汽車科技大未來及先進(jìn)測試綜覽

汽車科技大未來及先進(jìn)測試綜覽May20162KeysightataGlance

Unlockingmeasurementinsightsfor75years1939–1998:Hewlett-PackardyearsAcompanyfoundedonelectronicmeasurementinnovationGrewsuccessfullyasaPremierTestandMeasurementcompany.HPIntroducedtheearlyComputersandPrinters,andcapturedhugegrowth1999–2013:AgilentTechnologiesyearsAgilentTechnologiesspunofffromHP,becametheWorld’sPremierMeasurementCompany.InSeptember2013,Agilentannouncedthespinoffofitselectronicmeasurementbusiness.2014:KeysightbeginsoperationsKeysightTechnologieswasspunofffromAgilenton1stNov2014,asanindependentcompanyfocused100%ontheelectronicmeasurementindustry..BillHewlettandDavePackard’svisionlaunchedSiliconValleyandshapedourpassionfor“firsts”75yearsago.Todaywearecommittedtoprovideanewgenerationof“firsts”–software-orientedsolutions–thatcreatevalueforourinvestorsandvaluedinsightsforourcustomers.REVENUEINFY14$2.9billionEMPLOYEES9,600PRESIDENTandCEORonNersesianGLOBALHEADQUARTERSSantaRosa,CaliforniaCUSTOMERLOCATIONS100+countriesLOCATIONSU.S.,Europe,AsiaPacificNYSEKEYSKeysightProfileFY14$2.9billionrevenue|19.1%operatingmargin|31%ROIC|bestinclassfinancialprofileCommunicationsIndustrial,computer,semiconductorAerospace/defenseNon-GAAPmeasure.SeereconciliationtoGAAPfinancialmeasures.KeysightProfile3KeysightinElectronicMeasurement

Theindustryleader

KeysightProfile4MarketLeadership

Technologycorefuelstransformationtosoftware-orientedsolutions

CorePlatformsLeadershipPositionElectronic

Design

AutomationHighestperformancedesignsoftwareusedby2/3oftheworld’sRF/MicrowavedesignersNetwork

AnalyzersHighestperformance,broadestoffering,includingindustry-leadingPNA-XmicrowavenetworkanalyzersSignal

AnalyzersHighestperformancesignalanalyzerfamily,includingtheflagshipPXAX-SeriesSignal

SourcesHighestperformancesignalgeneratorsledbytheindustry-standardPSGperformancesignalgeneratorOscilloscopesProductleadershipinhigh-performanceoscilloscopesviaproprietarytechnologyandapplicationexpertiseOneBoxTestersTwonewR&D(UXM)andmanufacturing(EXM)platformsfor4GandbeyondAgendaAutomotiveTrendsKeysightinEnergy&AutomotiveKeysightinEnergy&Automotive5Safety1.23MRoadDeathsCommunication/ConvenienceEnvironment+50%CO,NOxEmissionDataSource:WHO,USEPAMoreCarstoComeontoRoads!-Automotiveproduction:80Min2013,107Min2020MarketDriversKeysightinEnergy&Automotive6AutomotiveSafety1.23MRoadDeathsCommunication/ConvenienceEnvironment+50%CO,NOxEmissionDataSource:WHO,USEPAMarketDriversKeysightinEnergy&Automotive7AutomotiveWireless/HighSpeedDigitalWireless/RF/mmWave/DigitalPower/EnergyADAS

先進(jìn)駕駛輔助系統(tǒng)Semiconductor車用半導(dǎo)體EV/HEV電動車(電池/充電)BMS電池管理系統(tǒng)ConnectedCar

