2023年Quality中英文對照

中英文對照英文縮寫中文名稱英文全名SPC統(tǒng)計製程管制StatisticalProcessControlUSL規(guī)格上限UpperSpecificationLimitLSL規(guī)格下限LowerSpecificationLimitUCL管制上限UppercontrollimitLCL管制下限LowercontrollimitPCL前置管制中心限Per-controlCentralLimitUPCL前置管制上限UpperPer-controlLimitLPCL前置管制下限LowerPer-controlLimitCaCpPpPpkCIPContinuousImprovementProcessModelDOADeadOnArrivalIFIRInitialFieldIncidentRate.FIRFieldIncidentRateANOVA變異數(shù)分析AnalysisofVarianceBSC平衡計分卡BalancedScoredoard信賴區(qū)間Confidenceinterval管制圖ControlchartCTQ品質(zhì)關(guān)鍵CriticaltoqualityDPMO每百萬個機(jī)會的缺點(diǎn)數(shù)DefectspermillionopportunitiesDPM每百萬單位的缺點(diǎn)數(shù)DefectspermillionDPU單位缺點(diǎn)數(shù)DefectsperunitDFSS六個希格瑪設(shè)計DesignforsixsigmaDOE實(shí)驗(yàn)設(shè)計Designofexperiment製造設(shè)計DesignofmanufactringFMEA故障型態(tài)與效應(yīng)分析Failuremodeandeffectanalysis故障率FailurerateGageR&R量規(guī)重複能力與重製能力Gagerepeatability&reproducibility直方圖Histogram假設(shè)檢定HypothesistestingKM知識管理KnowledgeManagementMRP物料需求規(guī)劃Materialrequireplanning常態(tài)分派NormaldistributionQFD品質(zhì)機(jī)能展開Qualityfunctiondeployment6σ六個希格瑪SixSigmaσ,s標(biāo)準(zhǔn)差Standarddeviationσ2,S2變異數(shù)VarianceABC作業(yè)制成本制度Activity-BasedCostingBTF計劃生產(chǎn)BuildToForecastBTO訂單生產(chǎn)BuildToOrderCPM要徑法CriticalPathMethodCPM每一百萬個使用者會有幾次抱怨ComplaintperMillionCRM客戶關(guān)係管理CustomerRelationshipManagementCRP產(chǎn)能需求規(guī)劃CapacityRequirementsPlanningCS顧客滿意度CustomerSatisfactionCTO客製化生產(chǎn)ConfigurationToOrderDVT設(shè)計驗(yàn)證DesignVerificationTestingDSS決策支援系統(tǒng)DecisionSupportSystemEC設(shè)計變更／工程變更EngineerChangeEC電子商務(wù)ElectronicCommerceEMC電磁相容ElectricMagneticCapabilityEOQ基本經(jīng)濟(jì)訂購量EconomicOrderQuantityERP企業(yè)資源規(guī)劃EnterpriseResourcePlanningFMS彈性製造系統(tǒng)FlexibleManufactureSystemFQC成品品質(zhì)管制FinishorFinalQualityControlIPQC製程品質(zhì)管制In-ProcessQualityControlIQC進(jìn)料品質(zhì)管制IncomingQualityControlISO國際標(biāo)準(zhǔn)組織InternationalOrganizationforStandardizationISAR首批樣品認(rèn)可InitialSampleApprovalRequestJIT即時管理JustInTimeMES製造執(zhí)行系統(tǒng)ManufacturingExecutionSystemMO製令ManufactureOrderMPS主生產(chǎn)排程MasterProductionScheduleMRO請修(購)單MaintenanceRepairOperationMRP物料需求規(guī)劃MaterialRequirementPlanningMRPII製造資源計劃ManufacturingResourcePlanningNFCF更改預(yù)估量的告知NoticeforChangingForecastOEM委託代工OriginalEquipmentManufactureODM委託設(shè)計與製造OriginalDesign&ManufactureOPT最佳生產(chǎn)技術(shù)OptimizedProductionTechnologyOQC出貨品質(zhì)管制Out-goingQualityControlPDCAPDCA管理循環(huán)Plan-Do-Check-ActionPO訂單PurchaseOrderQA品質(zhì)保證QualityAssuranceQC品質(zhì)管制QualityControlQCC品管圈QualityControlCircleQE品質(zhì)工程QualityEngineeringRMA退貨驗(yàn)收ReturnedMaterialApprovalROP再訂購點(diǎn)Re-OrderPointSCM供應(yīng)鏈管理SupplyChainManagementSFC現(xiàn)場控制ShopFloorControlSO訂單SalesOrderSOR特殊訂單需求SpecialOrderRequestTOC限制理論TheoryofConstraintsTPM全面生產(chǎn)管理TotalProductionManagementTQC全面品質(zhì)管制TotalQualityControlTQM全面品質(zhì)管理TotalQualityManagementWIP在製品WorkInProcess

