SMT中英文專業(yè)術(shù)語教程

1、http:/ 深圳市共進(jìn)電子有限公司SMT中英文專業(yè)術(shù)語教程中英文專業(yè)術(shù)語教程更新日期：2011.09http:/ 深圳市共進(jìn)電子有限公司1.印刷工藝專業(yè)英語2.貼片工藝專業(yè)英語3.回流工藝專業(yè)英語針對新入職或有一定基礎(chǔ)的職員2小時(shí)羅衛(wèi)龍使大家對SMT專業(yè)英語有所了解，能夠看懂一些專業(yè)素材培訓(xùn)目的培訓(xùn)目的培訓(xùn)對象培訓(xùn)對象培訓(xùn)講師培訓(xùn)講師學(xué)習(xí)重點(diǎn)學(xué)習(xí)重點(diǎn)培訓(xùn)課時(shí)培訓(xùn)課時(shí)http:/ 深圳市共進(jìn)電子有限公司Printing Process English/印刷工藝英語http:/ 深圳市共進(jìn)電子有限公司測試測試OK后后轉(zhuǎn)轉(zhuǎn)DIP插件插件印刷（印刷（Printing）：）：目的：借助于鋼網(wǎng)把錫膏印刷

2、在PCB之焊盤（PAD）上 貼片（貼片（Mount）：）：目的：將貼片元件準(zhǔn)確的貼裝到PCB焊盤上回流焊（回流焊（Reflow）：）：目的：把完成貼片的PCB經(jīng)由一定的溫度曲線使錫膏與PCB，元件之間形成機(jī)械連接AOI（自動(dòng)光學(xué)檢測）：（自動(dòng)光學(xué)檢測）：目的：自動(dòng)檢測PCBA板上各種不同帖裝錯(cuò)誤及焊接缺陷，確保SMT不良品不會流入下一道工序SMT：Surface Mount Technology/表面貼裝技術(shù)http:/ 深圳市共進(jìn)電子有限公司Definition：Process of transferring solder paste onto the pads of a PCB, by f

3、orcing it through mating apertures on a stencil, using a squeegeeBoard loader/上板機(jī)：上板機(jī)： PCBs to be transported to the screen printer using conveyorsPrinter/印刷機(jī)：印刷機(jī)： deposits solder paste onto pads on the circuit boardhttp:/ 深圳市共進(jìn)電子有限公司PCBPCB（Printed circuit boardPrinted circuit board）/印制線路板Solder pas

4、teSolder paste/錫膏： Mixture of solder powders and flux deposited onto pads of circuit board on a controlled volume. After reflow provides electrical, mechanical and thermal connection between component and boardhttp:/ 深圳市共進(jìn)電子有限公司SqueegeeSqueegee/刮刀: Critical tool used to “push” paste through the desi

5、gnated openingsStencilStencil/鋼網(wǎng)：Vehicle by which the volume and placement location of solder paste deposition is controlledFoil/鋼片F(xiàn)rame/外框Flex Mask/繃網(wǎng)Aperture/開孔http:/ 深圳市共進(jìn)電子有限公司Main Elements of the Screen Printer/Main Elements of the Screen Printer/印刷機(jī)要素印刷機(jī)要素Input Conveyor/輸入導(dǎo)軌Solvent tank/容劑曹Mon

6、itor/監(jiān)控器Output Conveyor/輸出導(dǎo)軌Light tower/指示燈Emergency stop buttons/緊急制動(dòng)開關(guān)http:/ 深圳市共進(jìn)電子有限公司Vision system/視覺系統(tǒng)Clamps/夾子Board support/支撐塊Or support Pins/支撐頂針stencil/鋼網(wǎng)Squeegee/刮刀http:/ 深圳市共進(jìn)電子有限公司Print Parameters/Print Parameters/印刷參數(shù)印刷參數(shù)Angle of Attack (45Angle of Attack (45 or 60 or 60 with stencil)/

7、 with stencil)/角度角度：The angle made by the front of squeegee blade in relation to the stencilSnap-Off (Contact or Non-Contact)/Snap-Off (Contact or Non-Contact)/印刷間隙印刷間隙：The distance from the top surface of the PCB to the bottom surface of the stencilSqueegee Pressure/Squeegee Pressure/刮刀壓力刮刀壓力：Contr

8、ols the shear stress，The total force with which the squeegee is pushing onto the boardSqueegee Speed/Squeegee Speed/刮刀速度刮刀速度：Controls the shear rate，The velocity at which the squeegee traverses across the stencilSeparation Speed/Separation Speed/分離速度分離速度：The velocity at which the PCB release from th

9、e stencilhttp:/ 深圳市共進(jìn)電子有限公司Separation Distance/分離距離分離距離:The distance when the PCB release from the stencil which keep the separation speedStencil Alignment/Stencil Alignment/鋼網(wǎng)對位鋼網(wǎng)對位:Vision Based:Fully automatic with fiducials or Semi-automatic ManualCleaning Frequency/Cleaning Frequency/清洗頻率清洗頻率Cle

10、aning mode/Cleaning mode/清洗模式清洗模式:Dry/wet/vacuumhttp:/ 深圳市共進(jìn)電子有限公司Print Defects/Print Defects/印刷缺陷印刷缺陷Misalignment/偏位Bridge or Short/短路Icicle/拉尖Scoopinghttp:/ 深圳市共進(jìn)電子有限公司Incomplete print/少錫Excessive print/多錫Paste residue/錫膏臟污Slump/坍塌http:/ 深圳市共進(jìn)電子有限公司Component placement process english/元件貼裝工藝英語http:

