PB印制電路板PB工程問(wèn)客

PB印制電路 CommonBoardLay-Mismatchbetweenthelay-upboardRelaxboardthicknessCarbonCuthickness&AddCuclearanceforNPTHorconsider2nd-AdddummyCopperclosetoboardCopperextendingtounitDeleteNPTHDistancebetweentwopadslessthanIsolatedfiducialNospacetoenlargepadstoensure2milannualPadsizeistooPTHholewithellipticRelaxCuthicknessonouterRelaxCuthicknessonouterLabelinDWGisNoDWGwithUnitDWGsizeisCommonE/TOurX-GoldDeletesoldermaskbridgebetweengoldRelaxtoleranceforbevelRelaxbevelingangleordisregardtheremainingSpacebetweengoldfingeredgeandoutlineistooSpacebetweentestpadandthetopofgoldfingeristooBlind/buriedBreakawayholeispartiallyoncopperChangeoverlappedholeasDrillingpositionalRelaxtoleranceforRelaxtoleranceforRepeatedRoutingRectangularCalculatedvaluetrendstotheMatchReferenceWhichtraceshouldbeInnerRightOutlineConnectiontabfarawayfromunitMismatchbetweenCAD/CAMdataandMissNarrowconnectionareabetweenbreakawayNotoolingRelaxtoleranceforoutlineUnevenUselessAddPeelablesolderPeelablesoldermaskcoveredPeelablesoldermaskpluggedRelaxthicknessforpeelablesolderWithoutthedetaildimensionofpeelablesolderMarkinginholeorMarkinginlargesolderLegendonstepRelaxtolerancefornon-platedRelaxtoleranceforplatedSolderAddS/MBridgeforChangeS/MpluggedholetocoveredHolesizeistoolargetoHolesizeistoosmalltoRelaxsoldermaskS/McovergoldSoldermaskSpacingistoonarrowtoaddS/MSolderRelaxsolderWithoutTABononerowofunitsattheTgvalueisnotspecifiedforHighTgConnectionbetweenCugroundsistooExposedtracefromsoldermaskRelaxetchingSelf-SpacingbetweentwotracesistooTransferSampleV-DiscontinuousV-RelaxV-CutremainthicknessRelaxV-CutgrooveangleV-CutremainthicknessistooV-CutrunacrossRelax銅厚&NPTHCu加dummy刪除NPTHPAD獨(dú)??FiducialPAD2milPadPADPTH常規(guī)E/T公司PADNPTHPTHTABCAD/CAMDWGPeelablesolderSMT單元間無(wú)TgTgCugroundV-跳V-V-CutV-CutV-CutV-CutBoardLay-InDWG,customermentionedlayerorderonly,butdidn'tindicatethedielectricthicknessbetweenlayersandCopperthickness.So,wesuggestyoufollowthelay-upshownonattachedfileXX.Pleaseconfirm.Mismatchbetweenthelay-upandboardAccordingtothelay-upspecifiedbycustomer,theoverallboardthicknesswillbeXXXmil,notthecustomernominalrequirementofYYYmil.So,wesuggest:Tofollowthelay-upspecifiedbycustomerandchangetheoverallboardthicknesstoYYYmil+/-10%,ORTomodifythelay-upasshownonattachedfileandcontroltheoverallboardthicknesstobeXXXmilpercustomerPleaseclarifywhichitem(AorB)customerCustomerrequiredcontrollingthefinishedboardthicknesstobeXX%,however,thestandardtoleranceforboardthickness+/-10%.Wecanachievetightertolerancebyorderingnon-standardmaterials,however,itwilltakealonglead-timeandahighpricetopurchasethisspecialmaterial.So,wesuggestyourelaxthetolerancefromXX%to+/-10%.Pleaseconfirm.CarbonAccordingtomasterA/W,carboninkwillbeprintedoncontactfinger.Whilethecarbon/carbonisolationspacingistoonarrow: MasterOur Carbon YCufinger UCarbon/Cu ZCarbon +/-X+/-Inordertofacilitateinproduction,wesuggestyoumodifymasterA/Wasbelow: on Change XmilYmilUmilZ

