔ)強(qiáng)軟板

2.提供零件所需承載強(qiáng)度3.補(bǔ)償軟板厚度材質(zhì)區(qū)分:PI/PET/FR4/SUS…結(jié)合方式:

PSA:感壓型

ThermalSet:熱固型

ThermalPlastic:熱塑型RawMaterial-STIFFENERFR4PETPISUSRawMaterial-Adhesive3M4673M9460tesa60980SonyT4000用途:便軟板粘著在其他物件上，類似於雙面膠吉盛3702ManufacturingProcessCoverlayAdhesiveCopperAdhesiveBaseFilmAdhesiveCopperAdhesiveCoverlay鑽孔NCDrilling雙面板DoubleSided黑孔&鍍銅BlackHole&CuPlatingCVL壓合CVLLamination沖孔HolePunching沖型Blanking電測(cè)/目檢Elec.-test&VisualInspection表面黏著/組裝SMT&Assembly壓膜/曝光D/FLamination&Exposure顯影/蝕刻/去膜D.E.S.單面板SingleSided自動(dòng)光學(xué)檢測(cè)AutomaticOpticalInspection假貼合CVLLayup錫鉛電鍍/噴鍚Sn/PbPlatingorHAL電測(cè)/目檢Elec.-test&VisualInspection印刷ScreenPrinting浮雕線路製造流程1.純銅箔下料3.純銅貼下CVL4.壓合,烘烤5.微蝕6.壓乾膜7.曝光2.純銅箔鑽孔(貼CVL對(duì)位孔)亮面棕化面上下開(kāi)燈膠溢流在機(jī)臺(tái)上,轉(zhuǎn)印到下依片製品的銅面上造成殘膠,鍍不上錫.使用TPX防止轉(zhuǎn)印以進(jìn)入紙面方向進(jìn)行壓乾膜製程.8.DES9.上Coverlay10.壓合烘烤12.鍍錫鉛13.沖型懸浮端1.設(shè)計(jì)上非懸