車連網(wǎng)V2V/V2XWirelessCharging無線充電+40%ofvehiclestobeconnectedby2030

Theautomotivechipsmarketisprojectedtogrow6.1%

to$27.9Bin2014.SalesofchipsforADAS,willincreaseanaverageof13%ayearthrough202011.4%(2012)to60.1%(2017)growthsofglobalOEMconnectedcarsystempenetration;+80%inUSandWestEuropeby201747%annualgrowthofAutomotiveRadar,risingto28.2Munits($1.2B)by2018$14.4B(CAGR12.4%)by2016ofthetotalin-carinfotainmentmarket8M(2014),23M(2015),and45Mby2017ofwearabledeviceshipmentsStatisticsofMarketForecastEnergy&AutomotiveTrends

KeysightinEnergy&Automotive8MajorBenefitsof

ApplyingAdvancedElectronicTechnologiesIncreaseSafetyImproveEnvironmentEnhanceCommunication/ConvenienceWireless,RF,mmWave,Digital,PowerManagementsExamplesofEmergingTechnologiesSmartGridBatteryManagementEV/HEVAutomotiveElectronics/RadarConnectedCarSafetyEnvironmentCommunication/ConvenienceEnergy&AutomotiveMarketModelSemiconductor

/ComponentsSmartGrid/EnergyconsumptionBatteries/BMSHEV/EVGeneralAutomotiveElectronicAutomotiveRadarConnectedCarR&DMfgEngineControlBodyControlSafetyElectronicsInstrumentClusterCarNetworkingSensorElectronicsCabletestChargingStationInverter/motordriveConverterCars,TrucksSolarpowerstorageUPSSatellitePCDUsV2V/V2XcommunicationseCall

InfotainmentGPSAutonomousDrivingCar

RKE/TPMSEMI/EMC

WirelessChargingAdaptiveCruiseControlLineDeparturewarningBlindspotdetectionReartrafficcrossingalertMOSFETIGBTSiCGaNThyristor/IGCTSmartMeterSmartappliancesDCdistributionPowerConvertersRegen.brakingSolarInverterVariablefreq.DriveWindInverterUPSMaterialScienceAutomotiveMarketEnergyMarketProduction/FunctionalTestInnovations(SmartBench)AgendaKeysightinEnergy&Automotive11AutomotiveTrendsKeysightinEnergy&AutomotiveHighPowerSemiconductor&ComponentRequiredhighefficiency,safetyandreliabilityunderextremeconditionsCan‘tfailatanysituationHighoperatingcurrent&voltage(e.g.200A,650V)Functioninextremetemperature(e.g.-40°Cto+150°C)HigheroperatingfrequencyforlighterandsmallermoduleSiC/GaNforhigherefficiency&widertemperaturebudgetHowtotestthesemiconductordevices/powercomponentswithrealoperatingconditionstoverifyrealperformanceandvariation?TestingwithrealoperatingconditionsincludinghighAmpere,Voltage,andextremetemperatureHowaccuratelyandeasilytoselectbestsemiconductordevicesinhighfrequencyswitchingconverterera?CapacitanceandgatechargethatdictatepowerlossesDesignandTestChallenge/RequirementPowerDevice(Wafer)PowerDevice(Discrete)PowerModuleInverter/ConverterPowerElectricCircuitHighPowerSemiconductor&ComponentSolutionsforDifferentTestNeedsUniqueIntegratedandRealTimePowerSemiconductorCharacterizationSolutions!B1505APowerDeviceAnalyzer/CurveTracerExtensivecurrent/voltagerangeto1500A/10kV,-50℃to+250℃PreciseandAutomatedcapacitancetestForPowersemiconductormanufacturersForpowerelectronicsengineersusingpowerdevicesintheirproducts

