目視檢驗(yàn)規(guī)范IPC0（精選干貨）

1、目視檢驗(yàn)規(guī)范IPC0 2 目視檢驗(yàn)規(guī)范標(biāo)準(zhǔn)IPC610 1.允收標(biāo)準(zhǔn) 2.拒收標(biāo)準(zhǔn) 3 零件本體僅下方有二接觸點(diǎn)的零件 (Chip Components/Bottom Only Terminations cont.) 偏移 (Shift) 允收 (Target Condition) 零件黏焊於錫墊中心位置, 沒有任何偏移. No side overhang. 允收極限 (Acceptable) 零件往錫墊寬邊(A)偏移, 但零件 本體寬邊(C) 有75% 以上焊接於 錫墊上. 零件本體與電路板錫墊間(G)錫 厚至少0.2 mm. Side overhang (A) is allowed if

2、minimum end joint width (C) requirements are met.Minimum is 75%. Minimum thickness (G) is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance. 拒收 (Nonconforming Defect) 零件往錫墊寬邊(A)偏移, 且零 件本體小於75% 寬邊(C) 焊接 於錫墊上. 零件往錫墊長(zhǎng)邊(B)偏移. Side overhang (A) is allowed if minimum end joint

3、 width (C) requirements are met. Minimum is 75%. Minimum thickness (G) is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance. 4 零件本體有1,3,5面矩形金屬焊接點(diǎn) (Rectangular End Components-1,3or5 side Termination) 偏移 (Shift) 允收 (Target Condition) 零件金屬部份黏焊於錫墊中 心位置, 沒有任何偏移. 零件 本體錫墊完全沾錫.

4、No side overhang. Side joint length (D) equals component termination length. 允收極限 (Acceptable) 零件往錫墊寬邊(A)偏移, 但 零件本體金屬焊墊寬邊(W) 75%以上焊接於電路板錫墊上. End joint width (C) is 75% width of component termination area (W) or 75% width of PB land (P), whichever is less. 拒收 (Nonconforming Defect) 零件往錫墊寬邊(A)偏移, 但零 件

5、本體不足75% 寬邊(C)以上焊 接於電路板錫墊上. 零件往錫墊長(zhǎng)邊偏移(B). Side overhang (A) causes minimum end joint width (C) requirements not to be met. End overhang (B) is not permitted. 5 零件本體有1,3,5面矩形接觸點(diǎn) (Rectangular End Components-1,3or5 side Termination) 偏 移 (Shift) 允收 (Target Condition) 零件黏焊於錫墊中心位置, 沒有任何偏移. 零件本體錫 墊完全沾錫. No

6、side overhang. 允收極限 (Acceptable) 零件往錫墊寬邊偏移, 但零件 之焊接面佔(zhàn)75% 以上. End joint width is 75% width of component termination area or 75% width of PB land , whichever is less. 拒收 (Nonconforming Defect) 零件往錫墊長(zhǎng)邊偏移. End overhang is not permitted. 6 圓柱體零件 (Cylindrical End Cap Termination) 偏 移 (Shift) 允收 (Target Co

7、ndition) 零件黏焊於錫墊中心位置, 沒有任何偏移. 吃錫面在圓筒零件直徑(W) 與板上錫墊長(zhǎng)(P)之間. No side overhang. End joint width is equal to or greater than the component width (W) or width of the land (P), whichever is less. 允收極限 (Acceptable) 零件往錫墊寬邊偏移(A), 側(cè) 邊偏移度允收極限為零件直 徑(W)的25% 或錫墊長(zhǎng)度(P) 的25%. Side overhang (A) is 25% diameter of comp

8、onent width (W) or land with (P). 拒收 (Nonconforming Defect) 零件側(cè)邊偏移度(A)超出25%零 件直徑 (W)或錫墊長(zhǎng)度(P)的25%. 零件往錫墊長(zhǎng)邊偏移(B). Side overhang (A) is 25% diameter of component width (W) or land with (P). End overhang is not permitted. 7 無導(dǎo)腳零件 (Leadless Chip Carriers with Castellated Terminations) 偏移 (Shift) 允收 (Targ

9、et Condition) 零件未偏移. 零件延伸引腳長(zhǎng)等於電路板 上錫墊長(zhǎng). 零件立於電路板上錫墊中心. No side overhang. Fillet extension equals land width. Fillet height covers terminal. 允收極限 (Acceptable) 零件偏移向錫墊寬邊之間(A), 偏移度小於電路板上錫墊面 (W)的25%. Maximum side overhang (A) is 25%W. 拒收 (Nonconforming Defect) 零件偏移向錫墊寬邊之間(A), 偏 移度大於電路板上錫墊面(W)的 25%.零件偏移向錫

