數(shù)字集成電路英文課件：Chapter 1 Deep Submicron Digital IC Design

1、Faculty of Materials and Energy, Guangdong University of Technology Chapter 1: Deep Submicron Digital IC Design 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 2 Outline vKids Today! Engineer Tomorrow? vIntroduction vVLSI Design vThe Challenges Ahead 2021-5-15 Digital Int

2、egrated Circuits Faculty of Materials and Energy, GDUT 3 1.0 Kids Today! Engineer Tomorrow?-1 ISSCC 2009 vUS Engineering Degrees 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 4 1.0 Kids Today! Engineer Tomorrow?-2 ISSCC 2009 vDo You Like to be an Engineer? 2021-5-15 Dig

3、ital Integrated Circuits Faculty of Materials and Energy, GDUT 5 1.0 Kids Today! Engineer Tomorrow?-3 ISSCC 2009 vPercent. of Women Studying Engineer 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 6 1.0 Kids Today! Engineer Tomorrow?-4 ISSCC 2009 vPublic Perception of En

4、gineering 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 7 1.0 Kids Today! Engineer Tomorrow?-5 ISSCC 2009 v New Engineer Messages: v Live your life, love what you do: Engineering will challenge you to turns dreams into realities while working with inspiring people. v Cr

5、eativity has its rewards: Engineering are respected, recognized and financially rewarded for their innovative thinking and creativity. v Make a world of difference: Engineering are going where there is the greatest need and making a lasting contribution. v Create possibilities: Engineering opens all

6、 kinds of doors, from humanitarian work to international business. 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 8 1.1 Introduction-1 The First Computer The Babbage Difference Engine 2500 parts (1832), at The London Science Museums difference engine Fully operational di

7、fference engine No.2 at the Computer History Museum in Mountain View, CA 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 9 1.1 Introduction-2 Mechanical Alternative to Electronics 1989, Doron Swade “The calculating section of Difference Engine No. 2, has 4,000 moving part

8、s (excluding the printing mechanism) and weighs 2.6 tons. It is 7 feet high, 11 feet long and 18 inches in depth” 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 10 1.1 Introduction-3 Why Integrated Circuit v Break this question into two questions Why electronics Why use

9、ICs to build electronics v Why use electronics Electrons are easy to move / control Easier to move/control electrons than real stuff Move information, not things (phone, fax, WWW, etc.) Takes much less energy and $ 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 11 1.1 In

10、troduction-4 ENIAC Electronic Numerical Integrator And Computer First electronic computer 18000 vacuum tubes, 680 ft3 (63m2), 150kW 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 12 1.1 Introduction-5 From Tubes v 1946, ENIAC filled an entire room! 17,468 vacuum tubes, 7

11、0,000 resistors, 72,000 crystal diodes, 10,000 capacitors, 6,000 manual switches, 5 million hand-soldered joints and many blinking lights! v could add 5,000 numbers ina single second 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 13 1.1 Introduction-6 To Transistors 2021

12、-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 14 1.1 Introduction-7 TX-0 (MIT) and the Transistor 1 1953, TX-0, Massachusetts Institute of Technology (MIT), Lincoln Labs. Circuit module from the TX-2 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDU

13、T 15 1.1 Introduction-8 v What is IC (Integrated Circuit) ? Definition：An IC, sometimes called a chip, is a piece of a semiconductor wafer (called a die) with package, on which many tiny resistors, capacitors, and transistors are fabricated. v Number of process steps is independent of circuit comple

14、xity Suitable for mass production 12 inch wafer 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 16 1.1 Introduction-9: Integrated Circuits v A device with multiple electrical components and their interconnects manufactured on a single substrate v Classification Analog Dig

15、ital Mixed Signal 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 17 1.1 Introduction-10: First IC v 1952, the idea of the IC was conceived by W.A. Dummer, a radar scientist working for the Royal Radar Establishment of the British Ministry of Defense. But he unsuccessfull

16、y attempted to build such a circuit in 1956. v 1958, Jack Kilby, (2000 Nobile prize), Texas Instruments, Kilbys chip was made of germanium v chip cost does not increase significantly v Cost of a function decreases by 2x v But How to design chips with more and more functions? Design engineering popul

17、ation does not double every two years v Hence, a need for more efficient design methods Exploit different levels of abstraction 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 33 1.1 Introduction-26: Energy per Logic Operation v Energy per logic operation scaling will slo

18、w down 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 34 1.1 Introduction-27: Moores Law in Microprocessors v Transistors on lead microprocessors double every 2 years 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 35 1.1 Introduction-28: Evol

19、ution in DRAM Chip Capacity 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 36 1.1 Introduction-29: Die Size Growth v Die size grows by 14% to satisfy Moores Law 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 37 1.1 Introduction-30: Clock Freq

20、uency v Lead microprocessors frequency doubles every 2 years 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 38 1.1 Introduction-31: Power Dissipation v Lead Microprocessors power continues to increase 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy,

21、 GDUT 39 1.1 Introduction-32: Power Density v Power density too high to keep junctions at low temperature 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 40 1.1 Introduction-33: # of Transistors per Die v Source: ISSCC 2003 G. Moore “No exponential is forever, but forever

22、 can be delayed” 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 41 1.1 Introduction-34: Design Productivity Trends v Complexity outpaces design productivity 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 42 1.1 Introduction-35: Exponential Co

23、sts 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 43 1.1 Introduction-36: Average Transistor Price by Year 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 44 1.1 Introduction-37: Organic vs. Electronic Evolution 2021-5-15 Digital Integrated C

24、ircuits Faculty of Materials and Energy, GDUT 45 1.1 Introduction-38: Organic vs. Electronic Evolution 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 46 1.1 Introduction-39: More Moore not correct by construction! 2021-5-15 Digital Integrated Circuits Faculty of Material

25、s and Energy, GDUT 61 1.2 VLSI Design-14 Validation and Tape Out v Making a mistake is very expensive Have a tool check all previous types of mistakes Check all errors, sign off on false positives, fix errors Run check tool again v Tape out Used to write 9-track computer tapes for mask making Now, t

26、ransfer polygons to fabrication company via ftp v Youre done! (Except for documentation, test vector generation, device bringup, skew lots, reliability tests, burnin) 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 62 1.3 The Challenges Ahead-1 v Channel Length: minimum r

27、esolvable geometry on a given layer of a metal in the integrated circuits, specifically, the metal line widths or metal-to- metal spacing (metal pitch). 2009: 22nm Physical limit for photolithography: 0.35m (the wavelength of light is approximately equal to 0.35m) v Oxide thickness 2009: 0.5nm Curre

28、nt tunneling through oxide: need high k dielectrics v Leakage current or sub threshold current: the current flowing through the transistor when it is nominally off. The rapid increasing leakage current would produce an unacceptably large static power dissipation. 2021-5-15 Digital Integrated Circuits Faculty of Materials and Energy, GDUT 63 1.3 The Challenges Ahead-2 v Deep Submicron Interconnect Wire capacitance With the increasing of wire length, the capacitance to ground of the wires could no longer be neglected. The wire capacitance should be included in the calculation of capaci