PleaseCuthickness&Thenon-platedholelocatedingroundplane(ORalargepad:DIAXXX),inordertofacilitateinproduction,wesuggestweshaveCuandadda10milclearancearoundnon-platedholes.PleaseAdddummyAsthedistributionofCupatternisveryunevenonouterlayers,inordertobalanceplatingandimprovequality,wesuggestyouaddsomedummypatterninblankarea.Thedummyshapeandsizeseeattachedfile.Pleaseconfirm. 15mil(10mil)fromtheoutline.Thispresentstheriskofcopperatboardedges.Wesuggestweshavecoppertogetsufficientspacing.Pleaseconfirm.Insomelocations,copperhasextendedtounitedge.IfwefollowmasterA/Wtobuild,copperwillbeexposedatunitedge.So,wesuggestweshavecoppertogetsufficientspacing.PleaseDeleteNPTHForsomenon-platedholes(DIA:XX),theirpadsize(DIA:XXX)islargerthanholesize.Inordertofacilitateinproduction,wesuggestyoudeletethesepads.PleaseconfirmOncomponentside/solderside,thespacingbetweentwopadsistoonarrow(Xmilonly).AsthetwopadshavebeenconnectedtogetherininnerlayerYY.Inordertofacilitateinproduction,wesuggestweshavethepadsandkeep5milspacing.PleaseIsolatedfiducialTheisolatedfiducialmarksareeasytobepeeledoffduringthehotairleveling.Inordertoavoidthisproblem,wewouldsuggestyouaddacircularcopperringaroundthefiducialmarkundersoldermask.Toensure2milannualring,weneedenlargethepadsto35mil(min).Butaccordingtomasterfilm,thereisnoenoughspacingtoenlargethesepads,sowesuggesttotryourbesttoenlargethem,andensure2milannualringatthejointoftraceandpad.Bydoingthis,theremaybeholebreakoutinotherarea,pleasesuggestcustomertoaccept.PadsizeistooAccordingtomasterA/W,theviaholepadistoosmall(holesize:MMM,padsize:NNN).Asthereisn'tenoughspacingforustoaddthesepads.InordertoselectasmallerdrillwesuggestyouchangethetoleranceofviaholefromXXXX+/-3miltoXXXX+0/-6mil.Pleaseconfirm.PTHholewithellipticPermasterartwork,wefoundsomePTHholes(DIA:XXXmil)withellipticpad(padsize:MMXNNmil)(seeattachedfile).Astheellipticpadwastoosmall,thusitwasineluctablethatholewillbebrokenonshortsideifwefollowmasterartworktoproceed.Wesuggesttoenlargethepadsuitablytoguaranteea2mil(min)annularringontheconjointarea,pleaseconfirm.RelaxCuthicknessonholeCustomerrequiredplatingathickcopperofXXXmilonplatedholewall;however,thestandardforholewallcopperplatingthicknessis1.0milminimum.Thickercopperplatingcanoverplatesurfacefeatures,dependingonthecircuitrydistributionandcreateyieldproblems.Inordertofacilitateinproduction,wesuggestyourelaxyourminimumtothespecificationabovefromXXXmil(min).Pleaseconfirm.RelaxCuthicknessonouterCustomerrequiredusingXozcopperfoilforouterlayerandplatedtoYYmilfinish.Becausecircuitdistributionwillsignificantlyaffectouterlayerconductorcopperthickness,itisdifficulttoguaranteethicknessgreaterthan1.4milfor1/2ozfoil,and2.1milfor1ozfoil.Inordertofacilitateinproduction,wesuggestyourelaxtheoverallcopperthicknesstobeZZmil.Pleaseconfirm.OnthepanelDWG,therewasonedimensionXXX,whichwedidn'tknowwhatitindicated,pleasecustomertoclarifyit,orwesuggesttoignoreit,pleaseconfirming.NoDWGwithAftermeasuringout-lineoftheDrillDWG,wesuggestadraftDWGwithdimensionasattachedfileXshown.PleaseUnitDWGsizeisBecauseoftheunitDWGsizeistoosmall(MMMxNNN),inordertofacilitateinourproduction,wedesignapanelDWG(seeattachedfile),pleaseconfirm.Iftheaboveisaccepted,howmanyscrapunits(XXup/perpanel)couldbeaccept,pleaseconfirm.InordertodistinguishX-outboardwithgoodboard,wewilldrawablackcrossonX-outboard,andwewillpacktheX-outboardseparately,pleasetakeCommonSomecommoncriteriawerenotspecified.WesuggestyoufollowIPC-6012ACLASS2andourdefaultconditions:Surfacefinish:HAL/ImmersionAnnularring:2milSoldermaskcolor:Legendcolor:WhiteSolderOnCuGroundArea:40u'(min)(30u'(min)forOnSMTPad;100u'(min)(80u'(min)fornewEtchingtolerance:+/-Outlinetolerance:+/-InnerRadius:R63milTheCuthicknessofholewall:TheAuthickness:15u'(min)TheNithickness:80u'(min)Warpandtwist:ToleranceofholeForVia(Dia:12mil):+0/-6milForPTH(exceptVia):+/-3milForNPTH:+/-2milSlotPlatedslot:width:+/-4.5milXlength:+/-5.5mil(width:+/-3milXlength:+/-4milfortightertolerance)Non-platedslot:width:+/-3milXlength:+/-4mil(width:+/-2milXlength:+/-3milfortightertolerance)ForblindorburiedTheCuthicknessofholewall:0.5mil(min)perAnnularring:2mil(min)atconnectionarea,90-breakoutatrestInordertostrengthentheconnectionbetweenholetopad,wesuggestyouaddteardropforallblind/buriedholeatconnectionarea.Pleaseconfirm.E/TInordertoshowtheboardhaspassedE-Test,wewillplaceawhite/black“T”stampwithoutS/Mopeningsolder/componentPlease3.Our solder/componentside. Pleaseconfirm.4.X-Couldonescrapunitperpanel(2-UPperpanel)beaccepted,pleaseconfirm.Howmanyscrapunitsperpanel(X-UPperpanel)beaccepted,pleaseconfirm.InordertodistinguishX-outboardwithgoodboard,wewilldrawablackcrossonX-outboard,andwewillpacktheX-outboardseparately,pleasetakenote.GoldTherehassoldermaskbridgebetweengoldfingers(seeattachedfile1),inordertoimprovegoldfingerquality,grindingcoppersurfaceofgoldfingerisrequiredbeforeplatedgoldfingerprocess.Sothesmallrubbishofsoldermaskwouldbecreatedongoldfinger'scoppersurface,whichwillaffectgoldfingerquality.Inordertoavoidthisproblem,wesuggesttodeletesoldermaskbridgebetweengoldfingers,togetfullsoldermaskopeningforgoldfinger.Pleaseconfirm.RelaxtoleranceforbevelInUNITDWG,thebevelsizeisXXXmil,however,thetoleranceofbevelheightistootight.Thestandardtoleranceforbevelsizeis+/-5milfor30/40degreecutter(+/-8milfora20degreecutter).Tightertolerancecanbeachievedwithspecialprocessing.BevelsizeiseasilyaffectedbytheboardInordertofacilitateinproduction,wesuggestyourelaxyourtolerancetothestandardsabove.Pleaseconfirm. Accordingtocustomer'sDWG,thebevelingdimensionwasrequiredasbelowsketched:Angle:XXdegree;Height:YYRemainingthickness:ZZForangle+/-Xdegree,however,tightertolerancecanbeachievedwithspecialprocess.Inordertofacilitatetheproductionandimproveefficiency,wesuggesttorelaxto+/-3degree.Pleaseconfirm.Fortheremainingthickness.Ingeneral,thebevelingheightwasadjustableandcontrolledinproduction,whiletheremainingthicknesswasareferenceinthebevelingprocess.Wesuggesttoonlycontrolthebevelingheightanddisregardtheremainingthickness.Pleaseconfirm. TheminimumspacewasonlyXmilbetweenthegoldfingeredgeandoutline(seeattachedfile).Becauseofregisteredtolerance,afterfinished,thecoppermaybeexposedattheedgeofkey-slot.Inordertoavoidthisquestion,wesuggesttoshavesuitablecopperandassuringthespacetoourstandardspace:8mil(min)(seeattachedfile).PleaseconfirmSpacebetweentestpadandthetopoffingeristooThespacebetweentestpadandthetopofgoldfingeriscloserthan30mil(onlyXXmil)(seeattachedfileM)onbottomItisnecessarytocovergoldfingerwithhightemperaturetapeduringHALprocess,andthisoperationisperformedbyhand,Werequireda30milspacingasdeviationareatoavoidthatthesepadswithsoldermaskopeningwerecoveredwiththetape.So,wesuggesttoshiftdownsoldermaskopening10mil(max)(seeattachedfileN).Pleaseconfirm.Blind/buriedIsthisblindholedesignforyourcomponentbondingpurpose?Sothatcopperplatingisrequiredontheseblindholesurfaces.Pleasespecifyandconfirm.BreakawayholeispartiallyoncopperPerthebreakawaydetail,thebreakawayholewouldbelocatedpartiallyonthecopperplanesofalllayers.Wesuggesttocreateasuitableclearance(about0.50mmlargerthantheholesize).Pleaseconfirm.ChangeoverlappedholeasOndrillfile,threeholes(PTH/NPTH,DIA:VVV)areoverlappedeachother,thedistancebetweentwoholesisXXXmil.Inordertofacilitateinproduction,wesuggestyouchangethemasaslot.Pleaseconfirm.DrillingpositionalCustomerrequiredcontrollingthedrillpositionaltolerancetobe+/-Xmil,however,thestandardtolerancefordrillpositionalaccuracyis+/-3mil.Tightertolerancecanbeachievedwithspecialprocessing.Inordertofacilitateinproduction,wesuggestyourelaxthetolerancefrom+/-Xmil+/-3mil.PleaseRelaxtoleranceforCustomerrequiredcontrollingthetoleranceof+/-Xmilfornon-platedholeofDIAXXX;however,thestandardtoleranceforPTHdiameteris+/-2mil.Tightertolerancecanbeachievedwithspecialprocessing.Inordertofacilitateinproduction,wesuggestyourelaxthetolerancefrom+/-Xmilto+/-2mil.PleaseRelaxtoleranceforCustomerrequiredcontrollingthetoleranceof+/-XmilforplatedholeofDIAXXX;however,thestandardtoleranceforPTHdiameteris+/-3mil.Thisallowsforvariationscausedbycircuitrydistributionandprocessing.Inordertofacilitateproduction,wesuggestyourelaxthetolerancefrom+/-Xmil+/-3mil.PleaseRepeatedOnCAD/CAMdata,wefoundsomeholesoverlappedeachother.Thedistancebetweenholeis1-5mil.Wesuggestyouremoveoneoftwo.Pleaseconfirm.Accordingly,theholequantityofDIA:XXXwillbechangedtobeVVV.Pleaseconfirm.RoutingAstheholesize(NPTH,DIA:XXX)istoolarge,wewillhavetobuildthembyrouting,accordingly,wesuggestyourelaxtheirtolerancefrom+/-Xmilto+/-5mil.Pleaseconfirm.PerthedrillDWG,therearesomeDIA:XXmilplatedholes,whichlocateattherectangularholeofYYmmxZZmm(SeeattachedfileX).Fromtheadditionalsheetofrectangularholesartwork,whichincludestheserectangularholes,wefoundtherectangularholesinthisartworkwerenotcenteredwiththeplatedholesandthecorrespondingpad(SeeattachedfileY).Wesuggesttobuildtherectangularholes/slotswithreferencetotheplatedholeasthecenterofslot.Pleaseconfirm.Pertheshapeofrectangularholes,therewasaFULLRincludedattheendofeachrectangularhole,thatmeanstheslotsizeas3mmx0.6mmrectangularholeswillbebuiltas3.6mmx0.6mmplatedslotwithfullradius.2mmx0.6mmrectangularholeswillbebuiltas2.6mmx0.6mmplatedslotwithfullradius.TheillustrationseeattachedfileZ,pleaseWesuggesttocontroltheplatedslotlength/widthtoleranceas+/-0.127mm,pleaseconfirming.CalculatedvaluetrendstotheBasedonthelay-upspecifiedbycustomer,thecalculatedvalueofimpedanceisYYohmsperourPolarnotthecustomernominalrequirementofXXohms.So,wesuggest:TomodifythecontrolledtracewidthtoAAmilfromBBmil,and/ormakeamicro-adjustmentforthelay-upastheoneonattachedfile.Wewillcontrolimpedancetobe:XXohmspercustomerrequirement,ORWewon'tmakeanychangefortracewidthandlay-up,butwehavetochangetheimpedancetobeYYohms+/-10%.Pleaseclarifywhichitem(AorB)customerMatchAccordingtostackuponDWG,thecalculatedresultofimpedancemeanvaluewasXXXforlayerXandlayerYwhichshiftedtoupper/lowerlimitbyXXohmsandtherewillbecertainpercentageofscrapduetotheimpedanceoutofcontrolrequirement.InordertoimprovetheimpedancecontrolandtendthemeantonominalvalueofZZohms,wesuggest:TochangethedielectricthicknessFromXXXtoYYYbetweenlayerXandlayerY.TochangethetracewidthtoXXXfromTochangethecontrolledimpedancevaluetoXXXPleaseclarifywhichitem(A,BorC)customerCustomerdidn'tclearlyindicatewhichlayerisreferenceplaneoflayerX.Accordingtoourexperiencesofcalculatedimpedancevalue,wethinklayerYandZarereferenceplanesoflayerX,Pleaseconfirm.CustomerrequiredcontrollingtheimpedancewithintherangeofXohms+/-10%,butcustomerdidn'tmentionwhichtracewidthshouldbecontrolled.Xmiltraceiswithahighpercentonallsignallayers,sowesuggesttocontroltheimpedanceof60ohmsforXmiltrace.Pleaseconfirm.InnerRightPerthepanelDWG,theinnercornerontheboardshouldberightangle,butitisimpossibletomaketheinnercorneratrightanglesbyrouting,wesuggestasbelow:Fortheinnercornerbetweenunitandunit,wesuggesttheinnercornertobeR0.5mm(max),buttherewillbesharpanglesonthefinishedunitsaftertheunitsbeingseparatedbyV-CUTgroove(seeattachedfile1).Pleaseconfirm.FortheinnercornerbetweenunitandTAB,inordertoavoidtherearethesharpanglesonthefinishedunitsandguaranteealltheunitedgetobelinear,wesuggesttoaddovershootontheTAB(seeattachedfile1).Pleaseconfirm.FortheinnercornerbetweenTAB,wesuggesttobuildthemtobeR0.8mm(max)insteadofrightangles.Pleaseconfirm.OutlineAccordingtoPanelDWG,theconnectionareaisfarawayfromunitedge.Thetabmaybedamagedduetounbalancingstrengthonprofilingprocess.So,wesuggestyoumovetheconnectionareaclosetoUnitedge.Pleaseconfirm.MismatchbetweenCAD/CAMdataandMismatchwasfoundaboutadimensionofholetohole(holetoedge/edgetoedge)betweenCAD/CAMdataandDWG: XXX YYYWesuggesttofollowXXX/YYYinCAD/CAM(DWG)toPleaseTheremissedXXXdimensioninUNIT/PANELDWG.AftermeasuringCAD/CAMdata,wegotthesedimensionsasattachedfile.Anyway,wewillfollowCAD/CAMdatatobuild.Pleaseconfirm.NarrowconnectionareabetweenbreakawayAccordingtopanelDWG,theconnectionareabetweenbreakawayholesis10milonly(lessthan15mil),whichissothatitisveryeasytobrokeoffonourprocessorduringdelivery.Inordertostrengthentheconnection,wesuggestyourelaxthebreakawayholefromXXXmiltoDIAYYYmil.PleaseAsthereisnonon-platedholeontheboards;however,inordertofixtheboardonmachine,werequireatleastthreetoolingholeslargerthan1.5mmonprofilingandE-testprocess.Wesuggesttoaddthreeextranon-platedholes(DIA:118mil)onboards.Pleaseconfirm.RelaxtoleranceforoutlineCustomerrequiretocontrolthetoleranceof+/-XXXmilforsomeoutlinedimension;however,thestandardtoleranceforoutlinedimensionis+/-5mil.Tightertolerancecanbeachievedwithspecialprocessing.Inordertofacilitateinproduction,wesuggestyourelaxthetolerancefrom+/-XXXmilto+/-5mil.PleaseUnevenTherearesomeuneventolerancesforsomedimensionsofholetoholeinUNITDWG,ThedimensionbetweenholesmeasuringfromCAD/CAMisn'tequaltonominalvalue,so,wesuggest:Inordertocontroltheuneventolerance,wewillhavetomovetheholelocationsasattachedfile,pleasetakenote.OR:ChangetheuneventolerancetobeeventoleranceofPleaseclarifywhichitem(AorB)customerUselessOnUNIT/PANELDWG,therearesomedimensions;however,wedidn'tknowwhattheydefined.Pleaseclarify.Otherwise,wewillignorethem.Pleaseconfirm.AddInordertoavoidthatasharpanglewasproducedafterseparatingtheunits,wesuggesttoaddanovershootonbreakawaytab,