質(zhì)量專業(yè)英語詞匯.docx

質(zhì)量專業(yè)英語大全零件材料類的專有名詞CPU: central processing unit(中央處理器)IC: Integrated circuit(集成電路)Memory IC: Memory Integrated circuit（記憶集成電路）RAM: Random Access Memory（隨機(jī)存取內(nèi)存）DRAM: Dynamic Random Access Memory（動(dòng)態(tài)隨機(jī)存取內(nèi)存）SRAM: Staic Random Access Memory（靜態(tài)隨機(jī)內(nèi)存）ROM: Read-only Memory（只讀存儲(chǔ)器）EPROM:Electrical Programmable Read-only Memory（電可抹只讀存諸器）EEPROM: Electrical Erasbale Programmable Read-only Memory（電可抹可編程只讀存儲(chǔ)器）CMOS: Complementary Metal-Oxide-Semiconductor（互補(bǔ)金屬氧化物半導(dǎo)體）BIOS: Basic Input Output System（基本輸入輸出系統(tǒng)）Transistor：晶體管LED:發(fā)光二極管Resistor：電阻Variator：可變電阻Capacitor:電容Capacitor array：排容Diode：二極管Transistor：三極體Transformer：變壓器（ADP）Oscillator：頻率振蕩器（0sc）Crystal：石英振蕩器XTAL/OSC:振蕩產(chǎn)生器（X）Relay：延時(shí)器Sensor：感應(yīng)器Bead core：磁珠Filter:濾波器Flat Cable：排線Inductor：電感Buzzer：蜂鳴器Socket：插座Slot：插槽Fuse：熔斷器Current：電流表Solder iron：電烙鐵Magnifying glass：放大鏡Caliper：游標(biāo)卡尺Driver：螺絲起子Oven：烤箱TFT:液晶顯示器Oscilloscope：示波器Connector：連接器PCB:printed circuit board（印刷電路板）PCBA: printed circuit board assembly（電路板成品）PP:并行接口HDD:硬盤FDD:軟盤PSU:power supply unit（電源供應(yīng)器）SPEC:規(guī)格Attach:附件Case: 機(jī)箱，蓋子Cover：上蓋Base：下蓋Bazel：面板（panel）Bracket：支架，鐵片Lable：貼紙Guide：手冊(cè)Manual：手冊(cè)，指南Card：網(wǎng)卡Switch：交換機(jī)Hub：集線器Router：路由器Sample：樣品Gap：間隙Sponge：海綿Pallet：棧板Foam：保利龍F(tuán)iber：光纖Disk：磁盤片PROG:程序Barcode：條形碼System：系統(tǒng)System Barcode：系統(tǒng)條形碼M/B:mother board：主板CD-ROM:光驅(qū)FAN:風(fēng)扇Cable：線材Audio：音效K/B:Keyboard（鍵盤）Mouse：鼠標(biāo)Riser card：轉(zhuǎn)接卡Card reader：讀卡器Screw：螺絲Thermal pad：散熱墊Heat sink：散熱片Rubber：橡膠墊Rubber foot：腳墊Bag：袋子Washer：墊圈Sleeve：袖套Config：機(jī)構(gòu)Label hi-pot：高壓標(biāo)簽Firmware label：燒錄標(biāo)簽Metal cover：金屬蓋子Plastic cover：塑料蓋子Tape for packing：包裝帶Bar code：條形碼Tray：托盤Collecto：集線夾Holder：固定器,L鐵Connecter：連接器IDE:集成電路設(shè)備，智能磁盤設(shè)備SCSI:小型計(jì)算機(jī)系統(tǒng)接口Gasket：導(dǎo)電泡棉AGP:加速圖形接口PCI:周邊組件擴(kuò)展接口LAN:局域網(wǎng)USB:通用串形總線架構(gòu)Slim：小型化COM:串型通訊端口LPT:打印口，并行口Power cord：電源線I/O:輸入，輸出Speaker：揚(yáng)聲器EPE:泡棉Carton：紙箱Button：按鍵，按鈕Foot stand：腳架部門名稱的專有名詞QS:Quality system質(zhì)量系統(tǒng)CS:Customer Sevice 客戶服務(wù)QC:Quality control質(zhì)量管理IQC:Incoming quality control 進(jìn)料檢驗(yàn)LQC:Line Quality Control 生產(chǎn)線質(zhì)量控制IPQC:In process quality control 制程檢驗(yàn)FQC:Final quality control 最終檢驗(yàn)OQC:Outgoing quality control 出貨檢驗(yàn)QA:Quality assurance 質(zhì)量保證SQA:Source(supplier) Quality Assurance 供貨商質(zhì)量保證(VQA)CQA：Customer Quality Assurance客戶質(zhì)量保證PQArocess Quality Assurance 制程質(zhì)量保證QE:Quality engineer 質(zhì)量工程CE:component engineering零件工程EE:equipment engineering設(shè)備工程ME:manufacturing engineering制造工程TE:testing engineering測(cè)試工程PPEroduct Engineer 產(chǎn)品工程IE:Industrial engineer 工業(yè)工程ADM: Administration Department行政部RMA:客戶退回維修CSDI:檢修PC:producing control生管MC:mater control物管GAD: General Affairs Dept總務(wù)部A/D: Accountant /Finance Dept會(huì)計(jì)LAB: Laboratory實(shí)驗(yàn)室DOE:實(shí)驗(yàn)設(shè)計(jì)HR:人資PMC:企劃RD:研發(fā)W/H:倉(cāng)庫(kù)SI:客驗(yàn)PD: Product Department生產(chǎn)部PA:采購(gòu)(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘著技術(shù)MFG:Manufacturing 制造MIS:Management information system 資迅管理系統(tǒng)DCC:document control center 文件管制中心廠內(nèi)作業(yè)中的專有名詞QT:Quality target質(zhì)量目標(biāo)QP:Quality policy目標(biāo)方針QI:Quality improvement質(zhì)量改善CRITICAL DEFECT:嚴(yán)重缺點(diǎn)（CR）MAJOR DEFECT:主要缺點(diǎn)（MA）MINOR DEFECT:次要缺點(diǎn)（MI）MAX:Maximum最大值MIN:Minimum最小值DIAiameter直徑DIMimension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:電磁干擾ESD:靜電防護(hù)EPA:靜電保護(hù)區(qū)域ECN:工程變更ECO:Engineering change order工程改動(dòng)要求（客戶）ECR:工程變更需求單CPI:Continuous Process Improvement 連續(xù)工序改善Compatibility：兼容性Marking：標(biāo)記DWGrawing圖面Standardization：標(biāo)準(zhǔn)化Consensus：一致Code：代碼ZD:Zero defect零缺點(diǎn)Tolerance：公差Subject matter：主要事項(xiàng)Auditor：審核員BOM:Bill of material物料清單Rework：重工ID：identification識(shí)別,鑒別,證明PILOT RUN: (試投產(chǎn))FAI:首件檢查FPIR：First Piece Inspection Report首件檢查報(bào)告FAA:首件確認(rèn)SPC：統(tǒng)計(jì)制程管制CP: capability index（準(zhǔn)確度）CPK: capability index of process(制程能力)PMP:制程管理計(jì)劃（生產(chǎn)管制計(jì)劃）MPI:制程分析DASefects Analysis System 缺陷分析系統(tǒng)PPB：十億分之一Flux：助焊劑P/N:料號(hào)L/N：Lot Number批號(hào)Version：版本Quantity：數(shù)量Valid date：有效日期MIL-STD：Military-Standard軍用標(biāo)準(zhǔn)ICT: In Circuit Test (線路測(cè)試)ATE：Automatic Test Equipment自動(dòng)測(cè)試設(shè)備MO: Manafacture Order生產(chǎn)單T/U: Touch Up (錫面修補(bǔ))I/N:手插件P/T:初測(cè)F/T: Function Test (功能測(cè)試-終測(cè))AS組立P/K:包裝TQM:Total quality control全面質(zhì)量管理MDA:manufacturing defect analysis制程不良分析(ICT)RUN-IN:老化實(shí)驗(yàn)HI-pot：高壓測(cè)試FMI：Frequency Modulation Inspect高頻測(cè)試DPPM: Defect Part Per Million(不良率的一種表達(dá)方式：百萬分之一) 1000PPM即為0.1%Corrective Action: (CAR改善對(duì)策)ACC：允收REJ:拒收S/S：Sample size抽樣檢驗(yàn)樣本大小SI-SIV：Special I-Special IV特殊抽樣水平等級(jí)CON：Concession / Waive特采ISO:國(guó)際標(biāo)準(zhǔn)化組織ISA：Industry Standard Architecture工業(yè)標(biāo)準(zhǔn)體制結(jié)構(gòu)OBA:開箱稽核FIFO:先進(jìn)先出PDCA:管理循環(huán)Plan do check action計(jì)劃，執(zhí)行，檢查，總結(jié)WIP:在制品（半成品）S/O: Sales Order (業(yè)務(wù)訂單)P/O: Purchase Order (采購(gòu)訂單)P/R: Purchase Request (請(qǐng)購(gòu)單)AQL:acceptable quality level允收質(zhì)量水平LQL;Limiting quality level最低質(zhì)量水平QVL:qualified vendor list合格供貨商名冊(cè)AVL ：認(rèn)可的供貨商清單(Approved Vendor