CCM產(chǎn)品工藝知識培知識

1、1會計學(xué)CCM產(chǎn)品工藝知識培知識產(chǎn)品工藝知識培知識234拆解拆解56789ChipLensBarrelHolderIR FilterstiffenerFPCSolder BallGlass10ChipLensBarrelHolderIR FilterFingerGold WireFPCPCB11鏡頭鏡頭(Lens)鏡座鏡座(Holder)芯片芯片(Chip)電路板電路板(PCB)連接器連接器(Con.)12CMOS CHIPLENS HOLDERLENS BARRELThese 3 items come as an assembly1st LENS ELEMENT2nd LENS ELEMEN

2、TIR GLASSSUBSTRATEFPC131415161718Wafer清洗Plasma清洗固晶固晶烘烤邦線金線檢查DAM邦定DAM烘烤二流體清洗CCD檢查Glass貼附CCD檢查固化半成品測試19ProcessSupply WaferTrayOKOKOKOKN/AOKN/AOKIR Glass Attach ProcessCM800Barrel Insert ProcessCM800dispenseCMOS ChipdispenseIR Glassdispense+Lens BarrelDie Attach ProcessCM800Holder Attach ProcessCM80020

3、Die Bonding:使芯片 與PCB粘合。注意點：1.芯片方向 2.膠量 3.頂針和吸嘴印 4.芯片角度 5.芯片位置 6.芯片傾斜 21Wire Bonding: 通過金線焊接使芯片與PCB線路導(dǎo)通。注意點：1.接線是否正確 2. 線弧 3.金球大小 4.金球厚度 5.金線拉力 6.金球推力 22Solder PasteScreen PrintPassive PlacementForDie AttachPassiveSolder PastePassiveSubstrate23Die AttachWire BondingWet CleanChipSensorAreaAu WireChipS

4、ensorAreaAu Wire24IR Glass MountIR Glass SAWWafer RingIR GlassIR Glass25Glue DispenseIR Glass AttachHolderHolderGlueGlueIR cut GlassIR Glass26Glue DispenseHolder AttachGlueGlueBarrel InsertBarrelHolder27Singlationcutcut28Focus adjustBarrelBarrel FixationMotorLighting（ （Percolation Method)chartAchrom

5、atic LensND4（ （Adjustment of Light Quantity） ）Laser293031323334SEARCH HEIGHT35SEARCH SPEED1SEARCH TOL 136SEARCH SPEED1SEARCH TOL 137SEARCH TOL 1SEARCH SPEED138SEARCH TOL 1SEARCH SPEED139SEARCH TOL 1SEARCH SPEED140SEARCH SPEED1SEARCH TOL 141SEARCH SPEED1SEARCH TOL 1IMPACT FORCE424344454647484950RD (R

6、everse Distance)515253Calculated Wire LengthWIRE CLAMP CLOSE54Calculated Wire Length55SEARCH DELAY56TRAJECTORY57TRAJECTORY58TRAJECTORY59TRAJECTORY60TRAJECTORY61TRAJECTORY62TRAJECTORY63TRAJECTORY64TRAJECTORY65TRAJECTORY662nd Search HeightSearch Speed 2Search Tol 267Search Speed 2Search Tol 268Search Speed 2Search Tol 269707172737475Tail length76777879808182ChipLensBarrelHolderIR FilterFingerGold WireFPCPCB8384Wafer清洗Plasm