QMPGLOSSARYOFACRONYMSAFR AnnualizedFailureRateAVL ApprovedVendorListCA CorrectiveActionCET CustomerExperienceTestCLCA ClosedLoopCorrectiveActionDVT DesignVerificationTestECN EngineeringChangeNotificationEVT EngineeringVerificationTestFAE FieldApplicationEngineerFAI FirstArticleInspectionFMEA FailureModeEffectAnalysisGQAM GlobalQualityAccountManagerGR&R GaugeRepeatabilityandReproducibilityGSQE/WWSQE GlobalorWorldWideSupplierQualityEngineerIFIR InitialFieldIncidentRateIQC IncomingQualityControlJQE JointQualityEngineerPIT ProjectorIFIRTestMTBF MeanTimeBetweenFailureOBA OutofBoxAuditOQC OutgoingQualityControlOSD OnScreenProjectorPA PreventiveActionPCBA PrintedCircuitBoardAssemblyPCN ProcessChangeNotificationPDG ProductDevelopmentGroupPPID PiecePartIdentificationQMP QualityManagementPlanQPA QualityProcessAuditRSQE RegionalSupplierQualityEngineerRTS ReadyToShipSPC StatisticalProcessControlSQE SupplierQualityEngineerCAD

：

ComputerAidedDesign)計算機(jī)輔助設(shè)計。

CAM

：

ComputerAidedManufacturing)計算機(jī)輔助制造。

CAT

：

ComputerAidedTesting)計算機(jī)輔助測試。

FPC

：

(FlexiblePrintedCircuit)柔性印制電路。

PCB

：

(PrintedCircuitBoard)印制電路板。

PWB

：

(PrintedWiringBoard)印制線路板。

FTH

：

(PlatedThroughHole)通孔鍍。

SMT

：

(SurfaceMountTechnology)表面安裝技術(shù)。

SMB

：

(SurfaceMountBoard)表面安裝板。

SMD

：

(SurfaceMountDevices)表面安裝器件。

ISO

：

(InternationalOrganizationforStandardization)國際標(biāo)準(zhǔn)化組織。

IEC

：

(InternationalElectrotechnicalCommision)國際電工技術(shù)委員會組織。

IPC

：

(TheInstituteforInternationalandPackagingElectronicCircuits)美國電路互連與封裝學(xué)會(標(biāo)準(zhǔn))。

MIL

：

(MilitaryStandard)美國軍用標(biāo)準(zhǔn)。

IC

：

(IntegratedCircuit)集成電路。

LSI

：

(LargeScaleIntegratedCircuit)大規(guī)模集成電路。

JPC

：

(JapanPrintedCircuitAssociation)日本印制電路學(xué)會。

UL

：

(UnderwritersLaboratoriesINC)美國保險商實(shí)驗(yàn)室。

SMOBC：

(SolderMaskonBareCopper)裸銅線路絲印阻焊油墨。

AOI

：

(AutomatedOpticalInspection)自動光學(xué)檢測。

SPC

：

(StatisticalProcessControl)記錄制程控制。

SQC

：

(StatisticalQualityControl)記錄質(zhì)量控制

5S

:5S管理

ABC

:作業(yè)制成本制度(Activity-BasedCosting)

ABB

:實(shí)行作業(yè)制預(yù)算制度(Activity-BasedBudgeting)

ABM

:作業(yè)制成本管理(Activity-BaseManagement)

