電路板制作流程PPT

1、,P C B PRESENTATION,P C B PRESENTATION,P C B PRESENTATION,PCB Manufacturing Process Flow,PCB Manufacturing Process Flow,PCB Manufacturing Process Flow,April,20,1999 JOHNNY HSU,流 程 圖 PCB Mfg. FLOW CHART,UPDATED: 1999,04,16,顧 客 (CUSTOMER),工 程 製 前 (FRONT-END DEP.),裁 板 (LAMINATE SHEAR),內(nèi) 層 乾 膜 (INNERLAY

2、ER IMAGE),預(yù) 疊 板 及 疊 板 (LAY- UP ),通 孔 電 鍍 (P . T . H .),液 態(tài) 防 焊 (LIQUID S/M ),外 觀 檢 查 (VISUAL INSPECTION ),成 型 (FINAL SHAPING),業(yè) 務(wù) (SALES DEPARTMENT),生 產(chǎn) 管 理 (P&M CONTROL),蝕 銅 (I/L ETCHING),鑽 孔 (PTH DRILLING),壓 合 (LAMINATION),外 層 乾 膜 (OUTERLAYERIMAGE),二次銅及錫鉛電鍍 (PATTERN PLATING),蝕 銅 (O/L ETCHING),檢 查

3、(INSPECTION),噴 錫 (HOT AIR LEVELING),電 測(cè) (ELECTRICAL TEST ),出 貨 前 檢 查 (O Q C ),包 裝 出 貨 (PACKING&SHIPPING ),曝 光 (EXPOSURE),壓 膜 (LAMINATION),前處理(PRELIMINARY TREATMENT),顯 影 (DEVELOPIG),蝕 銅 (ETCHING),去 膜 (STRIPPING),黑 化 處 理 (BLACK OXIDE),烘 烤 (BAKING),預(yù) 疊 板 及 疊 板 (LAY- UP ),壓 合 (LAMINATION),後處理 (POSTTREAT

4、MENT),曝 光 (EXPOSURE),壓 膜(LAMINATION),二次銅電鍍 (PATTERNPLATING),錫 鉛 電 鍍 (T/L PLATING),去 膜 (STRIPPING),蝕 銅 (ETCHING),剝 錫 鉛 (T/L STRIPPING),塗 佈 印 刷 (S/M COATING),預(yù) 乾 燥 (PRE-CURE),曝 光 (EXPOSURE),顯 影 (DEVELOPING),後 烘 烤 (POST CURE),多層板內(nèi)層流程 (INNER LAYER PRODUCT),MLB,全 板 電 鍍 (PANEL PLATING),銅 面 防 氧 化 處 理 (O S

5、P (Entek Cu 106A),外 層 製 作 (OUTER-LAYER),TENTING,PROCESS,鍍 金 手指 (G/F PLATING),鍍 化 學(xué) 鎳 金 (E-less Ni/Au),For O. S. P.,選 擇 性 鍍 鎳 鍍 金 (SELECTIVE GOLD),印 文 字 (SCREEN LEGEND ),網(wǎng) 版 製 作 (STENCIL),圖 面 (DRAWING),工 作 底 片 (WORKING A/W),製 作 規(guī) 範(fàn) (RUN CARD),程 式 帶 (PROGRAM),鑽 孔 , 成 型 機(jī) (D. N. C.),底 片 (MASTER A/W),磁

6、片, 磁 帶 (DISK , M/T),藍(lán) 圖 (DRAWING),資 料 傳 送 (MODEM , FTP),A O I 檢 查 (AOI INSPECTION),除 膠 渣 (DESMER),通 孔 電 鍍 (E-LESS CU),DOUBLE SIDE,前處理(PRELIMINARY TREATMENT),前處理(PRELIMINARY TREATMENT),前處理(PRELIMINARY TREATMENT),全面鍍鎳金 (S/G PLATING),雷 射 鑽 孔 (LASER ABLATION),Blinded Via,顯 影 (DEVELOPIG),P 2,( 1 ) Front-

7、end Process (Tooling),P 3,( 2 ) 多 層 板 內(nèi) 層 製 作 流 程,MLB,DOUBLE SIDE,Blinded Via,P 4,( 3 ) Outer Layer Process Flow,P 5,For O. S. P.,( 4 ) Surface Finished & Final Inspection,P 6,Typical PCB Manufacturing Process,1. （基板）THIN CORE,2. （壓膜）Dry Film Resist Coat,P 7,Typical PCB Manufacturing Process,4. （顯影）

8、Develop,3. （曝光）Expose,P 8,Typical PCB Manufacturing Process,5. （蝕刻）Etch,6. （剝膜）Strip Resist,P 9,Typical PCB Manufacturing Process,7. （疊合）Lay-up,8. （壓合）Lamination,P 10,Typical PCB Manufacturing Process,9. （鉆孔）Drilling (Primary),10. （PTH&鍍銅）PTH & Copper Deposition,P 11,Typical PCB Manufacturing Proces

9、s,11. （外層壓膜）Dry Film Lamination (Outer layer),12. （曝光）Expose,P 12,Typical PCB Manufacturing Process,13. （顯影）Develop,14. （鍍二銅）Pattern Plating,P 13,Typical PCB Manufacturing Process,15. （鍍錫鉛）Tin Plating,16. （剝膜）Film Stripping,P 14,Typical PCB Manufacturing Process,15. （蝕刻）Etch,16. （剝錫鉛）Tin Stripping,P

10、 15,Typical PCB Manufacturing Process,18. （表面處理）Surface Finished (Electroless Ni/Au , HAL),17. （防焊）Solder Mask (Spray Coating),P 16,Lay-up Structure,. . .,P 17,1.下料裁板 Laminate Shear (Panel Size),2.內(nèi)層板壓乾膜 Dry Film Resist Coat (Inner Layers),P 18,3.曝光 Expose,4.曝光後 After Expose,P 19,5.內(nèi)層板顯影 Develop,6.酸

11、性蝕刻 Power/Ground/Signal (Etch),P 20,8.黑化 Oxide Treatment,7.去乾膜 Strip Resist,P 21,9.疊板 Lay-up,P 22,10.壓合 Lamination,11.鑽孔 (Drill & Deburr) (P.T.H.& Blind Via),P 23,12.鍍通孔及一次電鍍 Desmear & Copper Deposition,13.外層壓膜 D/F Photo Resist Coat,P 24,14.外層曝光 Expose (Outer-Layer),15.曝光後 After Expose,P 25,16.外層顯影 Develop,17.線路蝕刻(酸性蝕刻) (Etch),P 26,18.去乾膜 Strip Resist,19.防焊 Solder Mask