GB/T 44375-2024300 mm半導(dǎo)體設(shè)備裝載端口要求

ICS

31.260

CCS

L97

中華人民共和國國家標(biāo)準(zhǔn)

GB/T44375—2024

300mm半導(dǎo)體設(shè)備裝載端口要求

Requirementsforloadportsof300mmsemiconductorequipment

2024-08-23發(fā)布2025-03-01實施

國家市場監(jiān)督管理總局發(fā)布

國家標(biāo)準(zhǔn)化管理委員會

GB/T44375—2024

目次

前言

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Ⅲ

1

范圍

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1

2

規(guī)范性引用文件

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3

術(shù)語和定義

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4

要求

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2

4.1

接口尺寸要求

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2

4.2

裝載端口配置選項

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4

4.3

裝載端口排序規(guī)則

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4.4

晶圓承載器裝載/卸載尺寸要求

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4.5

感應(yīng)地面搬運系統(tǒng)的光電傳感器安裝位置尺寸要求

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6

4.6

ID讀取器專屬空間尺寸要求

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4.7

晶圓承載器取放機構(gòu)專屬空間尺寸要求

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9

Ⅰ

GB/T44375—2024

前言

本文件按照GB/T1.1—2020《標(biāo)準(zhǔn)化工作導(dǎo)則第1部分：標(biāo)準(zhǔn)化文件的結(jié)構(gòu)和起草規(guī)則》的規(guī)

定起草。

請注意本文件的某些內(nèi)容可能涉及專利。本文件的發(fā)布機構(gòu)不承擔(dān)識別專利的責(zé)任。

本文件由全國半導(dǎo)體設(shè)備和材料標(biāo)準(zhǔn)化技術(shù)委員會（SAC/TC203）提出并歸口。

本文件起草單位：上海微電子裝備（集團）股份有限公司、中國電子技術(shù)標(biāo)準(zhǔn)化研究院、北京北方

華創(chuàng)微電子裝備有限公司、中微半導(dǎo)體設(shè)備(上海)股份有限公司、漳州市太龍照明工程有限公司、深圳

市埃芯半導(dǎo)體科技有限公司、蘇州鎂伽科技有限公司、中電鵬程智能裝備有限公司。

本文件主要起草人：胡松立、李運鋒、吳怡然、曹可慰、趙俊莎、周曉鋒、李殿浦、武小娟、

朱明、李英、張寶帥、洪峰、張志勇、喬志新、王鳴昕。

Ⅲ

GB/T44375—2024

300mm半導(dǎo)體設(shè)備裝載端口要求

1范圍

本文件規(guī)定了300mm晶圓半導(dǎo)體設(shè)備裝載端口的尺寸要求，主要包括半導(dǎo)體設(shè)備與產(chǎn)線之間的物

理接口。

本文件適用于半導(dǎo)體設(shè)備設(shè)計與制造領(lǐng)域。

2規(guī)范性引用文件

本文件沒有規(guī)范性引用文件。

3術(shù)語和定義

下列術(shù)語和定義適用于本文件。

3.1

片架cassette

承載一個或多個晶圓的開放式結(jié)構(gòu)。

3.2

裝載面loadfaceplane

在設(shè)備上用于執(zhí)行裝載的一側(cè)（或多側(cè)），距離片架質(zhì)心或晶圓承載器質(zhì)心直線距離最遠的物理垂

直平面。

3.3

裝載端口loadport

設(shè)備上傳輸晶圓承載器的接口位置。

3.4

傾斜度tilt

為了保持晶圓排列整齊或防止滑出，在片架或晶圓承載器的標(biāo)準(zhǔn)水平或垂直方向上，設(shè)計的角度

偏移。

注：標(biāo)準(zhǔn)水平方向是指垂直于裝載面的方向。

3.5

晶圓承載器wafercarrier

存放晶