BSOB模式與BBOS模式.ppt

1 CHAPTER6 2 BondStickOnBall BSOB BondBallOnStitch BBOS TailBreak 3 1 0 BONDSTICKONBALL BSOB 1 1 DescriptionThisbondingprocessisspeciallydevelopedbyASMtohandlemulti die MCM bondingapplication Intheconventionalapproach ifoneistryingtoconnectthegoldwirefromonedietotheanother acapillarymarkofsecondbondwillbeevidentontopofthediewhichmaydamagethedie TheBSOBprocesswillsolvethisproblembybondingaballontothedie ssurfacefirst followedbybondinganotherwirewherethesecondbond swedgewillbelandingontopofthisbondedball figure1 4 Die1 Die2 BondBall 2ndBond wedge Figure1 BondStickOnBall BSOB 5 2 0 BONDBALLONSTITCH BBOS SECURITYBOND 2 1 DescriptionThisprocessisalsoknownassecuritybond Itbondsaballontopofthewedgeofthenormalconnectionwire Thisprocessismainlyusedtosecurethesecondbondstickingcapability Figure2 Die1 Lead BondBall 2ndBond wedge Figure2 BondBallOnStitch BBOS 6 3 1 FreeAirBall FAB2 isalignedtothecenterofthebondpadondevice2 FAB2 3 0STANDOFFBALLCONTROLBONDINGSEQUENCE 7 3 2 Capillarydescendsandbondsballtobondpad Device1 Device2 W clamp open Capillary Applicationof1stbondstandoffballparametertoform BallThickness and BallSize DuringStandOffBonding SOBparametersareapplied 8 3 3 Capillaryrisestoloopbasetoclearball Device1 Device2 W clamp open CapillaryrisestosetLoopBase LoopBase ContactPt Loopbaseisthedistancebetweenthecapillarytipandcontactpoint Recommendedsetting 2 9 3 4 Capillarymovetoprogrammeballoffset Balloffsetcanbeprogrammedtowardsorawayfromthefirstbond vetowards2ndbond veaway2ndbond Device1 Device2 ActualBallOffset Settingx10umIfBallOffsetSetting 22ThenActualLoopBase 220um RecommendedSetting ve35 10 3 5 Capillarydescendsandformsstitchbondontopoftheball Device1 Device2 BallThickness SOBParameter StandOffBallParameter CapillarydescendstosetBallThickness Amt Zmovementabovetheballheight ContactPt BallThicknessisthedistancebetweenthecapillarytipandcontactpointRecommendedsetting 2 11 3 6 Capillarymoveshorizontallyforascrubdistancetoweakenthewireatballneck Device1 Device2 Scrubonedirectionawayfromball ActualScrubDistance Settingx0 8umIfScrubDistanceSetting 10ThenActualScrubDistance 8um CapillarymovetosetScrubDistanceOnedirectionONLY Awayfromtheball Recommendedsetting 8 12 3 7 Capillaryrisestotailheight Device1 Device2 W clamp close CapillarymovestosetTailLength AmountZmovementabovethebumpbeforethewireclampcloses Recommendedsetting 35 13 3 8 Capillaryrisesandtearsthewire asBHascendtoFireLevel Device1 Device2 W c close 14 15 3 10 Afterplacingallstandoffballs Themachinecontinuetobondwires 2ndBond wedge Device1 Device2 Device1 16 BumpballformationforBSOB BBOS MOTION BO LB BT SC NormalLBBOBTScrub FlatLBBOBTScrub 0 CONELBBOBT LBScrub 0 LB BO BT LB BO Thebumpballformationprocessisalmostlikebondinganormalwire including1stbond loopingand2ndbondparameters 17 4 0 PARAMETERDEFINITIONINSTANDOFFBALLCONTROLMENU 4 1 LoopBaseThisparameterdeterminesthelooplevelofthebondheadwhichshouldbesufficienttoavoidtheball Range LoopBase0 5Setting 24 2 BallOffsetThissettingcontrolsthedistanceofthetablemoveinordertooffsetthecapillaryfromthestandoffball Negativevaluecanbemovedtowardstothefirstbond Positivevaluecanbemovedawayfromthefirstbond Range BallOffset 40 20Setting ve35 18 4 4 ScrubDistanceThissettingcontrolsthecapillarymoveshorizontallywithaScrubamplitudetoweakenthewireatneck Itisalwaysawayfromthefirstbond Range ScrubDist4 12Setting 84 5 TailLengthThissettingcontrolsthelengthofthetailwherethebondheadrisestothepresetheightbeforethewireclampisclosed Range TailLength30 40Setting 35 4 3 BallThicknessThisparameterrefertotheballthicknesswhichcontrolsthelevelofthebondheadasitdescendstothetopoftheballRange BallThickness0 5Setting 2 19 4 6 TimeBase1 2Thissettingcontrolsthebondtimeappliedtothestandoffballcontrolonly Time1forthe1stbondandTime2forthe2ndbond 4 7 PowerBase1 2Thissettingcontrolstheultrasonicpowerappliedtothestandoffballcontrolonly Power1forthe1stbondandTime2forthe2ndbond 4 8 ForceBase1 2Thissettingcontrolsthebondingforceappliedtothestandoffballcontrolonly Force1forthe1stbondandForce2forthe2ndbond 20 4 9 StandbyPower1 2Thissettingcontrolsthepoweractivatedwhenthebondingheadreachthesearchlevel tothemomentthebondheadcontactsthebondsurface Withthevibration beforecontacttakeplace Bondheadwillcleanupthepadsurfaceandremovewatervaporonthepad Thisparameterusedforthestandoffballcontrolonly 4 10 ContactTime1 2Refertothe Contacttime1 2 definitionin BondParameter menu ButthisparameterwillbeaffectedontheStandoffballcontrolonly 21 4 11 ContactPower1 2Refertothe ContactPower1 2 definitionin BondParameter menu ButthisparameterwillbeaffectedontheStandoffballcontrolonly 4 12 ContactForce1 2Refertothe ContactForce1 2 definitionin BondParameter menu ButthisparameterwillbeaffectedontheStandoffballcontrolonly 22 Figure4 StandoffBallControlParameterDisplay page2 5 0BSOBWIREPARAMETERS 23 5 1 WireOffsetIn MenuThisistheoffsetparameterthatisrequiredtoensuremaximumcontactareabetweenthestitchbondandball Itisalwaysawayfromthefirstbond Range WireOffset10 30Recommendedsetting 25 5 2 SecondBondSearchSpeedThisParametercontrolstheimpactforstitchonball Range SearchSpeed232 256Recommendedsetting 32 2ndBondWedge StandOffBall Capillarypositionduringstitchbond 24 5 3 TimeBase1 2Thissettingcontrolsthebondtimeappliedtothedevice Time1forthe1stbondandTime2forthe2ndbond 5 4 PowerBase1 2Thissettingcontrolstheultrasonicpowerappliedtothedevice Power1forthe1stbondandTime2forthe2ndbond 5 5 ForceBase1 2Thissettingcontrolsthebondingforceappliedtothedevic