B1506APowerDeviceAnalyzerforCircuitDesignRealconditiontest:3kV,upto1500A,-50℃to+250℃AutomaticandeasytouseB1507APowerDeviceCapacitanceAnalyzerNon-linearcapacitancetestwithupto3kVbiasIntuitivesoftwareU5855ATrueIRThermalImagerNon-contactdevicetemperaturecharacterizationwithfineresolutionof320x230pixelsPowerConvertersOptimizetheefficiencyandincreasethereliabilityofPowerConverters(E.g.SolarInverter,WindInverter,DCDistribution)withlowmaintenanceneedsReliabilityofPowerConverterplayskeyroleofLevelizedCostofEnergy(LCOE)OptimizingefficienciesofInverter,DCtoDCConverter,RectifieriscriticalsuccessfactorforPowerConvertingHandlevaryingandchangingcertificationrequirementFlexibledesignandtesttoolsarerequiredKeysightinEnergy&Automotive14DesignandTestChallenge/RequirementPowerDeviceEvaluationSimulation,DesignandDebugDesignValidation/CertificationMfg.PowerConvertersSolutionsforDifferentTestNeedsN8900SeriesPowerSuppliesB1506APowerDeviceAnalyzerforCircuitDesignE4360AModularSolarArraySimulatorSimulationSWInfiniiVisionOscilloscopePA2200PowerAnalyzer34970/72DataAcquisition34461ATruevoltDMMN6900/7900DCPowerSuppliesAccurateandFlexiblePowerConverterDesignandTestSolutionstoIncreaseEfficiency&Reliability,andOptimizeLevelizedCostOfEnergy!ElectricVehicle&HybridElectricVehicleIncreaseefficiency&reliability,andoptimizethepowerusageofvariousEV/HEVpowerconversionsInverters/MotorDrivesDCtoDCConvertersOn-BoardChargersChargingStationandEquipmentKeysightinEnergy&Automotive16DesignandTestChallenge/RequirementPowerdeviceevaluationSimulation,designanddebugDesignvalidation/certificationMfg.ElectronicVehicle&HybridElectronicVehicleSolutionsforDifferentTestNeedsN8900SeriesPowerSuppliesB1506APowerDeviceAnalyzerforCircuitDesignSimulationSWInfiniiVisionOscilloscopePA2200PowerAnalyzer34970/72DataAcquisition34461ATruevoltDMMN6900/7900DCPowerSuppliesKeysightSystemsAccurateandFlexibleEV/HEVDesignandTestSolutionstoIncreaseEfficiency&Reliability,OptimizePowerUsage,andGuaranteeManufacturingQuality!M9185APXI8/16-ChannelDACConnectedCarVerifyvariousautomotivewirelesstechnologiesfordesign&testlifecycleConnectedCar(V2V,V2X,eCall)InfotainmentsystemWirelesschargingMoreapplications/featuresDesignandTestChallenge/RequirementKeysightinEnergy&Automotive18ConnectedCarVerifyvariousautomotivewirelesstechnologiesfordesign&testlifecycleDesignandTestChallenge/RequirementExamplesofAutomotiveWirelessTechnologiesCellular5GLTE-Advanced,LTEFDD/TDDHSPA+,W-CDMA,1xEV-DOGSM/EDGE/EDGE,CDMA,TD-SCDMAWirelessconnectivity802.11a/b/g/n/ac/pBluetoothuptoVer.4.2NearFieldCommunication(NFC)/EMVCoGNSSGPS,Galileo,GLONASS,Beidou,SBAS,QZSSBroadcastingandWirelessChargingDigitalvideoBroadcast:FMradio,ISDBTmmQi(WPC),Rezence(AirFuel?Alliance,newnameofA4WP/PMAmergence)ConnectedCarVerifyvariousautomotivewirelesstechnologiesfordesign&testlifecycleDesignandTestChallenge/RequirementExamplesofAutomotiveWirelessTechnologiesCellular5GLTE-Advanced,LTEFDD/TDDHSPA+,W-CDMA,1xEV-DOGSM/EDGE/EDGE,CDMA,TD-SCDMAWirelessconnectivity802.11a/b/g/n/ac/pBluetoothuptoVer.4.2NearFieldCommunication(NFC)/EMVCoGNSSGPS,Galileo,GLONASS,Beidou,SBAS,QZSSBroadcastingandWirelessChargingDigitalvideoBroadcast:FMradio,ISDBTmmQi(WPC),Rezence(AirFuel?Alliance,newnameofA4WP/PMAmergence)ConnectedCarWirelessChargingUniqueS/WMode-1:Real-timeanalysisDisplayreal-timemeasurementresultsofpowertransferefficiency.SourcevoltageandloadimpedancecanbedefinedbyusersInputCurrent(A)OutputCurrent(A)OutputVoltage(V)PowerTransferEfficiency(%)Mode-2:2D/3DsimulationDisplaysimulatedresultsin2Dor3Dbysweepingoneortwoofthefollowingparameters