APS

:先進(jìn)規(guī)畫與排程系統(tǒng)(AdvancedPlanningandScheduling)

ASP

:應(yīng)用程序服務(wù)供貨商（ApplicationServiceProvider）

ATP

:可承諾量(AvailableToPromise)

AVL

:認(rèn)可的供貨商清單(ApprovedVendorList)

BOM

:物料清單(BillOfMaterial)

BPR

:公司流程再造(BusinessProcessReengineering)

BSC

:平衡記分卡(BalancedScoreCard)

BTF

:計劃生產(chǎn)(BuildToForecast)

BTO

:訂單生產(chǎn)(BuildToOrder)

CPM

:要徑法(CriticalPathMethod)

CPM

:每一百萬個使用者會有幾次抱怨(ComplaintperMillion)

CRM

:客戶關(guān)系管理(CustomerRelationshipManagement)

CRP

:產(chǎn)能需求規(guī)劃(CapacityRequirementsPlanning)

CTO

:客制化生產(chǎn)(ConfigurationToOrder)

DBR

:限制驅(qū)導(dǎo)式排程法(Drum-Buffer-Rope)

DMT

:成熟度驗(yàn)證(DesignMaturingTesting)

DVT

:設(shè)計驗(yàn)證(DesignVerificationTesting)

DRP

:運(yùn)銷資源計劃(DistributionResourcePlanning)

DSS

:決策支持系統(tǒng)(DecisionSupportSystem)

EC

:設(shè)計變更／工程變更(EngineerChange)

EC

:電子商務(wù)(ElectronicCommerce)

ECRN

:原件規(guī)格更改告知(EngineerChangeRequestNotice)

EDI

:電子數(shù)據(jù)互換(ElectronicDataInterchange)

EIS

:主管決策系統(tǒng)(ExecutiveInformationSystem)

EMC

:電磁相容(ElectricMagneticCapability)

EOQ

:基本經(jīng)濟(jì)訂購量(EconomicOrderQuantity)

ERP

:公司資源規(guī)劃(EnterpriseResourcePlanning)

FAE

:應(yīng)用工程師(FieldApplicationEngineer)

FCST

:預(yù)估(Forecast)

FMS

:彈性制造系統(tǒng)(FlexibleManufactureSystem)

FQC

:成品質(zhì)量管理(FinishorFinalQualityControl)

IPQC

:制程質(zhì)量管理(In-ProcessQualityControl)

IQC

:進(jìn)料質(zhì)量管理(IncomingQualityControl)

ISO

:國際標(biāo)準(zhǔn)組織(InternationalOrganizationforStandardization)

ISAR

:首批樣品認(rèn)可(InitialSampleApprovalRequest)

JIT

:實(shí)時管理(JustInTime)

KM

：知識管理(KnowledgeManagement)

L4L

:逐批訂購法(Lot-for-Lot)

LTC

:最小總成本法(LeastTotalCost)

LUC

:最小單位成本(LeastUnitCost)

MES

:制造執(zhí)行系統(tǒng)(ManufacturingExecutionSystem)

MO

:制令(ManufactureOrder)

MPS

:主生產(chǎn)排程(MasterProductionSchedule)

MRO

:請修(購)單(MaintenanceRepairOperation)

MRP

:物料需求規(guī)劃(MaterialRequirementPlanning)

MRPII

:制造資源計劃(ManufacturingResourcePlanning)

NFCF

:更改預(yù)估量的告知NoticeforChangingForecast

OEM

:委托代工(OriginalEquipmentManufacture)

ODM

:委托設(shè)計與制造(OriginalDesign&Manufacture)

OLAP

:在線分析解決(On-LineAnalyticalProcessing)

OLTP

:在線交易解決(On-LineTransactionProcessing)

OPT

:最佳生產(chǎn)技術(shù)(OptimizedProductionTechnology)

OQC

:出貨質(zhì)量管理(Out-goingQualityControl)

PDCA

:PDCA管理循環(huán)(Plan-Do-Check-Action)

PDM

:產(chǎn)品數(shù)據(jù)管理系統(tǒng)(ProductDataManagement)

PERT

:計劃評核術(shù)(Program