10、墊長(zhǎng)邊之間 (B). Maximum side overhang (A) is 25%W. End overhang (B) is not permitted. 8 允收 (Target Condition) 零件腳未偏移. No side overhang. 允收極限 (Acceptable) 零件偏移向錫墊寬邊之間(A), 偏移小於電路板上錫墊寬度 (W)的 25% 或偏移小於0.5mm. Side overhang (A) is 25%W or 0.5 mm. 拒收 (Nonconforming Defect) 零件偏移向錫墊寬邊之間(A), 偏移大於電路板上錫墊寬度(W) 的 25%或

11、偏移大於0.5mm. 不允許任何的零件趾端偏移 如(B). Side overhang (A) is greater than 25%W or 0.5 mm whichever is less. Toe overhang (B) is not specified 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon L / Gull Wing leads / Round leads) 偏移 (Shift) 9 I 腳 (“I” Leads) 偏移 (Shift) 允收 (Target Condition) 零件腳未偏移. No side overhang. 允收極限 (Accep

12、table) 零件偏移向錫墊寬邊之間(A), 偏移大於錫腳寬度 (W) 的25% 仍不允許. 不允許任何的偏移. Overhang(A) exceeds 25% lead width (W). No overhang allowed. 拒收 (Nonconforming Defect) 不允許任何的零件趾端偏移 如(B). Toe overhang (B) is not specified. 10 範(fàn)例 (Example) - 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon L / Gull Wing leads / Round leads) 允收 (Target Cond

13、ition) 允收極限 (Acceptable) 拒收 (Nonconforming Defect) 11 範(fàn)例 (Example) - 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon L / Gull Wing leads / Round leads) 拒收 (Nonconforming Defect) 拒收 (Nonconforming Defect) 拒收 (Nonconforming Defect) 12 範(fàn)例 (Example) - J 腳 / I 腳 允收極限 (Acceptable) 拒收 (Nonconforming Defect) 拒收 (Nonconfo

14、rming Defect) 13 範(fàn)例 (Example) 拒收 (Nonconforming Defect) 高翹 / LIFTED 14 範(fàn)例 (Example) 高翹 / LIFTED OKNG 15 範(fàn)例 (Example) 拒收 (Nonconforming Defect) 折腳 / BENT 缺件 / MISSING 偏移 / SHIFT 16 範(fàn)例 (Example) 拒收 (Nonconforming Defect) 破損 / DAMAGE 17 範(fàn)例 (Example) 拒收 (Nonconforming Defect) 撞件 / BROKEN 撞件 / BROKEN 18

15、範(fàn)例 (Example) 允收極限 (Acceptable) 偏移 / SHIFT 錫洞 / Solder Hole 19 範(fàn)例 (Example) ASR1 : LED2 反向 / REVERSE 拒收 (Nonconforming Defect) 缺口端為負(fù)極 / Nick side is “ ” 5168 : SW4 反向 / REVERSE Switch數(shù)字與PCBA同向 / Number on component same direction with PCBA. 20 21 範(fàn)例 (Example) 折腳 / PIN BENT 包焊 / Poor Solder 拒收 (Noncon

16、forming Defect) 22 範(fàn)例 (Example) 拒收 (Nonconforming Defect) NG OK 退PIN 23 Travis M/B DIP component cosmetic 1,整體高翹，且最大不可以超過0.3mm 2.后邊、前邊緣高翹不可超過0.2mm 整體高翹 單邊高翹 24 Travis M/B DIP component cosmetic 1.1.水平高翹，最大允許限度為水平高翹，最大允許限度為0.3mm. 0.3mm. 2.2.不允許不允許單單邊高翹。邊高翹。 25 Travis base sample RAM RAM 的卡勾不可出現(xiàn)變形等不良。

17、的卡勾不可出現(xiàn)變形等不良。 26 Travis M/B DIP component cosmetic 不能出現(xiàn)任何標(biāo)記,特 別是有鉛異物。 不能出現(xiàn)任何標(biāo)記, 特別是有鉛異物。 27 Travis M/B DIP component cosmetic JUSB 不可出現(xiàn)氣泡和明不可出現(xiàn)氣泡和明 顯擦痕顯擦痕 . 28 Travis base sample Microphone 不能失掉海綿，禁止使用雙面膠黏貼脫落海綿。 29 Travis M/B solder hole JDOCK 不允許單邊高翹 30 Travis base sample 1.Function Pin 吃 錫量不應(yīng)少于75%. 2.固定pin錫量不應(yīng) 少于50%.（以固定 住零件為標(biāo)準(zhǔn)） 3.折腳 （1）:如果pin 折腳但是有露出， function 測(cè)試pass 可以判斷為