List)QCD: Quality cost delivery（質(zhì)量，交期，成本）MPM:Manufacturing project management制造項(xiàng)目管理KPI:Key performance indicate重要績(jī)效指標(biāo)MVT:Manufacturing Verification Test制造驗(yàn)證試產(chǎn)Q/R/S：Quality/Reliability/Service質(zhì)量/可靠度/服務(wù)STL:ship to line（料到上線）NTF:No trouble found誤判CIP:capacity improvement plan（產(chǎn)能改善計(jì)劃）MRB:material review board（物料審核小組）MRB:Material reject bill退貨單JIT:just in time（實(shí)時(shí)管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整頓，清掃，清潔，修養(yǎng)）SOP:standard operation process（標(biāo)準(zhǔn)作業(yè)程序）SIP:Specification inspection process制程檢驗(yàn)規(guī)格TOP: Test Operation Process (測(cè)試作業(yè)流程)WI: working instruction（作業(yè)指導(dǎo)書）SMD:surface mounting device（表面粘著原件）FAR:failure aualysis report故障分析報(bào)告CAR:Corrective action report改善報(bào)告BPR： 企業(yè)流程再造 (Business Process Reengineering)ISAR ：首批樣品認(rèn)可(Initial Sample Approval Request)-JIT：實(shí)時(shí)管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面質(zhì)量環(huán)境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (進(jìn)出口)AOQ：Average Output Quality平均出貨質(zhì)量AOQL：Average Output Quality Level平均出貨質(zhì)量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程變更會(huì)議)CSA：Customer Simulate Analysis客戶模擬分析SQMS：Supplier Quality Management System供貨商質(zhì)量管理系統(tǒng)QIT: Quality Improvement Team 質(zhì)量改善小組QIP：Quality Improvement Plan質(zhì)量改善計(jì)劃CIP：Continual Improvement Plan持續(xù)改善計(jì)劃M.Q.F.S: Material Quality Feedback Sheet (來料質(zhì)量回饋單)SCAR: Supplier Corrective Action Report (供貨商改善對(duì)策報(bào)告)8D Sheet: 8 Disciplines sheet ( 8D單)PDCA：PDCA (Plan-Do-Check-Action) (管理循環(huán))MPQ: Material Packing Quantity (物料最小包裝量)DSCN: Delivery Schedule Change Notice (交期變更通知)QAPS: Quality Assurance Process Sheet (質(zhì)量工程表)DRP ：運(yùn)銷資源計(jì)劃 (Distribution Resource Planning)DSS：決策支持系統(tǒng) (Decision Support System)EC ：電子商務(wù) (Electronic Commerce)EDI ：電子數(shù)據(jù)交換 (Electronic Data Interchange)EIS ：主管決策系統(tǒng) (Excutive Information System) ：企業(yè)資源規(guī)劃 (Enterprise Resource Planning)FMS ：彈性制造系統(tǒng) (Flexible Manufacture System)KM ：知識(shí)管理 (Knowledge Management)4L ：逐批訂購(gòu)法 (Lot-for-Lot)LTC ：最小總成本法 (Least Total Cost)LUC ：最小單位成本 (Least Unit Cost)MES ：制造執(zhí)行系統(tǒng) (Manufacturing Execution System)MPS ：主生產(chǎn)排程 (Master Production Schedule)MRP ：物料需求規(guī)劃 (Material Requirement Planning)MRP：制造資源計(jì)劃 (Manufacturing Resource Planning)OEM ：委托代工 (Original Equipment Manufacture)ODM ：委托設(shè)計(jì)與制造 (Original Design & Manufacture)OLAP：在線分析處理 (On-Line Analytical Processing)OLTP：在線交易處理 (On-Line Transaction Processing)OPT ：最佳生產(chǎn)技術(shù) (Optimized Production