thedimensionasshownonattachedfile.Pleaseconfirm.Packingrequirementsaren'tspecifiedincustomerspec.orDWG,wesuggestyoufollowourstandardcondition:VacuumsealedPanelarea<=0.6squareft,20pcsperbag,Panelarea>0.6squareft,10pcsperEachcartonboxweighttobe501b.max.Pleaseconfirm.PeelablesolderCustomerrequiredpluggingholeofDIA:YYYwithpeelablemask;however,theholelargerthan5.5mmmaybenotcompletelytentedbypeelablemask.So,wesuggesttochangethepluggedholetocoveredhole.Pleaseconfirm.CustomerrequiretocoverpeelablemaskontheplatedholeofDIA:XXX;however,itisverydifficulttoremovepeelablemaskfromtheholesmallerthan0.7mil,pleaseadvisecustomertoacceptpeelablemaskremainingintheseholes.RelaxthicknessforpeelablesolderCustomerrequiredcontrollingthepeelablemaskthickerthanXXXmil,however,thestandardthicknessis5milto23mil.Thickerthicknessmaybeachievedwithspecialprocessing.Inordertofacilitateinproduction,wesuggestyourelaxthethickerXXXmiltoYYYmil.PleaseWithoutthedetaildimensionofpeelablesolderPerthereadmefile(seeattachedfile1),therewasrequestedtoaddPeelableSoldermaskinappointedarea.ButwithoutmentionedthedetaildimensionsofPeelableSoldermask.wesuggestthedetaildimensionsasshownonattachedfile2,pleaseconfirm.wesuggesttoapplypeelablesoldermaskonbothsides,pleaseconfirm.MarkinginholeorSomelegendmarkingslayonpadfellintohole.Ifspacingisavailable,wesuggesttomovethemtosuitableplace,ifnot,wewillshavethepartonpad.Pleaseconfirm.MarkinginlargesolderTherearesomelegendmarkingsonsoldersurface.Inordertofacilitateinproduction,wesuggestyouremovethem.PleaseLegendonstepPermasterartwork,therearesomelegendslocatedonthesteparea(betweenlaminateandcopperpattern),whichwouldcausethesilkscreenillegiblebyphysicalperformance.Sowesuggesttomoveorshrinkthemtosuitableareaifpossible(seejpgfileandmodifiedfile).PleaseRelaxtolerancefornon-platedCustomerrequiredcontrollingthetoleranceofnon-platedslottobe+/-ZZmil,however,thestandardtolerancefornon-platedslotsis+/-3milinwidthand+/-4milinlength.Thisallowsforvariationscausedontheroutingprocess.Inordertofacilitateinproduction,wesuggestyourelaxthetolerance+/-3milfromXXXforslotwidth,and+/-4milfromYYYforslotlength.Pleaseconfirm.RelaxtoleranceforplatedCustomerrequiredcontrollingthetoleranceofplateslottobe+/-XXmil,however,thestandardtoleranceforplatedslotdimensioniswith:+/-4.5milXlength:+/-5.5mil.Thisallowsforvariationscausedbycircuitrydistributionandplatingprocess.Inordertofacilitateinproduction,wesuggestyourelaxthetoleranceto+/-YYmil.Pleaseconfirm.SolderAddS/MBridgeforOnmasterA/W,thereisnoS/MBridgebetweenneighboringSMTpads.Thispresentstheriskofsoldershortonassemblyprocess.So,wesuggesttoaddS/MBridgebetweenthem.PleaseChangeS/MpluggedholetocoveredAccordingtomasterA/W,someviaholeispluggedwithsoldermaskononesideoftheboardbuthasanopeningontheotherside,then,onhotairleveling,thesolderwillflowinholefromthesidewiththeopeningbutcan'tflowoutoftheholeformtheside.TheresultmaybeasolderballinholeafterHAL.Sowesuggest:Toacceptsolderballsinthesehole,TochangeS/Mpluggingsidetohavea3milopening.Pleaseclarifywhichitem(AorB)customerpreferred.HolesizeistoolargetoCustomerrequiredpluggingtheviaholesofDIA:XXXmilwithsoldermask.Forholediametersgreaterthan30mil,wecan'tassurethatsoldermaskwillfillandplugeveryhole.WesuggestReduceholesizefromXXXmiltoYYYmilandpluggedviaholepermasterA/W.Pleaseconfirm.OR:Changethepluggedholestocoveredholes.Pleaseclarifywhichitem(AorB)customerHolesizeistoosmalltoCustomerrequiredcoveringtheviaholesofDIA:XXXwithsoldermask.Forholediametersmallerthan10mil,becauseofthemisregistration,itisveryeasythatsoldermaskflowintoholeandblockthehole.Inordertofacilitateinproduction,weTochangethecoveredholetothepluggedhole.ToaddaS/Mopeninglargerthanfinishedholesizeby5milperside.Pleaseclarifywhichitem(AorB)customerOurstandardspecificationforLPIthicknessis0.4milminimum.Theliquidphotoimageablesoldermask(LPI)flowsonapplicationanddistributesinthicknessbaseduponthecircuitrypattern.Thicknessgreaterthan0.4milrequiresmultipleapplicationsofLPI.Inordertofacilitateinproduction,wesuggestyourelaxthespecificationfromXXXmiltoYYYmil.Pleaseconfirm.S/McovergoldInsomeareasoftheboard,anarrowlineconnectedtogoldfingersisnotcoveredbysoldermask.Ourprocessingsolutionsmayattackthisjunctionandcreateopensornicks.Inordertoavoidthis,wesuggestyoucoverthegoldfingerwithsoldermaskby15mil(max).Pleaseconfirm.Someviaholesarecloserthan20milfromtopsideofgoldfinger,andtheseviaholesarewithS/Mopening.ItisnecessarytocovergoldfingerwithhightemperaturetapeduringHALprocess,andthisoperationisperformedbyhand.Werequired40milspacingasdeviationareatoavoidthatthesepadswithS/Mopeningwerecoveredwiththetape.So,wesuggestyoucovergoldfingerwithsoldermaskby15mil(max).Pleaseconfirm.SoldermaskCustomerspecifiedsoldermaskmaterialtobeXXX;however,wedidn'thavethesoldermaskmaterialsonstore.Itwilltakealonglead-timetopurchasethismaterial.Inordertodeliveryontime,wesuggestyouusethecommonmaterialonhandinstead:Taiyo:PSR4000Tamura:DSR2200GooChemical:PSR550Pleaseclarifywhichitem(A,BorC)customerThespacingbetweenSMTpadsis5milonly;however,werequireda7milminspacingtoaddS/MBridge.So,wesuggest:ToshaveSMTpadby0.5milpersidetogeta6milspacing,OR:NottoaddS/MBridgebetweenSMTPleaseclarifywhichitem(AorB)customerSolderRelaxsolderThesolderthicknessspecifiedintheDWG(specification)istobeXXXu',however,thestandardthicknessforsolderthicknessis40u'(min)ongroundcopperplanesand100u'(min)onSMTpads.Becausetheboarddesignstronglyaffectssolderthickness,wecannotguaranteeresultsabovethespecification.Werequestyourelaxyourthickness(XXXu')totheabovespecification.Pleaseconfirm.PerthepanelDWG,itlookslikeastrangedesignwithoutTABononerowofunitsatthecenter(seeattachedfile),PleaseadvisecustomertoclarifywhetherthepanelDWGiscorrect.XVIII1.TgvalueisnotspecifiedforHighTgOntheDWGnoteformaterial,itrequiredusing'HighTG'materialtobuildthisproject,butcustomerdidnotspecifiedtheTgvalue.Oncurrentboard,wehadusedahighTg>=160DEGmaterialforthisproject,sowestilluseitasnormal,pleaseconfirm.ConnectionbetweenCugroundsistooPerthesoldersidemasterA/W,theconnectionbetweenthetwoCugroundsisveryfine(onlyXXmil)(seeattachedfile),whichisveryeasyopenedafterouretchingprocess,toavoidtheproblem,wesuggestTostrengthenshortingtheconnection,ToshortenthePleaseclarifywhichitem(AorB)customerSometracewasexposedfromtheS/MopeningoffiducialmarkonC/S(S/S).WesuggestyoumodifytheS/Mopeningandhavethetracescoveredwithsoldermask.Pleaseconfirm.RelaxetchingCustomerrequiredcontrollingthetoleranceof+/-XXXforalltraces;howe