工廠常見(jiàn)英語(yǔ)單詞

工廠常見(jiàn)英語(yǔ)單詞工廠常見(jiàn)英語(yǔ)單詞工廠常見(jiàn)英語(yǔ)單詞xxx公司工廠常見(jiàn)英語(yǔ)單詞文件編號(hào)：文件日期：修訂次數(shù)：第1.0次更改批準(zhǔn)審核制定方案設(shè)計(jì)，管理制度從事質(zhì)量工作以來(lái)積累的常用英語(yǔ)，希望對(duì)有需要的朋友有所幫助！質(zhì)量專業(yè)英語(yǔ)大全零件材料類的專有名詞CPU:centralprocessingunit(中央處理器)IC:Integratedcircuit(集成電路)MemoryIC:MemoryIntegratedcircuit（記憶集成電路）RAM:RandomAccessMemory（隨機(jī)存取內(nèi)存）DRAM:DynamicRandomAccessMemory（動(dòng)態(tài)隨機(jī)存取內(nèi)存）SRAM:StaicRandomAccessMemory（靜態(tài)隨機(jī)內(nèi)存）ROM:Read-onlyMemory（只讀存儲(chǔ)器）EPROM:ElectricalProgrammableRead-onlyMemory（電可抹只讀存諸器）EEPROM:ElectricalErasbaleProgrammableRead-onlyMemory（電可抹可編程只讀存儲(chǔ)器）CMOS:ComplementaryMetal-Oxide-Semiconductor（互補(bǔ)金屬氧化物半導(dǎo)體）BIOS:BasicInputOutputSystem（基本輸入輸出系統(tǒng)）Transistor：晶體管LED:發(fā)光二極管Resistor：電阻Variator：可變電阻Capacitor:電容Capacitorarray：排容Diode：二極管Transistor：三極體Transformer：變壓器（ADP）Oscillator：頻率振蕩器（0sc）Crystal：石英振蕩器XTAL/OSC:振蕩產(chǎn)生器（X）Relay：延時(shí)器Sensor：感應(yīng)器Beadcore：磁珠Filter:濾波器FlatCable：排線Inductor：電感Buzzer：蜂鳴器Socket：插座Slot：插槽Fuse：熔斷器Current：電流表Solderiron：電烙鐵Magnifyingglass：放大鏡Caliper：游標(biāo)卡尺Driver：螺絲起子Oven：烤箱TFT:液晶顯示器Oscilloscope：示波器Connector：連接器PCB:printedcircuitboard（印刷電路板）PCBA:printedcircuitboardassembly（電路板成品）PP:并行接口HDD:硬盤FDD:軟盤PSU:powersupplyunit（電源供應(yīng)器）SPEC:規(guī)格Attach:附件Case:機(jī)箱，蓋子Cover：上蓋Base：下蓋Bazel：面板（panel）Bracket：支架，鐵片Lable：貼紙Guide：手冊(cè)Manual：手冊(cè)，指南Card：網(wǎng)卡Switch：交換機(jī)Hub：集線器Router：路由器Sample：樣品Gap：間隙Sponge：海綿Pallet：棧板Foam：保利龍F(tuán)iber：光纖Disk：磁盤片PROG:程序Barcode：條形碼System：系統(tǒng)SystemBarcode：系統(tǒng)條形碼M/B:motherboard：主板CD-ROM:光驅(qū)FAN:風(fēng)扇Cable：線材Audio：音效K/B:Keyboard（鍵盤）Mouse：鼠標(biāo)Risercard：轉(zhuǎn)接卡Cardreader：讀卡器Screw：螺絲Thermalpad：散熱墊Heatsink：散熱片Rubber：橡膠墊Rubberfoot：腳墊Bag：袋子Washer：墊圈Sleeve：袖套Config：機(jī)構(gòu)Labelhi-pot：高壓標(biāo)簽Firmwarelabel：燒錄標(biāo)簽Metalcover：金屬蓋子Plasticcover：塑料蓋子Tapeforpacking：包裝帶Barcode：條形碼Tray：托盤Collecto：集線夾Holder：固定器,L鐵Connecter：連接器IDE:集成電路設(shè)備，智能磁盤設(shè)備SCSI:小型計(jì)算機(jī)系統(tǒng)接口Gasket：導(dǎo)電泡棉AGP:加速圖形接口PCI:周邊組件擴(kuò)展接口LAN:局域網(wǎng)USB:通用串形總線架構(gòu)Slim：小型化COM:串型通訊端口LPT:打印口，并行口Powercord：電源線I/O:輸入，輸出Speaker：揚(yáng)聲器EPE:泡棉Carton：紙箱Button：按鍵，按鈕Footstand：腳架部門名稱的專有名詞QSualitysystem質(zhì)量系統(tǒng)CS:CoutomerSevice客戶服務(wù)QCualitycontrol質(zhì)量管理IQC:Incomingqualitycontrol進(jìn)料檢驗(yàn)LQCineQualityControl生產(chǎn)線質(zhì)量控制IPQC:Inprocessqualitycontrol制程檢驗(yàn)FQC:Finalqualitycontrol最終檢驗(yàn)OQC:Outgoingqualitycontrol出貨檢驗(yàn)QAualityassurance質(zhì)量保證SQA:Source(supplier)QualityAssurance供貨商質(zhì)量保證(VQA)CQA