半導(dǎo)體詞匯縮寫表

RevisedbyPetrelat2021RevisedbyPetrelat2021半導(dǎo)體詞匯縮寫表半導(dǎo)體詞匯縮寫表A/DanalogtodigitalAAatomicabsorptionAASatomicabsorptionspectroscopyABCactivity-basedcostingABMactivity-basedmanagementACalternatingcurrent;activatedcarbonACFanisotropicconductivefilmACIafter-cleaninspectionACPanisotropicconductivepasteACTalternativecontroltechniques;actualcycletimeADCanalog-to-digitalconverterADEadvanceddevelopmentenvironmentADIafter-developinspectionADTapplieddiagnostictechniqueADTSEMApply/DevelopTrackSpecificEquipmentModelAEatomicemission;acousticemission;absoluteellipsometryAECadvancedequipmentcontrollerAECSAdvancedEquipmentControlSystem;AutomatedEquipmentControlSystemAEIafter-etchinspection;automatedequipmentinterfaceAEManalyticalelectronmicroscopyAESAugeremission/electronspectroscopyAFMatomicforcemicroscopyAFPabrasive-freepolishAgsilverA-GEMTFAdvancedGEMTaskForceAGVautomatedguidedvehicleAHFanhydroushydrogenfluorideAHUairhandlingunitAIRautomatedimageretrievalAlaluminumALDatomiclayerdepositionALEatomiclayerepitaxy;applicationlogicelementALSadvancedlightsource;advancedlow-powerSchottkyAMCairbornemolecularcontaminationAMHSautomatedmaterialhandlingsystemAMTadvancedmanufacturingtechnologyAMUatomicmassunitANNartificialneuralnetworkANOVAanalysisofvarianceAOVair-operatedvalveAPadhesionpromoterAPAadvancedperformancealgorithmAPCadvancedprocesscontrolAPCDadd-onpollutioncontroldeviceAPCFIAdvancedProcessControlFrameworkInitiativeAPCVDatmosphericpressurechemicalvapordepositionAPECadvancedprocessequipmentcontrolAPIapplicationprogramminginterface;atmosphericpressureionizationAPMatmosphericpassivationmodule;acousticplatemodeAPRDLAdvancedProductsResearchandDevelopmentLaboratoryaPSMattenuatingphase-shiftmaskAQIACCESSqueryinterfaceAQLacceptablequalitylevelArargonARaspectratioARAMSAutomatedReliabilityARCantireflectivecoatingARDEaspectratio-dependentetchingARPAAdvancedResearchProjectsAgency(seeDARPA)ARSangle-resolvedscatteringAsarsenicAS/RSautomatedstorageandretrievalsystemASAPAdvancedStepperApplicationProgramASICapplication-specificintegratedcircuitASOautomaticshutoffASPadvancedstripandpassivation;advancedstripprocessorASRautomatedsendreceiveATDFAdvancedToolDevelopmentFacilityATEautomatictestequipmentATGautomatictestgenerationATLASabbreviatedtestlanguageforallsystemsatmatmosphereATPadvancedtechnologyprogram;adenosinetriphosphate;acceptanceandtoolperformanceATRattenuatedtotalreflectanceAttattenuatedAugoldAVPadvancedverticalprocessorAVSadvancedvisualizationsystemAWEasymptoticwaveformevaluationAWISPMabovewaferinsituparticlemonitoringAWSadvancedwetstationBbillion;boronBabariumBARCbottomantireflectivecoatingBASEBostonAreaSemiconductorEducation(Council)BAWbulkacousticwaveBCbiascontrastBDEVbehavior-leveldeviationBDSBrownianDynamicsSimulationBeberylliumBEOLbackendoflineBESOIbondedandetchbacksilicononinsulatorBFbrightfieldBFGSBroyden-Fletcher-Goldfarb-ShannooptimizationalgorithmBFLbufferedfield-effecttransistorlogicBGAballgridarrayBHTBrinellhardnesstestBibismuthBiCMOSbipolarcomplementarymetal-oxidesemiconductorBIFETbipolarfield-effecttransistorBIMbinaryintensitymaskBiMOSbipolarmetal-oxidesemiconductorBISTbuilt-inself-testBITbulkiontemperatureBITEbuilt-intestequipmentBMCbubblememorycontrollerBMDbulkmicrodefectBOEbufferedoxideetchantBORbottomofrangeBOSSBookofSEMIStandards;binaryobjectstoragesystemBOXburiedoxideBPRbeamprofilereflectometry;businessprocessreengineeringBPSGboronphosphosilicateglassBPTEOSBPSGfromaTEOSsourceBrbromineBSEbackscatteredelectrondetectionBTABbumpedtapeautomatedbondingBVbreakdownvoltageCcarbonCacalciumCACIMarchitectureCAACIMapplicationsarchitectureCABCompetitiveAnalysisBenchmarkingCADcomputer-aideddesignCADTcontrolapplicationdevelopmenttoolCAEcomputer-aidedengineeringCAIcomputer-assistedinstructionCAMcomputer-aidedmanufacturingCAPScomputer-assistedproblemsolvingCARchemicallyamplifiedresistCARRIComputerizedAssessmentofRelativeRiskImpactsCASEcomputer-aidedsoftwareengineering;computer-aidedsystemsengineeringCATcomputer-aidedtestingCAWConstructionAnalysisWorkgroupCAWCcryogenicaerosolwafercleaningCBGAceramicballgridarrayCBSchemicalbottlestorageareaCBTcomputer-basedtrainingCCchipcarrier;clustercontrollerCCCceramicchipcarrierCCDcharge-coupleddeviceCCSLcompatiblecurrent-sinkinglogicCCWcounterclockwiseCdcadmiumCDcriticaldimensionCD/OLcriticaldimensionoverlayCDAcleandryairCDEchemicaldownstreametchCDEMCustomerDeliveryEnterpriseModelCDIcollector-diffusionisolationCDMCommonDeviceModelforSABCDOcontrolleddecomposition/oxidationCDRchemicaldistributionroomCDSchemicaldistributionsystemCeceriumCEcapillaryelectrophoresisCECcellevaluationchipCEEcontrolexecutionenvironmentCEMcontinuousemissionsmonitoringCER-DIPceramicdualin-linepackageCFAcomponentfailureanalysisCFCchlorofluorocarbonCFDcomputationalfluiddynamicsCFMcontamination-freemanufacturingCICcleanroominterfacechamberCIDcharge-injectiondeviceCIEcomputer-integratedengineeringCIMcomputer-integratedmanufacturingCIM-OSAcomputer-integratedmanufacturing-opensystemsarchitecture(ESPRITprogram)CIPContinuousImprovementProgramCISCenterforIntegratedSystemsCISCcomplexinstructionsetcomputerClchlorineCLCCceramicleadedchipcarrierCLICclosed-loopintensitycontrolCMconfigurationmanagement;cassettemoduleCMCcassettemodulecontrollerCMLcurrentmodelogicCMMcapabilitymaturitymodelCMOScomplementarymetal-oxidesemiconductorCMPchemicalmechanicalplanarizationCMRcommon-moderejectionratio;cancelmoverequestCNCcomputernumericalcontrol;condensationnucleuscounterCNTcarbonnanotubeCocobaltCOBchip-on-boardCOCcostofconsumablesCODECcoder-decoderCOEDcomputer-optimizedexperimentaldesignCOGScostofgoodssoldCoOcostofownershipCORBAcommonobjectrequestbrokerarchitectureCOREcompositeobjectreferenceCOSScommonobjectservicesspecificationCOTcustomer-ownedtoolingCoVcoefficientofvarianceCpprocesscapabilityCPDconcurrentproductdevelopmentCPECommunicationsCPGAceramicpingridarrayCpkprocesscapabilityindexCQFPceramicquadflatpackCQNclosed-queuingnetworkCrchromiumCRCcyclicredundancycheckCRMCost/ResourceModelCscesiumCSACIMsystemsarchitectureCSEcontrolsystemsengineeringCSFcriticalsuccessfactorCSLcurrent-steeringlogicCSMA/CDcarrier-senseCSPchip-scalepackageCSPEDconcurrentsemiconductorproductionandequipmentdevelopmentCSTCIMsystemstechnologyCSTRcontinuouslystirredtankreactorCSVcomma-separatedvariableCTCclustertoolcontrollerCTEcoefficientofthermalexpansionCTIcycletimeimprovementCTMCclustertoolmodularcommunicationsCucopperCUBcentralutilitybuildingCUBEScapacityutilizationbottleneckefficiencysystemCUIcommonuserinterfaceCUSUMcumulativesumCVcapacitance-to-voltageCVCMcollectedvolatilecondensablematerialsCVDchemicalvapordepositionCWcontinuouswaveCzCzochralskiprocessD/AdigitaltoanalogD/BdiebondingDACdigital-to-analogconverterDASdirectabsorptionspectroscopyDASSLdifferentialalgebraicsystemsolverDBMSdatabasemanagementsystemDCdirectcurrentDCAdirectchipattachmentDCATSdouble-containedacidtransfersystemDCEdistributedcomputerenvironmentDCLdigitalcommandlanguage;displaycommunicationlogDCSdichlorosilaneDDLdevicedescriptionlanguageDDMSdefectdatamanagementsystemDEDSdiscrete-eventdynamicsimulationDESdataencryptionstandard;displayequipmentstatusDFdarkfieldDFCdensifiedfluidcleanDFEdual-frequencyetchDFMdesignformanufacturingDFRdesignforreliabilityDFTdesignfortestDFYdesignforyieldDHFdilutehydrofluoricacidDIdeionized;dielectricisolationDIBLdrain-inducedbarrierleakageDICdifferentialinterferencecontrastDILdualin-lineDIPdualin-linepackageDLBIdevice-levelburn-inDLOCdevelopedsourcelinesofcodeDLSdisplaylotstatusDLTdevice-leveltestDLTSdeep-leveltransientspectroscopyDMAdirectmemoryaccess;dynamicmechanicalanalysisDMHdisplaymessagehelpsDMLdatamanipulationlanguage;displaymessagelogDMMdigitalmultimeterDMOSdiffusedmetal-oxidesemiconductorDMRdisplaymoverequestsDOdynamicoptimizationDOAdead-onalignmentDOASdifferentialopticalabsorptionspectroscopyDOEdesignofexperimentsDOFdepthoffocusDOPdioctylphthalateDPAdestructivephysicalanalysisDPMdigitalpanelmeterDPPdischarge-producedplasmaDPSRAMdual-portstaticrandomaccessmemoryDRAMdynamicrandomaccessmemoryDRAPACDesignRuleandProcessArchitectureCouncilDRCdesignrulecheckDREdestructionremovalefficiencyDRIFTSdiffusereflectanceinfraredFouriertransformspectroscopyDRTdefectreviewtoolDSAdisplaysystemactivity;dimensionallystableanodeDSCdifferentialscanningcalorimetryDSMCdirectsimulationMonteCarloDSQdownstreamquartzDSSdisplaystockerstatusDSWdirectstep-on-waferDTdynamictestDTAdifferentialthermalanalysisDTCdirectthermocouplecontrolDTLdiodetransistorlogicDTMdefecttestmonitor;delaytimemultiplier;devicetestmodule;digitalterrainmapDTMPNdefecttestmonitorphasenumberDUTdeviceundertestDUVdeepultravioletDVdesignverificationDVERdesignruleverificationDVMdigitalvoltmeterDVSdisplayvehiclestatusDWGdomainworkgroupEAPSMembeddedattenuatedphase-shiftmaskEAROMelectricallyalterableread-onlymemoryEASEequipmentandsoftwareemulatore-beamelectronbeamEBHTelectron-beamhigh-throughputlithographyEBICelectronbeam-inducedcurrentEBRedgebeadremovalECengineeringchange;equipmentcontrollerECAengineeringcapabilityassessmentECADelectroniccomputer-aideddesign;engineeringcomputer-aideddesignECAEelectroniccomputer-aidedengineeringECLemittercoupledlogicECNengineeringchangenoticeECOengineeringchangeorderECQBelectrochemicalquartzcrystalbalanceECRelectroncyclotronresonanceEDAelectronicdesignautomationEDSenergy-dispersivespectroscopyEDUequipment-dependentuptimeEDXenergy-dispersiveX-rayEDXAenergy-dispersiveX-rayanalysisEEDFelectronenergydistributionfunctionEELSelectronenergy-lossspectroscopyEEPROMelectricallyerasableprogrammableread-onlymemoryEFEMequipmentfront-endmoduleEFOCSevanescentfiber-opticchemicalsensorEFTIRemissionFouriertransforminfraredspectroscopyEFVexcessflowvalveEGEethyleneglycolethersEHSextremelyhazardoussubstanceEIequipmentintegrationEIDEquipmentInterfaceDevelopmentEIPEquipmentImprovementProgram;EquipmentImprovementProjectEISelectrochemicalimpedancespectroscopyEKFextendedKalmanfilterELFextremelylowfrequencyEMenterprisemodel;electromagnetic;electromigrationEMAequipmentmaturityassessmentEMCelectromagneticcapability;electromagneticcompatabilityEMFelectromagneticfieldEMGelectromigrationEMIelectromagneticinterferenceEMMAelectronmicroscopyandmicroanalysisEMPelectromagneticpulseEMRentermoverequestEMUelectromagneticunitEOSelectricaloverstressEOTendoftransfer;equivalentoxidethicknessEPextremepressure;electropolishEPLelectronprojectionlithographyEPRelectronparamagneticresonanceEPROMelectricallyprogrammableread-onlymemoryEPSSelectronicperformancesupportsystemEPTequipmentperformancetrackingEQUIPC/IequipmentcontrolandintegrationEQUIPRTCequipmentreal-timecontrolERAMequipmentreliabilityERMenterprisereferencemodelERNexternalrecurrentneuralnetworkERPextendedrangepyrometerERSeventreportingstandardERTemergencyresponsetimeESengineeringspecification;expertsystemESCelectrostaticchuckESCAelectronspectroscopyforchemicalanalysisESDelectrostaticdischargeESHenvironmentESMelectronicservicemanualETABExecutiveTechnicalAdvisoryBoardETQRExternalTotalQualityandReliabilityEUVextremeultravioleteVelectronvoltEWMAexponentiallyweightedmovingaverageFfluorineF/IfinalinspectionFAfailureanalysisFABfastatombombardmentFAMOSfloating-gateavalanche-injectionmetal-oxidesemiconductorFBGAfine-pitchballgridarrayFCflipchipFCMfacilitiescostmodelFCSfactorycontrolsystemFDCfaultdetectionandclassificationFDEfrequencydomainexperimentsFDSOIfullydepletedsilicononinsulatorFeironFECfabricationevaluationchipFEMfiniteelementmodelFEOLfrontendoflineFESEMfieldemissionscanningelectronmicroscopyFETfield-effecttransistorFFTfastFouriertransformFFUfilterfanunitFIfilterabilityindex;factoryintegrationFIBfocusedionbeamFIDflameionizationdetectorFIFOfirst-inFIMSfront-openinginterfacemechanicalstandardFLfuzzylogicFLOPCfloatingpointoperationsneededpercycleFLOTOXfloatinggatetunneloxideFLRTfactorylayout/relayouttoolFMforeignmaterialFMEAfailuremodeandeffectsanalysisFMMCfactorymaterialmovementcomponentFMVPFrameworkMemberValidationProjectFNNfeed-forwardneuralnetworkFOCSfiber-opticchemicalsensorFOSBfrontopeningshippingboxFOUPfrontopeningunifiedpodFOVfieldofviewFOXfieldoxideFPflashpointFPDfocalplanedeviation;flatpaneldisplayFPGAfield-programmablegatearrayFPLAfield-programmablelogicarrayFPLFfield-programmablelogicfamilyFPLSfield-programmablelogicswitchFPMSFactoryPerformanceModelingSoftwareFPROMfield-programmableread-onlymemoryFRACASFailureReportingFRAMEFailureRateAnalysisandModelingFRMBfastrampminibatchFSGfusedsilicaglassFSMfinitestatemachineFTfinaltest;FouriertransformFTAfaulttreeanalysisFTABFocusTechnicalAdvisoryBoardFTIRFouriertransforminfraredFWfullwaveFWHMfull-widthhalf-maximumFZfloatzoneGagalliumGACgranularactivatedcarbonGCgaschromatography;gravimetriccalibratorGCCgenericcellcontrollerGCDgaschromatographydistillationGCMSgaschromatographymassspectroscopyGDPPgasdriveplasmapinchGDSgraphicaldesignsystem;graphicaldesignsoftwareGegermaniumGEMGenericEquipmentModelGEMVSGEMverificationsystemGESgenericequipmentsimulatorGFCgasfiltercorrelationGFCIgroundfaultcircuitinterrupterGIDLgate-induceddrainleakageGILDgasimmersionlaserdopingGLCgasliquidchromatographyGOIgateoxideintegrityGPIBgeneral-purposeinterfacebusGSCEgassourcecontrolequipmentGTSGEMTestSystemHhydrogenHAPhazardousairpollutantHARIhighaspectratioinspectionHASThighlyacceleratedstresstestingHAZCOMHazardCommunicationStandardHBhorizontalBridgemancrystalHCIhotcarrierinjectionHCMhollowcathodemagnetronHCMOShigh-densityCMOSHCShot-carriersuppressedHDhighdensityHDLhardwaredescriptionlanguageHDPhigh-densityplasmaHDPEhigh-densitypolyethyleneHeheliumHEMhigh-efficiencymatchingHEPAhigh-efficiencyparticulateairHfhafniumHFhydrofluoricacidHgmercuryHIBSheavyionbackscatteringspectrometryHiPOxhigh-pressureoxygenHLFhorizontallaminarflowHMDShexamethyldisilizaneHMIShazardousmaterialsinventorystatementHMMPhazardousmaterialsmanagementplanHMOShigh-performanceMOS;high-densityMOSHOMERhazardousorganicmassemissionrateHOPGhighlyorientedpyroliticgraphiteHPhighpurityHPEMHybridPlasmaEquipmentModelHPIhighpressureisolationHPLhigh-performancelogicHPLChigh-performanceliquidchromatographyHPMhazardousproductionmaterials;high-puritymetalHPVhigh-pressureventHRAhumanreliabilityanalysisHRRhighramprateHRTEMhigh-resolutiontransmissionelectronmicroscopyHSQhydrogensilsesquioxaneHTOhigh-temperatureoxidationHTRBhigh-temperaturereversebiasHUPWhotultrapurewaterHVACheatingIiodineI/Oinput/outputI2LintegratedinjectorlogicI300IInternational300mmInitiativeICintegratedcircuit;InvestmentCouncil;ionchromatographyICAPinductivelycoupledargon-plasmaspectrometryICMSintegratedcircuitmeasurementsystemICPinductivelycoupledplasmaICP-AESinductivelycoupledplasmaatomicemissionspectroscopyICP-MSinductivelycoupledplasmamassspectrometryICTidealcycletimeIDDQdirectdrainquiescentcurrentIDEALinitiatingIDLinterfacedefinitionlanguageIDLHimmediatelydangeroustolifeorhealthIDSinteractivediagnosticsystemIEAionenergyanalysisIECinfusedemittercouplingIEDFionenergydistributionfunctionIERNinternal-externalrecurrentneuralnetworkIFinterfaceIGFETinsulated-gatefield-effecttransistorILBinnerleadbondILDinterleveldielectric;interlayerdielectricILSintracavitylaserspectroscopyIMintegratedmodel;integratedmetrologyIMDintermetaldielectricIMMAionmicrophobemassanalysisIMSionmobilityspectroscopyInindiumINCAMSindividualcassettemanufacturingsystemIPAisopropylalcoholIPLionprojectionlithographyIPTidealprocesstimeIriridiumIRinfraredIRASinfraredreflection-absorptionspectroscopyIRISimagingofradicalsinteractingwithsurfacesIRNinternalrecurrentneuralnetworkIRONMANImprovingReliabilityofNewMachinesatNightIRTC-1interconnectreliabilitytestchip-1ISinformationsystems;interfacespecifications;integratedsystemsISCIndustrySteeringCouncilISEMinspection/reviewspecificequipmentmodelISMinductorsupermagnetronISMTInternationalSEMATECHISPMinsituparticlemonitorISRinsiturinseISSionscatteringspectroscopyITRIInterconnectionTechnologyITRSInternationalTechnologyIVHinterstitialviaholeIVPintegratedvacuumprocessingJDPJointDevelopmentProgramJEDECJointElectronDeviceEngineeringCouncilJESSIJointEuropeanSubmicronSiliconInitiativeJICJointIndustrialCouncilJITjust-in-timeJJTJosephsonjunctiontransistorJVDjetvapordepositionKpotassium;thousandkeVkiloelectronvoltKPAkeyprocessareaKrkryptonkVkilovoltLalanthanumLAMMAlasermicro-massanalysisLAMMSlasermicro-massspectroscopyLCinductance-capacitance;liquidchromatographyLCAlifecycleanalysisLCCleadedchipcarrierLCLlowerconfidencelimitLDDlightlydopeddrainLDLlowerdetectionlimitLDPlow-densityplasmaLDPElow-densitypolyethyleneLECliquidencapsulatedCzochralskicrystalLELlowerexplosivelimitLERlineedgeroughnessLFlaminarflowLFLlowerflammablelimitLGQlinearGaussianquadraticLilithiumLIlaserinterferometryLIClinearintegratedcircuitLIDleadlessinverteddeviceLIFOlastinLIMAlaser-inducedmassanalysisLIMSlaser-inducedmassspectrometryLLCCleadlesschipcarrierLLDlowerlimitofdetectionLLNQleastlotsnextqueueLMlightmicroscopeLMMAlasermicroprobemassanalysisLOCOSlocaloxidationofsiliconLOSlossofselectivityLPClinearpredictivecoding;laserparticlecounter;lowparticleconcentration;liquid-borneparticlecounterLPCVDlow-pressurechemicalvapordepositionLPDlightpointdefectLPEliquidphaseepitaxyLPIlow-pressureisolationLPPlaser-producedplasmaLRSlaserRamanspectroscopyLSElatexsphereequivalentLSHIlarge-scalehybridintegrationLSIlarge-scaleintegrationLSMlaserscanningmicroscopeLTAlaserthermalannealLTCVDlow-temperaturechemicalvapordepositionLTOlow-temperatureoxidation/oxideLTPDlottolerancepercentdefectiveLTVlocalthicknessvariationLVlatentvariableLVDTlinearvoltagedifferentialtransducerLVIlow-voltageinverterLVSlayoutverificationofschematicLWRlinewidthreductionLWSlargewaferstudyMmillion;megaMACTmaximumachievablecontroltechnologyMALDImatrix-assistedlaserdesorptionandionizationMANmetropolitanareanetworkManagementStandardManufacturingandScienceMAPmanufacturingautomationprotocolMasterDeliverablesListMAWPmaximumallowableworkingpressureMBmachinebatchMBCmachinebathcollectionMBEmolecularbeamepitaxyMBPCmodel-basedprocesscontrolMBTCmodel-basedtemperaturecontrolMCBAmeancyclesbetweenassistsMCBFmeancyclesbetweenfailuresMCBImeancyclesbetweeninterruptsMCMmultichipmodule;manufacturingcyclemanagementMCPmastercontrolprocessor;multichippackageMCSmaterialcontrolsystemMCUmicroprocessorcontrolunit;mobilecalibrationunitMCVDmetalchemicalvapordepositionMDLminimumdetectionlimit;MD-MOSmulti-drainmetal-oxidesemiconductorMDQmarket-drivenqualityMEBSmediumenergybackscatteringspectrometryMEEFmaskerrorenhancementfactorMEMSmicroelectromechanicalsystemMERIEmagneticallyenhancedreactiveionetchingMESmanufacturingexecutionsystemsMESFETmetal-semiconductorfield-effecttransistorMETSMaterialsandEquipmentTradingServiceMeVmegaelectronvoltMFCmassflowcontrollerMFMmassflowmeterMgmagnesiumMGmanufacturedgoodsMHImaterialhazardindexMHzmegahertzMICmonolithicintegratedcircuitMIDmaterialIDMIEmagnetronionetchingMIMmetal-insulator-metalMISmetalinsulatorsiliconMLCCmultilayerceramiccapacitorMLLmodifylotlocationMLMmultilevelmetalMLRmessagelogreportMMCManufacturingMethodsCouncilMMDMicrolithographicMaskDevelopmentprogramMMICmonolithicmicrowaveintegratedcircuitMMMmaterialmovementmanagementMMMSMaterialMovementMMOmultimodeloptimizationMMOSmodifiedMOSMMSTMicroelectronicsManufacturingScienceandTechnologyMnmanganeseMNOSmetal-nitride-oxidesemiconductorMNSmetal-nitridesemiconductorMomolybdenumMOmetal-organicMOCVDmetal-organicchemicalvapordepositionMOPmodifyoperatingproceduresMOSmetal-oxidesemiconductorMOS-Cmetal-oxidesemiconductorcapacitorMOSFETmetal-oxidesemiconductorfield-effecttransistormpmeltingpointMPmassivelyparallelMP-OESmultipointopticalemissionspectroscopyMPRESmodularplasmareactorsimulatorMPUmicroprocessorunitMRPmaterialsrequirementsplanningMRP-IImanufacturingresourceplanningMSmassspectrometry;massspectroscopyMSDSMaterialSafetyDataSheetMSEMMetrologySpecificEquipmentModelMSGManagementSteeringGroupMSHAMineSafetyandHealthAdministrationMSImedium-scaleintegration;manufacturingsupportitemMSIDmassspectrometerleaddetectorMSLDmassspectrometerleakdetectorMSTABManufacturingSystemsTechnicalAdvisoryBoardMTBAmeantimebetweenassistsMTBFmeantimebetweenfailuresMTBFpmean(productive)timebetweenfailuresMTBImeantimebetweeninterrupt;meantimebetweenincidentMTOLmeantimeoffline;meantimeonlineMTSMaterialTrackingStandardMTTAmeantimetoassistMTTFmeantimetofailureMTTRmeantimetorepairMVmegavoltMVTRmoisturevaportransmissionrateMWmolecularweightMWBCmeanwafersbetweencleansMWTmonitorwaferturnerNnitrogenNasodiumNAnumericalapertureNCMSNationalCenterforNCSNetworkCommunicationStandardNDAnondisclosureagreementNDEnondestructiveevaluationNDIRnondispersiveinfraredspectroscopyNDPneutrondepthprofilingNDTnondestructivetestingNDUVnondispersiveultravioletspectroscopyNECNationalElectricCodeNESHAPNationalEmissionsStandardsforHazardousAirPollutantsNFOMnear-fieldopticalmicroscopyNGLnext-generationlithographyNinickelNILnanoimprintlithographyNIRAnear-infraredreflectionanalysisNMOSnegativechannelmetal-oxidesemiconductorNMRnuclearmagneticresonanceNNneuralnetworkNREnonrecurringengineeringNTRSNationalTechnologyRoadmapforSemiconductorsNTUnephelometricturbidityunitNVRnon-volatileresidueOoxygenOBAobjectbehavioranalysisOBEMObject-BasedEquipmentModelOBICopticalbeam-inducedcurrentOBLobject-basedlanguageOCopencassetteOCRopticalcharacterrecognitionODoutsidediameterODSozone-depletingsubstancesOEEoverallequipmenteffectivenessOEMoriginalequipmentmanufacturerOESopticalemissionspectroscopyOHToverheadtransport;overheadhoisttransportOHVoverheadvehicleOLoverlayOLBouterleadbondOLEobjectlinkingandembeddingOMoperationalmodeling;opticalmicroscopyOMAobjectmanagementarchitectureOMSopticalmassspectroscopyOMTobjectmodelingtechniqueOOobject-orientedOOAobject-orientedanalysisOODobject-orienteddesignOODBobject-orienteddatabaseOODBMSobject-orienteddatabasemanagementsystemOOPobject-orientedprogrammingOPCopticalparticlecounter;opticalproximitycorrectionOSoperatingsystemOSDorganicspin-ondielectricOSFOpenSystemsFoundationOSGorganosilicateglassOSIopensysteminterconnectionOSRMOfficeofStandardReferenceMaterialsOSSObjectServicesStandardOxoxidePphosphorousP/Tprecision-tolerancePABpost-applybakePACphotoactivecompoundPACVDplasma-assistedchemicalvapordepositionPA-FTIRphotoacousticFouriertransforminfraredspectroscopyPAGphotoacidgeneratorPALprocessautomationlanguage;programmablearraylogic;processassetlibraryPAMprocessapplicationmodulePASphotoacousticspectroscopyPAWSportableacousticwavesensorPbleadPBETPerformance-BasedEquipmentTrainingPBGAplasticballgridarrayPBLpoly-bufferedLOCOSPBSphotonbackscatteringPCpersonalcomputer;programmablecontroller;processcontrolPCADpackagingcomputer-aideddesignPCBprintedcircuitboardPCMPpost-chemicalmechanicalpolishingPCMSplasmachemistryMonte-CarlosimulationPCOphotocatalyticoxidationPCRprinciplecomponentregressionPCTprocesschangeteamPdpalladiumPDCpassivedatacollectionPDFportabledocumentformatPDSOIpartiallydepletedsilicononinsulatorPDUprotocoldataunitPDVCphase-dependentvoltagecontrastPEBpost-exposurebakePECVDplasma-enhancedchemicalvapordepositionPEDpost-exposuredelayPEDSplasma-enhanceddepositionsystemPEELSparallelelectronenergylossspectrometryPELpermissibleexposurelevelPESphotoelectronspectroscopyPETpost-etchtreatmentPETEOSplasma-enhancedtetraethylorthosilicatePFAperfluoroalkoxyPFCperfluorocarbonPFPEperfluorinatedpolyetherPGApingridarrayP-GILDprojectiongasimmersionlaserdopingPGVperson-guidedvehiclePIproportionalintegralPIDproportionalintegralderivative;process-induceddefectPIIIplasmaimmersionionimplantationPINDparticleimpactnoisedetectionPIPprocess-inducedparticlePIVpeakinversevoltage;postindicatorvalvePLAprogrammablelogicarrayPLCprogrammablelogiccontrollerPLCCplasticleadedchipcarrierPLLplasmalockloadPLSpartialleastsquares;projectionoflatentstructuresPLYphotolimitedyieldPMprocessmonitor;preventivemaintenance;processmodulePMCprocessmodulecontrollerPMCCPensky-MartensclosedcupPMIphasemeasuringinterferometerPMMApolymethylmethacrylatePMOSpositivechannelmetal-oxidesemiconductorPMSparticlemeasuringsystemPMTphotomultipliertubePMTFProductManagementTaskForcePORprocess-of-recordPOUpoint-of-usePOUCGpoint-of-usechemicalgenerationPPEpersonalprotectiveequipmentPPGAplasticpingridarrayPPIDprocessprogramidentificationPQFPplasticquadflatpackPRASparticlereactoranalysisservicesPRBpseudo-randombinaryPRBSpseudo-randombinarysequencePROMprogrammableread-onlymemoryPRSCparametricresponsesurfacecontrolPRVpersonrailguidedvehiclePSporoussiliconPSBphase-shiftingblankPSCporoussiliconcapacitorPSDpowerspectraldensity;portstatusdisplayPSGphosphosilicateglassPSIIplasmasourceionimplantationPSLpolystyrenelatexPSLSpolystyrenelatexspherePSMphase-shiftmaskPtplatinumPTABProjectTechnicalAdvisoryBoardPTCpre-andpost-processtreatmentchambersPTFEpolytetrafluorethylenePVApolyvinylacetatePVCpolyvinylchloridePVDphysicalvapordepositionPVDFpolyvinylidenefluoridePWBprintedwiringboardPWPparticlesperwaferpassQAqualityassuranceQCqualitycontrolQCMquartzcrystalmicrobalancesQDRquickdumprinseQFDqualityfunctiondeploymentQFPquadflatpackageQMSquadrupolemassspectrometryQSRqualitysystemreviewQTATquickturnaroundtimeR2Rrun-to-runRaradiumRACremoteaccessandcontrolRAIRSreflection-absorptioninfraredspectroscopyRAMrandomaccessmemory;reliabilityRAMPReliabilityAnalysisandModelingProgramRbrubidiumRBBbasesheetresistanceRBSrefractivebackscattering;RutherfordbackscatteringspectroscopyRCWArigorouscoupledwaveanalysisRDRrotatingdiskreactorRerheniumRELrecommendedexposurelimitResearchInstituteRESSFOXrecessedsealedsidewallfieldoxidationRFradiofrequency;resonancefrequencyRFIrequestforinformation;radiofrequencyinterferenceRFMradiofrequencymonitoringRFOrestrictedfloworificeRFPrequestforplan;requestforproposal;radiofrequencyprobeRGAresidualgasanalysisRGVrail-guidedvehicleRHrelativehumidityRIreliabilityimprovementRIEreactiveionetchRISCreducedinstructionsetcomputer/computingRISTruleinductionandstatisticaltestingRMOSrefractorymetal-oxidesemiconductorRMSrootmeansquare;RecipeManagementStandardRMTFRecipeManagementTaskForceRNNrecurrentneuralnetworkROreverseosmosisRoadmapforSemiconductorsROCremoteobjectcommunicationsROEreturnonequityROIreturnoninvestmentROMread-onlymemoryRPAOremoteplasma-assistedoxidationRRremovalrateRRMSEPrelativerootmeansquareerrorofpredictionRSEreactivesputteretchRSFrelativesensitivityfactorRSMresponsesurfacemethodology;responsesurfacematrixRTroomtemperatureRTArapidthermalannealRTBreal-timebackplaneRTCVDrapidthermalchemicalvapordepositionRTDresistancetemperaturedetectorRTLresistor-transistorlogic;registertransferlevelRTMrapidthermalmultiprocessingRTOrapidthermaloxidation;regenerativethermaloxidizerRTPrapidthermalprocessing/processorRTRreal-timereportingRurutheniumSsulfurS/Dsource/drainS/Nsignal-to-noiseSAsurfacearea;subresolutionassist;structuredanalysisSAMscanningaugermicroscopySATsprayacidtoolSAWsurfaceacousticwaveSbantimonySBstrongbaseionexchangeSC1StandardClean1SC2StandardClean2SCAsurfacechargeanalysisSCALESEMATECHCellApplicationLearningEnvironmentSCALPELscatteringwithaperturelimitedprojectionlithographySCCstrategiccellcontrollerSCCSsourcecodecontrolsystemSCEshortchanneleffectsSCFsupercriticalfluidSCIsurfacechargei