11、/ 深圳市共進(jìn)電子有限公司測試測試OK后后轉(zhuǎn)轉(zhuǎn)DIP插件插件印刷（印刷（Printing）：）：目的：借助于鋼網(wǎng)把錫膏印刷在PCB之焊盤（PAD）上 貼片（貼片（Mount）：）：目的：將貼片元件準(zhǔn)確的貼裝到PCB焊盤上回流焊（回流焊（Reflow）：）：目的：把完成貼片的PCB經(jīng)由一定的溫度曲線使錫膏與PCB，元件之間形成機(jī)械連接AOI（自動(dòng)光學(xué)檢測）：（自動(dòng)光學(xué)檢測）：目的：自動(dòng)檢測PCBA板上各種不同帖裝錯(cuò)誤及焊接缺陷，確保SMT不良品不會流入下一道工序http:/ 深圳市共進(jìn)電子有限公司Generic SMD Placement Machine/Generic SMD Placemen

12、t Machine/常用表面貼裝設(shè)備常用表面貼裝設(shè)備BoardBoardAlignmentAlignment板對位板對位Robot/Robot/機(jī)械臂機(jī)械臂ComponentComponentFeeding/Feeding/供料器供料器 ComponentAlignment/器件對位Frame/Frame/外框外框PlacementPlacementHead/Head/貼裝頭貼裝頭PCB Transport/PCBPCB Transport/PCB傳輸傳輸http:/ 深圳市共進(jìn)電子有限公司User interface/用戶界面Placement robotComponent feeding/

13、供料器料車feeder/飛達(dá)Toolbit or nozzle吸嘴http:/ 深圳市共進(jìn)電子有限公司PCB transporthttp:/ 深圳市共進(jìn)電子有限公司Board alignmenthttp:/ 深圳市共進(jìn)電子有限公司Board alignmenthttp:/ 深圳市共進(jìn)電子有限公司The other professional english used in placement process貼裝工藝其他專業(yè)英語貼裝工藝其他專業(yè)英語Loading list/站位表Offset/偏差Pick/吸取Place/貼裝Placement Accuracy/貼裝精度Linear Motor/

14、線性馬達(dá)Ball Screw/絲桿Image/影像http:/ 深圳市共進(jìn)電子有限公司Reflow process english/回流工藝英語http:/ 深圳市共進(jìn)電子有限公司測試測試OK后后轉(zhuǎn)轉(zhuǎn)DIP插件插件印刷（印刷（Printing）：）：目的：借助于鋼網(wǎng)把錫膏印刷在PCB之焊盤（PAD）上 貼片（貼片（Mount）：）：目的：將貼片元件準(zhǔn)確的貼裝到PCB焊盤上回流焊（回流焊（Reflow）：）：目的：把完成貼片的PCB經(jīng)由一定的溫度曲線使錫膏與PCB，元件之間形成機(jī)械連接AOI（自動(dòng)光學(xué)檢測）：（自動(dòng)光學(xué)檢測）：目的：自動(dòng)檢測PCBA板上各種不同帖裝錯(cuò)誤及焊接缺陷，確保SMT不良品

15、不會流入下一道工序http:/ 深圳市共進(jìn)電子有限公司Soldering/焊接焊接1.Process of joining metallic surfaces(金屬表面連接) through the mass heating(加熱) of solder or solder paste2.Creates a mechanical(機(jī)械的) and electrical(電的) connection between the components and PCB3.Solder alloy metal(焊料合金) is melted(熔化) to form the connection4.Liqui

16、d solder attaches to the base metals by forming intermetallic compounds(IMC:內(nèi)部合金), through the process of wetting(潤濕)http:/ 深圳市共進(jìn)電子有限公司Surface Tension/表面張力表面張力: Surface tension is a molecular force(分子作用力) existing in the surface film of all liquidsWetting/潤濕潤濕: : The ability of the molten solder all

17、oy (熔融焊錫合金) to adhere to the surfaces being solderedCapillary Action/毛細(xì)作用毛細(xì)作用：Interaction between a liquid (solder or flux) and a small opening or surface in a solid ( Pad, component Lead )Wetting Angle/潤濕角潤濕角IMC（Intermetallic compounds）/內(nèi)部合金層內(nèi)部合金層：When the molten solder alloy makes contact with the

18、 PCB finish or component lead finish, a small amount of Sn in the solder combines with the finish metal or the base copper to form a metallurgical compoundhttp:/ 深圳市共進(jìn)電子有限公司Typical Convection Reflow Oven/典型的熱風(fēng)回流爐典型的熱風(fēng)回流爐(a)PCBAConveyor/鏈條鏈條Heating Blowers/熱風(fēng)器熱風(fēng)器CoolingFan/冷卻風(fēng)扇冷卻風(fēng)扇Reflow oven/回流爐回流爐Lower/下溫區(qū)Upper/上溫區(qū)http:/ 深圳市共進(jìn)電子有限公司Typical reflow profile/典型回流曲線典型回流曲線The reflow of solder is achieved in a furnace with predetermined thermal profiles. The different stages are: 爐子里的回流焊接用預(yù)