金相樣品制備與組織顯示中術(shù)語的對應(yīng)翻譯

1、金相樣品制備與組織顯示中術(shù)語的對應(yīng)翻譯-基于BUEHLER® SUM-MET - The Science Behind Materials Preparation一書上傳試驗(yàn)序號1.2.Polishing拋光3.Mechanical Polishing4.disturbed metal干擾金屬5.pitting坑洞6.dragging out of inclusions, “comet tailing”夾雜脫出，彗星拖尾7.staining著色8.or relief (heightdifferences between different constituents, or betwe

2、enholes and constituents或浮雕(不同相的高度不同或孔和組織高度不同，9.Edge Retention10.Sampling . 7Goals of Specimen Preparation . 9Method Development . 9Sectioning . 10Abrasive Wheel Cutting . 10Precision Saws . 12Mounting of Specimens . 14Clamp Mounting . 14Compression Mounting . 14Castable Resins for Mounting . 15Edge

3、 Preservation . 17Grinding . 20Grinding Media . 20Grinding Equipment . 22Polishing . 23Mechanical Polishing . 24Electrolytic Polishing . 24Manual “Hand” Polishing . 24Automatic Polishing . 25Polishing Clothes . 25Polishing Abrasives . 27Examples of Preparation Procedure . 29The Traditional Method .

4、29Contemporary Methods . 29Procedures for Specific Materials . 32Periodic Table of Elements . 33Light Metals: Al, Mg and Be . 34Aluminum . 34Magnesium . 36Beryllium . 37Low Melting Point Metals:Sb, Bi, Cd, Pb, Sn and Zn . 38Refractory Metals: Ti, Zr, Hf, Cr, Mo,Nb, Re, Ta, V and W . 40Titanium . 40Z

5、irconium and Hafnium . 41Other Refractory Metals: Cr, Mo, Nb,Re, Ta, V and W . 43Ferrous Metals . 45Copper, Nickel & Cobalt . 48Copper . 45Nickel . 49Cobalt . 50Precious Metals . 51Thermally-Spray Coated Specimens . 53Sintered Carbides . 55Ceramics. 57Composites . 59Printed Circuit Boards . 61El

6、etronic Materials . 62Polymers . 65Etching . 67Etching Procedures . 67Selective Etching . 68Electrolytic Etching and Anodizing . 71Heat Tinting . 71Interference Layer Method . 72Commonly Used Etchants forMetals and Alloys . 73Light Optical Microscopy . 78The Light Microscope . 79Microscope Component

7、s . 79Resolution . 82Depth of Field . 83Imaging Modes . 83Microindentation Hardness Testing . 87The Vickers Test . 87The Knoop Test . 88Factors Affecting Accuracy, Precisionand Bias . 89Automation . 91Image Capture & Analysis . 93Acquisition . 93Clarification . 96Operator Interactive Measurements . 96Aut