導(dǎo)光板熱壓加工技術(shù)

1、(Roger Hsu)導(dǎo)導(dǎo)光光板板2010轉(zhuǎn)熱熱印壓壓技-03術(shù)加加-24部工工技技術(shù)術(shù)許建宏Highly Conf identialOutlineHighly Conf identialHighly Conf identialIntroductionHot Embossing ProcessExam p l e:MattestamperPMMAV-corestamperBoth sides of the work piece can be molded withstructure .Highly Conf identialFlow chart板板材材切切割割保保護護膜膜移移除除壓壓Highl

2、y離離加加縮縮冷冷成成模模熱熱卻卻形形Conf identialPolymersThermosetsThermoplasticsElastomer sThermosetsThermoplasticsElastomer samorphousA m orp h ou sA m orp h ou sCrysta l lin eCrysta l lin eThermoplastics(Semi)Cr ystalline polymers ( e.g. PE, PP, ny lon, etc.Amorphous polymers(e.g. PS,PMMA, PC,ABS, etc.crystalline

3、端端面面機機械械拋拋光光雷雷刀刀沖沖射射具具壓壓加加工工 模模仁仁雙雙/治治面面具具貼貼保保準準護護備備膜膜 HotHot EmbossingHighlyEmbossingConfidentialHighly Conf identialGlass Transition Temperature ()Tg : glassy amorphous polymers become flexible as a result of theonset of segmental motion.Melting Point ()Tm : Temperature at which total chain mobili

4、ty occurs (TmTg)At Tg, the amorphous region changes from a hard and glass-like stateto a rubbery state.The amorphous regions : respond to Tg.The crystalline regions: usually in the form of spherulites melt at a specific temperature, the melting point (Tm)高分子材料特性Highly Conf identialT g熔化溫度T fTg玻璃轉(zhuǎn)換溫度

5、Tf T gTg for common amorphouspolymersPS 100 CPC 150 CPMMA 105 CRigid PVC 83 CTgHighly Conf identialPVT Characteristics for Amorphous ResinsI ncreasi ngPressu reAP - Pressure熱機械曲線SpecificVolumeVV - SpecificVolumeBT - TemperatureTem peratu reA: Polymer melt into themold high temp and high pressureB: P

6、art solidifies at lower temp and lower pressure specific volume decreasesV :volume shrinkageHighly Conf identialHot Embossing Machine CategoriesHighly Conf identialHE TechnologyHot EmbossingTechnology/10Highly Conf identialHE TechnologyHeat Co n d uct io nSt r engt h T em p erat ureDurabilit yHE M o

7、ldAccuracy St amp erVa cuu mHighly Conf idential (,)Highly Conf idential (,)板材品質(zhì) 厚度均勻性 異物刮傷要求高加熱及冷卻之效率和耗能問題需要前處理及後處理,程序高壓力下有高轉(zhuǎn)寫率但模具模仁壽命縮短良率問題 : Cycle time of heating and cooling plus 產(chǎn)material能 handling熱壓製程之顧慮點Highly Conf identialOutlineHighly Conf idential/目的建評暸立估解產(chǎn)熱品壓之製開發(fā)程展全及打性貌樣能力HighlyConf ident

8、ial Optimized parameters in manufacturing process關(guān)鍵技術(shù) Factors affect yieldYield rat e Cycle time or tact time Pre-treatment and after process Tool life關(guān)鍵技術(shù)HighlyConf idential平面熱壓計劃之目的HE Development WorkSponsored by BBG, the goalsof HE TechnologyDevelopment Work are to:Identify optimized parameters i

9、n manufacturing process Identify factors affect yieldInvest igate achievable yield rateDesign optimized HE equipment and production layout for future operationInvest igate achievable cycle time or tact time Develop pre-treatment and after process Provide proto type manufacturing capacityDefi ne tool

10、 life and overall process economicsMold (Stamper)Highly Conf identialHE Technology Development WorkTarg et123Size7.5”15”15”24”32”Thickne ss0.4mm,0.60.9mm;23mmPatte rn onDouble-sided(V-groove, dots, .)LGPMicrostructure with a few 10m mrange MILEPRISMSANDBLASTINGETCHINGROTICULARENSSUFACEHighly Conf id

11、entialOutlineIntroduction of HE TechnologyPrecisiScope of HE Technology Development at NanoHE ExamplesRelevan IssuesHighly Conf idential產(chǎn)1品.平種類板型NB導(dǎo)光板熱壓實驗機適用開發(fā)產(chǎn)品Highly Conf identialExperimExperim entent ObjeObje ctct()2 TV擴SizeThicknessCycle散板:time1532“:0115.3約-818-10minute2Highly Conf identialThe T