?R

?X

?FrequencyUsefulforR&DtoevaluatethedependencyoftheloadimpedanceWirelessPowerTransferAnalysisWirelessPowerTransferAnalysisE5072A/E5061B/E5063AOption00622SourcevoltageandloadimpedancecanbeuserdefinedDisplayreal-timemeasurementresultsofpowertransferefficiency.ResonatorCouplingEfficiency(RCE)measurementsavailable.Displaysimulatedresultsin2D/3Dbysweepingoneortwoofthefollowingparameters:?R

?X

?FrequencyUsefulforR&Dengineerstoevaluatetheloadimpedancedependency.Mode-1:Real-timeanalysisMode-2:Advanced2D/3DsimulationMeasuresuptofourparametersatthesametimeSelectparametersforanalysis,including.couplingefficiency.MaximumpowertransferefficiencyGCAutoUpdateWPT(WirelessPowerTransfer)(E5072A/E5061B/E5063AOpt.006)PTU(Tx)PRU(Rx)APPBLEWiFi充電找尋無線充電優(yōu)惠推播彈跳廣告CloudServerO2O無隔空充電(需破壞桌面)支援1臺充電擺放限制可隔空充電(不破壞桌面)支援多臺充電無擺放限制WirelessCharging–underCSG/WDO(WWLead：KurtPhilipsen)EcosystemFerriteCoilRDHModuleSystemSIResearchTestLabsCTD-Kobe/TAO:NA,LCR,Attenuator,AccessoriesOPD:Scopes,HVandCurrentProbesGEM:FunctionGen,DMMs,etc.One-KeysightOffer(SeeAutoExpress)InternalOnlyInternalOnlyInternalOnlyInternalOnlyInternalOnlyInternalOnlyConnectedCarSolutionsforDifferentTestNeedsPowerofHW+SW+PeopletoSolvetheChallengesovertheWirelessDesignandTestLifecycle!Solutionexample:802.11phttp:///litweb/pdf/5992-1353EN.pdf?id=2703079WorldHealthOrganization(WHO):2,500peoplearekilledonroads/day.bettertrafficmanagement,vehicle-to-vehicle(V2V)andvehicle-to-infrastructure(V2I)communicationSolutionexample:802.11adhttp:///litweb/pdf/5992-1429EN.pdf?id=2715758VeryHighThroughput(VHT)tomeeteverincreasingbandwidthrequirementsforapplicationssuchaswirelessdisplay,distributionofHDTVandrapidupload/downloadoffiles.802.11b11Mb/s,2.4GHzband802.11g54Mb/s,2.4GHzband802.11n(MIMO)600Mb/s,2.4GHz,5GHzband802.11ac(4X4,80MHzBW)1.56Gb/scouldbe(8X8,160MHzBW,256QAM)6.93Gbp/s,5GHzband802.11ad(2GHzBW)>6.75Gb/s,60GHzbandAutomotiveRadarMeasurehighfrequencyandwidebandwidthautomotiveradarperformanceinaccurate,flexible,andcosteffectivewaymmWaveWidebandwidthFMCW,PulsemodulatedsignalsDesignandTestChallenge/RequirementAutomotiveRadarsExampleofAutomotiveRadarBlockDiagramAutomotiveRadarSolutionsforDifferentTestNeedsPNANetworkAnalyzersBandedmmWSolutionE-BandPowerSensorandMeterS-SeriesOscilloscope89600VSASWwithFMCWoptionX-SeriesSignalAnalyzerE8267DPSGVectorSignalGeneratorM8190AArbitraryWaveformGeneratorADS/SystemVueSimulationSW16900SeriesLogicAnalyzerPXIModularVSA/VSG/Digitizer/NetworkAnalyzerMostFlexibleandWideBandwidthmmWaveSignalGeneration&AnalysisSolutionswithPrecisePowerandComponentMeasurements!AutomotiveRadarSolutionsforDifferentTestNeedsCompactIntegratedRadarTargetSimulatorAllowsFastTestTimesandSavesFloorSpaceandCostforAutomotiveRadarManufacturing!SimulationSWFrequencyBand:76-77GHz1GHzBandwidthSingleTargetRangeupto250mRCSrange64dBwith0.1dBstepRadarTargetSimulatorAutomotiveSerialBusAutomobilesutilizeabroadrangeofdifferenttypesofserialbusesfordifferentpurposesExamples:CAN,CAN-FD,FlexRay,SENT,MOST,LIN,BroadR-Reach,APIX2,CXPI,etc.AutomotiveserialbussesarealsousedinawidevarietyofheavymachineryduetothelongtransmissionlengthsDesignandTestChallenge/RequirementAutomotiveSerialBusSolutionsforDifferentTestNeedsPowerful&ExtensiveOscilloscopeAnalysisCapabilitiesfortheLatestTechnologiesintheAutomotiveElectronicsMarket.Source:/webapp/sps/site/application.jsp?code=APLINCLPRMLL#BscanTestVTEPVTEPVoltageVoltageForwardCurrentVoltageSPI/I2CColorandIntensityTestVoltageVTEPFrequencyVCLVTEPBscanVoltageVTEPVoltageVoltageVoltageProductionandFunctionalTest:In-CircuitTestAccurate,reproducibleandrepeatedresultsAddictivenesstogrowingboardcomplexityStableandconsistenttestsagainstnumerousvariantsperrun,stretchesoveryearsGuaranteedsupportforlonglife/cycle