Technology)PDCA：PDCA管理循環(huán) (Plan-Do-Check-Action)PDM：產(chǎn)品數(shù)據(jù)管理系統(tǒng) (Product Data Management)RCCP：粗略產(chǎn)能規(guī)劃 (Rough Cut Capacity Planning)SCM ：供應(yīng)鏈管理 (Supply Chain Management)SFC ：現(xiàn)場(chǎng)控制 (Shop Floor Control)TOC：限制理論 (Theory of Constraints)TQC ：全面質(zhì)量管理 (Total Quality Control)FYI/R:for your information/reference僅供參考ASAP:盡快S/T:Standard time標(biāo)準(zhǔn)時(shí)間TPM:total production maintenance：全面生產(chǎn)保養(yǎng)ESD Wrist strap：靜電環(huán)IT:information technology信息技術(shù)，信息科學(xué)CEO：Chief Executive Officer執(zhí)行總裁COO：Chief Operaring Officer首席業(yè)務(wù)總裁SWOT：Strength,Weakness,Opportunity,Threat優(yōu)勢(shì)弱點(diǎn)機(jī)會(huì)威脅Competence：專業(yè)能力Communication：有效溝通Cooperation：統(tǒng)御融合Vibration Testing：振動(dòng)測(cè)試IDP：Individual Development Plan個(gè)人發(fā)展計(jì)劃MRP：Material Requirement Planning物料需求計(jì)劃MATS：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知會(huì)3C：Computer ,Communication , Consumer electronic消費(fèi)性電子5W1H：When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人,機(jī)器,材料,方法,測(cè)量4MIE: Man,Material,Machine,Method,Environment人力,物力,財(cái)務(wù),技術(shù),時(shí)間(資源)7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information人力， 機(jī)器， 材料， 方法, 市場(chǎng)， 管理， 資金， 信息1 Accuracy 準(zhǔn)確度2 Action 行動(dòng)3 Activity 活動(dòng)4 Analysis Covariance 協(xié)方差分析5 Analysis of Variance 方差分析6 Approved 承認(rèn)7 Attribute 計(jì)數(shù)值8 Average 平均數(shù)9 Balance sheet 資產(chǎn)負(fù)債對(duì)照表10 Binomial 二項(xiàng)分配11 Brainstorming Techniques 腦力風(fēng)暴法12 Cause and Effect Matrix 因果圖(魚骨圖)13 CL:Center Line 中心線14 Check Sheets 檢查表15 Complaint 投訴16 Conformity 合格（符合）17 Control 控制18 Control chart 控制(管制)圖19 Correction 糾正20 Correlation Methods 相關(guān)分析法21 CPI: continuouse Process Improvement 連續(xù)工序改善22 Cross Tabulation Tables 交叉表23 CS: Customer Sevice 客（戶）服（務(wù)）中心24 DSA: Defects Analysis System 缺陷分析系統(tǒng)25 Data 數(shù)據(jù) Description:品名26 DCC: Document Control Center 文控中心27 Decision 決策、判定28 Defects per unit 單位缺點(diǎn)數(shù)29 Description 描述30 Device 裝置31 Do 執(zhí)行32 DOE: Design of Experiments 實(shí)驗(yàn)設(shè)計(jì)33 Element 元素34 Engineering recbnology 工程技35 Environmental 環(huán)境36 Equipment 設(shè)備37 Estimated accumulative frequency 計(jì)算估計(jì)累計(jì)數(shù)38 E Equipment Variation 設(shè)備變異39 External Failure 外部失效,外部缺陷40 FA: Failure Analysis 失效分析41 Fact control 事實(shí)管理42 Fatigue 疲勞43 FMEA: Failure Mode and Effect Analysis失效模式與效果分析44 FP First-Pass Yield （第一次通過）合格率45 FQA: Final Quality Assurance 最終質(zhì)量保證46 FQC: Final Quality control 最終質(zhì)量控制47 Gauge system 測(cè)量系統(tǒng)48 Grade 等級(jí)49 Histogram 直方圖50 Improvement 