PCB專業(yè)英語資料,PCB海外銷售英語資料課件

1、What is PCB? Printed Circuit BoardPCB Effect？Conduct ElectricityTransmission SignelSupported Fixation Action（印刷線路板）印刷線路板）（導(dǎo)電）導(dǎo)電）（傳輸信號）傳輸信號）（支撐固定）支撐固定） A:Single-sidedDouble- sidedMulti-layer Printed Circuit Board (PCB) B:Rigid PCB Flexible PCB Flex-rigid PCB單面單面/雙面雙面/多層多層PCB剛性剛性/撓性撓性/剛撓性剛撓性PCB metalb

2、asePCB(金屬基板) Blindboard(盲孔板) buriedboard(埋孔板) bareboard(裸板) Quickturnprototype(樣板)Laminate Cut (開料開料)Inner Dry Film (內(nèi)層菲林內(nèi)層菲林)Inner Etching內(nèi)層蝕刻內(nèi)層蝕刻Black Oxide 黑化黑化Brown Oxidation棕化棕化Laminating層壓層壓Drilling鉆鉆 孔孔Plated-through hole沉銅沉銅Outer Dry Film外層干膜外層干膜Pattern Plating圖形電鍍圖形電鍍 Outer Etching外層蝕刻外層蝕刻

3、Wet Film 阻焊阻焊 Silk Screen綱版印刷字符綱版印刷字符 Surface Treatment表面處理表面處理 Golden Finger 鍍金手指鍍金手指 Hot Air Leveling噴錫噴錫 Routing外形外形 E-test （電子測試（電子測試 ) Packing包裝包裝 Output 出出 貨貨 Inner Dry FilmInner Etching內(nèi)層菲林內(nèi)層菲林Outer Dry Film 外層菲林外層菲林 內(nèi)層蝕刻內(nèi)層蝕刻outer Etching 外層蝕刻外層蝕刻Inner Inspection 內(nèi)檢內(nèi)檢Outer Inspection 外外檢檢層壓層壓

4、 LALaminate DR BO棕棕/黑氧化黑氧化Brown/Black Oxidation鉆鉆 孔孔Drilling PTH PP WF 沉銅沉銅 Plated-through hole 圖形電鍍圖形電鍍 阻焊阻焊Pattern PlatingWet Film BaseMaterial Coppercladlaminate(CCL)(覆銅板) PREPREG(半固化片) Epoxyresin(環(huán)氧樹脂) Copperfoil(銅箔) Dielecteics(介質(zhì)) PTFE(Polytetralluoetylene)Teflon(聚四氟乙烯) dielectricconstant（介電常數(shù)

5、） Soldermask(阻焊) Dryfilm（干膜） legendink(字符油墨) peelablesoldermask(可剝離阻焊) SurfaceTreatment 沉金 ImmersionGold ChemicalGold EnectrolessGoldPlating ENIG=EnectrolessNickeland ImmersionGold 電鍍金 Goldplating ElectricGoldplating HardGoldPlating 無鉛噴錫 LeadFreeHASL HASLforPbFree SN100C 噴錫 HAL=HotAirLeveling HASL=H

6、otAirSolderLeveling Sn/Pb(63/36) Tin/Leadsolder 金手指 GoldFingers EdgeConnectorPlating Tabconnector Chamfer(倒角) 橋連 BridgeConnecting TabConnecting 橋連郵票孔 ConnectingtabswithStampholes ConnectingtabswithMouse(Mice)Biteholes 工藝邊 Rails(ToolingRails) ToolingStrip PanelFrame HoldingFrame WasteEdge Burr(毛刺) Tw

7、istandWarp(翹曲) 檢驗 FinalInspection(終檢) Fibreexposure(漏基材) Holebreakout(破孔) Thermalshock(熱沖擊) Thermalstress(熱應(yīng)力) Reworking(返工) Overetching(過蝕) Majorequipments Laserplotter(激光光繪機) CNCroutingmachine(數(shù)控銑床) Patternplatingline(圖形電鍍線) Dryfilmlaminator（貼膜機） Exposuredevelopingline(曝光顯影線) FlyingProbetestFPT（飛針

8、檢測儀） AutomaticopticalinstrumentAOI(自動光學(xué)檢測儀) tearpad(淚滴焊盤) isolationpad(隔離焊盤) thermalpad(熱焊盤) mountinghole(安裝孔) FiducialMark(基準(zhǔn)點、反光點) SMT(Surfacemounttechnology)(表面貼裝技術(shù)) Bonding(邦定) BGA(ballgridarray)(球柵封裝) SMD(Surfacemountdevices)(表面貼裝設(shè)備) Placementmachine(貼裝機) REFOLWSOLDERING(回流焊) WAVESOLDERING(波峰焊)

9、 ADD4TOOLINGHOLESINEACHOFTHECORNERSOFTHEPANELFRAME.THE DIAMETEROFEACHTOOLINGHOLESHOULDBE3.5MM.EACHTOOLINGHOLESHOULDBEPLACEDY=2.5MMANDX=2.5MMFROMTHECORNERSOFTHEPANELFRAME.THEPANELFRAMEHASAWIDTHOF5MMANDSHOULDONLYEXISTON2SIDESOFTHEPANEL. 拼版后加2個寬5MM的附邊，在拼版附邊上的4角加4個定位孔，直徑3.5MM，X，Y方向分別離附邊2.5MM 6LAYERPCB,1

10、.60MMTHICKFR4,2XGREENSOLDERMASKS,2XWHITEOVERLAYS,ULISREQUIRED,PCBSTOBEBAREBOARDTESTED,PANELROUTED,PCBSIZE:265X356MM QUANTITYISPERPCB,10OFFPCBSREQUIRED,IMMERSIONSILVER 6層板，1.6MM厚，F(xiàn)R-4板材，兩層綠色阻焊，兩層白色字符，UL標(biāo)記要加，做裸板測試，拼版銑外形，板尺寸：265X356MM，交貨數(shù)量10個,沉銀 對于外銷客戶，客戶在回復(fù)工程問題后，會問道Pleaseconfirmallthequestionsareclearandtheordercouldbeproceeded?/Pleasefeedbackifyoucouldunderstandallthecommentabove? 我們在處