DesignandTestChallenge/RequirementSource:/solution/digital_radioDashPanelBoardAudioBoardProductionandFunctionalTest:In-CircuitTestScalableplatformtogrowwithtestneedsBreadthofICTsolutionstomeetfuturechallengesPatentedshort-wiretechnologyensurestransportability,repeatabilityandstabilityThroughputmultipliertechnologydoublesthroughputwithoutincreaseinhardwareinvestment33SolutionsforDifferentTestNeedsScalableSystemstoMeetCurrentRequirements&FutureEvolutionsofAutomotiveTesting!ProductionandFunctionalTest:In-CircuitTestVerifyvariousElectronicControlmodules/unitswithaccuracy,highpowerinput/load,andprecisestimulusineasywaywhilemaximizingproductionefficiencywithguaranteedtestaccuracyE.g.BodyControlModules(BCM),ElectronicControlUnit(ECU)ExtremescalabilityintestsystemsforvariouslowvolumemodulesReliabilityandrepeatabilityStandardizedfinaltestGlobalandtransferablesystemsandsupportsFastertimetomarketLonglifesupport/cycleDesignandTestChallenge/RequirementFunctionalTest SolutionsforDifferentTestNeedsProvenWorldwideLeadershipinAutomotiveBoard/ModuleTestSolutionsCoveringIn-CircuitandFunctionalVerification!M91xxxFamilyofAutomotivePXITestSolutionsInnovation(SmartBench)ExponentialInnovationshappeningintheEnergy&AutomotiveindustriesInternetofThingsNewEnergyGeneration/Storage/ConsumptionAutonomousDrivingCarsKeysightinEnergy&Automotive36DesignandTestChallenge/RequirementInnovation(SmartBench)ExponentialInnovationshappeningintheEnergy&AutomotiveindustriesHowtodriveseamlesscollaborationsfortheinnovationsfromtheglobalteamsandthesuppliers?KeysightinEnergy&Automotive37DesignandTestChallenge/RequirementGlobalResearchCenterslocatedinvariousregionsandcountriesareworkingtogetherfortheInnovationsinbroadapplicationsIntegratedtheentireplayersunderthesameDesignandTestenvironmentsarecriticaltosuccessoftheInnovations