12、hin est Work Piece1 3 0.4 tMatte stamperP MM APMMAV-Cut StamperV -cutDepth(um)Trans ferWidth(um )Trans ferRat eRat eStamper12.1439.73Center of plate11.4294.1%38.3596.50%Edge of plate11. 2092.3%39. 1898.6%Matte ( da)LGPMat teTrans ferRat eLight enter2.4362.353103.5%Center of plate2.0061.837109.2%En d

13、 of plate1.5681.457107.6%Highly Conf idential吋The Largest Work PieceMatte stamperPSV-Cut StamperHighly Conf identialThe Largest Work PieceV- cutDepth(um)Trans ferWidth(um)Trans ferRat eRat eStamper48.76101.07Center of plate51.00104.60%100.5799.50%32吋擴1.5t散板Edge of plate47. 1396. 66%100.5799. 50%High

14、ly Conf identialCMO 10 81:2 2 8mm1 3 5mm0.1 5mmLG PRe flector4. 7 mm15mmLED6.17mm9.2mmp attern()()Highly Conf idential228*135*0.15mm10mmStamper238*145*0.5mmMachinedmaster248*155*12mm15mm()即金使字加塔高深溫度高應(yīng)壓達讓厚度變，薄實做轉(zhuǎn)最寫深深僅度依然有限白反做微結(jié)構(gòu)10mm38um18um,.PET(Tg:100 )(Tg:800),38um白反射片微結(jié)構(gòu)熱壓反射片Highly Conf idential()

15、,Re flectorPE T,5 0%Ho t sp o t:0.4PMMA()雷鋸沖射片裁切壓對於可定以上位唯後續(xù)必須做端面拋光修整並不適用崩裂問題 目前選擇:,()對幾種可能方式加保護膜以後對位困難Highly Conf idential小片裁切技與實術(shù)驗選結(jié)果擇P試MM模機A-器0為.4t自動沖床,Press Mold T2 (PMMA-LI0001)圓型弧及成有型些較毛上邊次沖差切,且截有面些圓圓弧弧成沒型有不成良0.046mm有微結(jié)構(gòu)有情撕端形裂有撕裂的情形0.321mmP i tch 0.3 9 5mm De p th 0 .0 1 2mm-CMO 0.4t/13” LGP Pr

16、ojecteiki:誤位差321置 0.0075Ra138420.0737da2559 率轉(zhuǎn)Highly124%Ra寫52Conf111%da05identialda熱壓轉(zhuǎn)寫率分使用01.012575.01日期M試模打樣atte析第一次、版第二維次與持第三第次二da分布次比熱較壓的轉(zhuǎn)寫率 完成EB2ndCBe5b141AABDA1st2nd3rd(2008)7/14 - 7/168/11 - 8/139/15 9/17光學(xué)結(jié)果: EB()光學(xué)量測b1 4b1 4南科湖口54000369780%79%13輝度39373396R 304612 DA4版 分布比3較45 1.0025 位置 Matt

17、LGPdaRa點均勻度51%51%Highly Conf identialCMFProjectPattern6(230mmx140mm) +CMF Hot EmbossingDepth (m)CenterEdgeStamperPMMACMF 2.0t PMMA 熱轉(zhuǎn)印58.0659.95邊緣轉(zhuǎn)寫率中心中心1036020.7%95717.4%邊緣離CMF模不深良度的59情m形。，成型後容易發(fā)生O KD.離模()S tamp e rP MM A離模不良P MM AS tamp e r37Highly Conf idential轉(zhuǎn)寫率平均99.5%。Highly Conf identialOutli

18、neIntroduction of HE TechnologyPrecisiScope of HE Technology Development at Nano RelevantHEExamplesHighly Conf idential IssuesHighly Conf idential預(yù)成品估外模機翹部仁臺不曲因及溫素板度良:材控環(huán)厚制項境度目不均及可能mura原因Highly Conf idential表面瓦斯及氣痕材質(zhì)特性造成畫面Highly Conf idential製程平參整數(shù)度不適當(dāng)Relevant IssuesThickness uniformity of blank materialHeating/cooling system performance/Energy consumption Vacuum & vacuum in transfer boxMaterial handling methodPre-treatment & post-process requirementMold/work piece stack requiremen