改善51 Initial review 先期審查52 Inspection 檢驗(yàn)53 Internal Failure 內(nèi)部失效、內(nèi)部缺陷54 IPQC: In Process Quality Control 制程質(zhì)量控制55 IQC: Incomming Quality Control 來料質(zhì)量控制56 IS International Organization for Standardization 國(guó)際標(biāo)準(zhǔn)化組織57 LCL: Lower Control limit 管制下限58 LQC: Line Quality Control 生產(chǎn)線質(zhì)量控制59 LSL: Lower Size Limit 規(guī)格下限60 Machine 機(jī)械61 Manage 管理62 Materials 物料63 Measurement 測(cè)量64 Median 中位數(shù)65 MSA: Measurement System Analysis 測(cè)量系統(tǒng)分析66 Occurrence 發(fā)生率67 Operation Instruction 作業(yè)指導(dǎo)書68 Organization 組織69 Parto 柏拉圖70 PPMarts per Million （百萬分之）不良率71 Plan 計(jì)劃72 Policy 方針73 Population 群體74 PQA: Process Quality Assurance 制程質(zhì)量保證75 Practice 實(shí)務(wù)(踐)76 Prevention 預(yù)防77 Probability 機(jī)率78 Probability density function 機(jī)率密度函數(shù)79 Procedure 流程80 Process 過程81 Process capability analysis 制程能力分析（圖）82 Process control and Process capability制程管制與制程能力83 Product 產(chǎn)品84 Production 生產(chǎn)85 Projects 項(xiàng)目86 QA: Quality Assurance 質(zhì)量保證87 QC: Quality Control 質(zhì)量控制88 QE: Quality Engineering 質(zhì)量工程89 QFD: Quality Function Desgin 質(zhì)量機(jī)能展開(法)90 Quality 品質(zhì)91 Quality manual 品質(zhì)手冊(cè)92 Quality policy 質(zhì)量政策(質(zhì)量方針)93 Random experiment 隨機(jī)試驗(yàn)94 Random numbers 隨機(jī)數(shù)95 R:Range 全距（極差）96 Reject 拒收97 Repair 返修98 Repeatusility 再現(xiàn)性99 Reproducibility 再生性100 Requirement 要求101 Responsibilities 職責(zé)102 Review 評(píng)審103 Reword 返工104 Rolled yield 直通率105 RPN: Risk Priority Number 風(fēng)險(xiǎn)系數(shù)106 Sample 抽樣,樣本107 Sample space 樣本空間108 Sampling with replacement 放回抽樣109 Sampling without replacement 不放回抽樣110 Scatter diagram 散布圖分析111 Scrap 報(bào)廢112 Simple random sampling 簡(jiǎn)單隨機(jī)取樣113 Size 規(guī)格114 SL: Size Line 規(guī)格中心線115 Stratified random sampling 分層隨機(jī)抽樣116 SOP: Standard Operation Procedure 標(biāo)準(zhǔn)作業(yè)書117 SPC: Statistical Process Control 統(tǒng)計(jì)制程管制118 Specification 規(guī)范119 SQA: Source(Supplier) Quality Assurance 供貨商質(zhì)量保證120 Stage sampling 分段隨機(jī)抽樣121 Standard Deviation 標(biāo)準(zhǔn)差122 Sum of squares 平方和123 Taguchi-method 田口(試驗(yàn))方法124 Theory 原理125 TQC: Total Quality Control 全面質(zhì)量控制126 TQM: Total Quality Management 全面質(zhì)量管理127 Traceablity 追溯128 Training 培訓(xùn)129 UCL: Upper Control Limit 管制（控制）上限130 USL: Upper Size Limit 規(guī)格上限131 Validation 確認(rèn)132 Variable 計(jì)量值133 Verification 驗(yàn)證134 Version 版本135 VOC: Voice of Customer 客戶需求136 VOE: Voice of Engineer 工程需求137 Inventory stock report:庫(kù)存清單報(bào)告138 Sales order report:出貨報(bào)告QC quality control 品質(zhì)管理人員FQC final quality