<ExampleofTheCollaborationsfromGlobalResearches:KeysightDivisions>PowerfulCombinationofHW+SWtoDeliverInnovativeWaysofLocalBenchandGlobalTeamCollaborationbyIntegratingtheEntireEnvironmentwithOneGraphicalUserInterfaceofBenchVue!Innovation(SmartBench)SolutionsforDifferentTestNeedsBenchVueOverviewimageofde-packagedZ-axisaccelerometer(Right)andzoomedinviewoftopsidecontactlocations(Left).MaterialScienceIncreasedcomponentscountwithsemiconductors,MEMSandenergystoragerequirenano-scaleunderstandingofperformanceandsuitabilityQuantificationofqualityandwearofmechanicalcomponentsoverlifetimeUnderstandingtheelectricalpropertiesofcomponentsinenergystorageandtransport(batteries,ionicmembranes,lifetime)ExamplesofTestChallengesWearandhardnesstestingofmetalsandotherparts(e.g.gearandengineparts,gyroscopicdevices,fixturesandfittings)Scratchandhardnesstestingofpaints,glasses,andcoatingsSafetyandreliabilityoflithiumionbatteriesStudyfailuremodesandreliabilityofMEMSDevelopnovelmaterialsDesignandTestChallenge/RequirementMaterialScienceScanningElectronMicroscopes(SEM)Highresolutionimaginginacompact,convenientpackage1keVlowenergyimagingprovidesoptimalperformanceonallsamplesLargeSEMperformanceinapackagesuitableforremotelabuse10nmresolutionformaterialscienceresearch,andindustrialapplications.SolutionsforDifferentTestNeeds8500SEMUniqueTable-TopInstrumentwithHighestResolutionImagingatLowVoltageswithoutSampleCoating!GCAutoUpdate41NMONanoSolutionsNanoIndenter奈米壓痕機(jī)(orNHT,NanoindentationTester)AFM原子力顯微鏡(AtomicForceMicroscopes)FE-SEM場效發(fā)射式掃描電子顯微鏡

(Field-EmissionScanningElectronMicroscope)KeysightModelsG200($250-420K)5500AFM($125-200K)9500AFM(New,$185-300K)5600AFM($160-350K)8500B($165-195K)TargetMarket壓下去一段時間拉起,看硬度、彈性系數(shù)、破裂韌性、連續(xù)勁度等參數(shù)Automotive(Tire/Rubber/PartsCoating),Semiconductor,MEMS,DRAMpackaging,SolderReliability,ThinFilm,Polymer,Academic/GovtResearch,GeneralMaterial,etc.量測原子表面或奈米結(jié)構(gòu)、MEMS奈米切削與奈米結(jié)構(gòu)制造、生醫(yī)應(yīng)用如蛋白質(zhì)壓印等Automotive,Semiconductor,MEMS,LCD,Memory,LiPoBattery,MEMS,LED,Polymer,BiologicalImaging,Academic/GovtResearch奈米材料、半導(dǎo)體、封裝、印刷電路板、BGA、光盤片、LED、金屬、陶瓷等之表面、故障分析Automotive,Semiconductor,MEMS,LCD,Memory,LiPoBattery,MEMS,LED,Polymer,BiologicalImaging,Academic/GovtResearchStrengthHighperformanceNanomechanicalcharacterizationFastTestSpeedFlexibilitytomakecustommethodsEnvironmentalcontrol,includingheatingandcoolingElectrochemicalapplicationsElectricalcharacterizationVari