：CustomerQualityAssurance客戶質(zhì)量保證PQArocessQualityAssurance制程質(zhì)量保證QEualityengineer質(zhì)量工程CE:componentengineering零件工程EE:equipmentengineering設(shè)備工程ME:manufacturingengineering制造工程TE:testingengineering測(cè)試工程PPEroductEngineer產(chǎn)品工程IE:Industrialengineer工業(yè)工程ADM:AdministrationDepartment行政部RMA:客戶退回維修CSDI:檢修PC:producingcontrol生管MC:matercontrol物管GAD:GeneralAffairsDept總務(wù)部A/D:Accountant/FinanceDept會(huì)計(jì)LAB:Laboratory實(shí)驗(yàn)室DOE:實(shí)驗(yàn)設(shè)計(jì)HR:人資PMC:企劃RD:研發(fā)W/H:倉(cāng)庫(kù)SI:客驗(yàn)PD:ProductDepartment生產(chǎn)部PA:采購(gòu)(PUR:PurchaingDept)SMT:Surfacemounttechnology表面粘著技術(shù)MFG:Manufacturing制造MIS:Managementinformationsystem資迅管理系統(tǒng)DCC:documentcontrolcenter文件管制中心廠內(nèi)作業(yè)中的專有名詞QTualitytarget質(zhì)量目標(biāo)QPualitypolicy目標(biāo)方針QI:Qualityimprovement質(zhì)量改善CRITICALDEFECT:嚴(yán)重缺點(diǎn)（CR）MAJORDEFECT:主要缺點(diǎn)（MA）MINORDEFECT:次要缺點(diǎn)（MI）MAX:Maximum最大值MIN:Minimum最小值DIAiameter直徑DIMimension尺寸LCLowercontrollimit管制下限UCL:Uppercontrollimit管制上限EMI:電磁干擾ESD:靜電防護(hù)EPA:靜電保護(hù)區(qū)域ECN:工程變更ECO:Engineeringchangeorder工程改動(dòng)要求（客戶）ECR:工程變更需求單CPI:ContinuousProcessImprovement連續(xù)工序改善Compatibility：兼容性Marking：標(biāo)記DWGrawing圖面Standardization：標(biāo)準(zhǔn)化Consensus：一致Code：代碼ZD:Zerodefect零缺點(diǎn)Tolerance：公差Subjectmatter：主要事項(xiàng)Auditor：審核員BOM:Billofmaterial物料清單Rework：重工ID：identification識(shí)別,鑒別,證明PILOTRUN:(試投產(chǎn))FAI:首件檢查FPIR：FirstPieceInspectionReport首件檢查報(bào)告FAA:首件確認(rèn)SPC：統(tǒng)計(jì)制程管制CP:capabilityindex（準(zhǔn)確度）CPK:capabilityindexofprocess(制程能力)PMP:制程管理計(jì)劃（生產(chǎn)管制計(jì)劃）MPI:制程分析DASefectsAnalysisSystem缺陷分析系統(tǒng)PPB：十億分之一Flux：助焊劑P/N:料號(hào)L/N：LotNumber批號(hào)Version：版本Quantity：數(shù)量Validdate：有效日期MIL-STD：Military-Standard軍用標(biāo)準(zhǔn)ICT:InCircuitTest(線路測(cè)試)ATE：AutomaticTestEquipment自動(dòng)測(cè)試設(shè)備MO:ManafactureOrder生產(chǎn)單T/U:TouchUp(錫面修補(bǔ))I/N:手插件P/T:初測(cè)F/T:FunctionTest(功能測(cè)試-終測(cè))AS組立P/K:包裝TQM:Totalqualitycontrol全面質(zhì)量管理MDA:manufacturingdefectanalysis制程不良分析(ICT)RUN-IN:老化實(shí)驗(yàn)HI-pot：高壓測(cè)試FMI：FrequencyModulationInspect高頻測(cè)試DPPM:DefectPartPerMillion(不良率的一種表達(dá)方式：百萬(wàn)分之一)1000PPM即為%CorrectiveAction:(CAR改善對(duì)策)ACC：允收REJ:拒收S/S：Samplesize抽樣檢驗(yàn)樣本大小SI-SIV：SpecialI-SpecialIV特殊抽樣水平等級(jí)CON：Concession/Waive特采ISO:國(guó)際標(biāo)準(zhǔn)化組織ISA：IndustryStandardArchitecture工業(yè)標(biāo)準(zhǔn)體制結(jié)構(gòu)OBA:開(kāi)箱稽核FIFO:先進(jìn)先出PDCA:管理循環(huán)Plandocheckaction計(jì)劃，執(zhí)行，檢查，總結(jié)WIP:在制品（半成品）S/O:SalesOrder(業(yè)務(wù)訂單)P/O:PurchaseOrder(采購(gòu)訂單)P/R:PurchaseRequest(請(qǐng)購(gòu)單)AQL:acceptablequalitylevel允收質(zhì)量水平LQL;Limitingqualitylevel最低質(zhì)量水平QVL:qualifiedvendorlist合格供貨商名冊(cè)AVL：認(rèn)可的供貨商清單(ApprovedVendorList)QCD:Qualitycostdelivery（質(zhì)量，交期，成本）MPM:Manufacturingprojectmanagement制造項(xiàng)目管理KPI:Keyperformanceindicate重要績(jī)效指標(biāo)MVT:ManufacturingVerificationTest制造驗(yàn)證試產(chǎn)Q/R/S：Quality/Reliability/Service質(zhì)量/可靠度/服務(wù)STL:shiptoline（料到上線）NTF:Notroublefound誤判CIP:capacityimprovementplan（產(chǎn)能改善計(jì)劃）MRB:materialreviewboard（物料審核小組）MRB:Materialrejectbill退貨單JIT:justintime（實(shí)時(shí)管理）5S:seiriseitonseisoseiketsushitsuke（整理，整頓，清掃，清潔，修養(yǎng)）SOP:standardoperationprocess（標(biāo)準(zhǔn)作業(yè)程序）SIP:Specificationinspectionprocess制程檢驗(yàn)規(guī)格TOP:TestOperationProcess(測(cè)試作業(yè)流程)WI:workinginstruction（作業(yè)指導(dǎo)書(shū)）SMD:surfacemountingdevice（表面粘著原件）FAR:failureaualysisreport故障分析報(bào)告CAR:Correctiveactionreport改善報(bào)告BPR：企業(yè)流程再造(BusinessProcessReengineering)ISAR：首批樣品認(rèn)可(InitialSampleApprovalRequest)-JIT：實(shí)時(shí)管理(JustInTime)QCC：品管圈(QualityControlCircle)EngineeringDepartment(工程部)TQEM:TotalQualityEnvironmentManagement(全面質(zhì)量環(huán)境管理)PD:ProductionDepartment(制造)LOG:Logistics(后勤支持)Shipping:(進(jìn)出口)AOQ：AverageOutputQuality平均出貨質(zhì)量AOQL：AverageOutputQualityLevel平均出貨質(zhì)量水平FMEA：failuremodeleffectivenessanalysis失效模式分析CRB:ChangeReviewBoard(工程變更會(huì)議)CSA：CustomerSimulateAnalysis客戶模擬分析SQMS：SupplierQualityManagementSystem供貨商質(zhì)量管理系統(tǒng)QIT:QualityImprovementTeam質(zhì)量改善小組QIP：QualityImprovementPlan質(zhì)量改善計(jì)劃CIP：ContinualImprovementPlan持續(xù)改善計(jì)劃MaterialQualityFeedbackSheet(來(lái)料質(zhì)量回饋單)SCAR:SupplierCorrectiveActionReport(供貨商改善對(duì)策報(bào)告)8DSheet:8Disciplinessheet(8D單)PDCA：PDCA(Plan-Do-Check-Action)(管理循環(huán))MPQ:MaterialPackingQuantity(物料最小包裝量)DSCN:DeliveryScheduleChangeNotice(交期變更通知)QAPS:QualityAssuranceProcessSheet(質(zhì)量工程表)DRP：運(yùn)銷資源計(jì)劃(DistributionResourcePlanning)DSS：決策支持系統(tǒng)(DecisionSupportSystem)EC：電子商務(wù)(ElectronicCommerce)EDI：電子數(shù)據(jù)交換(ElectronicDataInterchange)EIS：主管決策系統(tǒng)(ExcutiveInformationSystem)ＥＲＰ：企業(yè)資源規(guī)劃(EnterpriseResourcePlanning)FMS：彈性制造系統(tǒng)(FlexibleManufactureSystem)KM：知識(shí)管理(KnowledgeManagement)4L：逐批訂購(gòu)法(Lot-for-Lot)LTC：最小總成本法(LeastTotalCost)LUC：最小單位成本(LeastUnitCost)MES：制造執(zhí)行系統(tǒng)(ManufacturingExecutionSystem)MPS：主生產(chǎn)排程(MasterProductionSchedule)MRP：物料需求規(guī)劃(MaterialRequirementPlanning)MRPⅡ：制造資源計(jì)劃(ManufacturingResourcePlanning)OEM：委托代工(OriginalEquipmentManufacture)ODM：