(工廠與企業(yè))工廠英文經(jīng)典知識縮寫

1、AF ALT ANOVA AOQL APO APQP ARE ASIC ASSP ATE ATO AVL BAC BCI BD BFR bo BOM BU c CBD CDM CDM CDM support Nokia CDN CE CECE. E0.E5 Milestones CEM CER. FILTERS, pressing, Firing CI CIM CLUSTER CM CMO co COC COO英文經(jīng)典知識縮寫Acceleration factorAccelerated life testAnalysis of VarianceAverage Outgoing Quality

2、LevelAuto Power OffAdvanced Product Quality Planning and Control PlanArea OptionsApplication Specific Integrated CircuitApplication Specific Standard PartAutomatic test equipmentAssembly To OrderRFQ IMPUT CHECKLIS里面用至 UBackupBulk current injectionBusiness DeveloperBatch Failure RateBochumBill of Mat

3、erialBusiness Unitacceptance level (= number of failed components accepted) Cost Break DownContract Design ManufacturerCharge Device Model - discharge typeOriginal Design done by Partner specifically toCoupling and Decoupling Network.Concurrent EngineeringConcurrent Engineering (used for product dev

4、elopment)Concurrent Engineering (CE) Product ProgramContract Electronic ManufacturerMONOBL. DUPLEXERSPowder mixing, BlockCapacity ImplementationCustom In MouldGroup of companies, head by one Cluster leaderCost ManagementCustomer & Market OperationsCopenhagenCertificate of complianceCountry of Or

5、iginCp, CpkProcess Capability indicesCpkCapabilityIndexCPLCost Part listCQEComponentQuality EngineerCQPComponentQuality PlanningCQSComponentQuality SpecialistCRChange RequestCRRComponent review reportCRYSTALSCrystal wafer manufacturingCSACurrent State AnalysisCSMC-TPATCustoms-Trade Partners Against

6、TerrorismCTSCost Target SettingDDraft, first version of the documentdaDallasDCDirectDCDirect CurrentDCNDesign change noticeDESDeselect allDFADesign For AssemblyDFBADesign for Board AssemblyDFDSDesign for Demand SupplyDfEDesign for EnvironmentDFFADesign for Final AssemblyDFMDesign For Manufacturing (

7、includes DFPT, DFBA,DFFA)DFMEADesign Failure Mode and Effects AnalysisDFPTDesign for Production TestDGDI-EL. DUPLEXERSResonator preparingDIRDesign Improvement ReportsDocManType of Lotus Notes database (for documents)DOEDesign Of ExperimentDOEDesign Of ExperimentDPMDefects Per MillionDSBDemand Supply

8、 BalanceDSNDemand Supplier NetworkDUTDevice Under TestDVDemand VolumeDVRE0.E5Concurrent Engineering (CE) MilestonesE0.E5Concurrent engineering (CE) milestonesECNEngineering Change NoticeEFREarly Failure RateELMECHElectro MechanicalEMC EMI EMS EN EoL EPA ERP es ESD ESDS ESI ETA EUT EVEVM FFA FAC FAQ

9、FAI FEM FFR FIL FIML FIT FMEA FOR FOTFR G.A.Gauge R&R GCPM GD&T GRP GRR HBM HBM HCP HIGH hk HUB ICDR ICDR IDElectro Magnetic CompatibilityElectro Magnetic InterferenceEnvironmental Management Sys-temEuropean NormEnd of LifeESD protected areaEspooElectrostatic dischargeElectrostatic discharge

10、 sensitive deviceEarly Supplier InvolvementEstimate to be arriveEquipment Under TestEnclosed volumeEnhancements Version ManagementFinal, document to be archivedFailure AnalysisFully anechoic chamberFrequently Asked QuestionsFirst article inspectionFinite Element ModellingField Failure RateFilter.Fab

11、ric Inmold Labeling, samewith CIMCustom In Mould Failures in TimeFailure Mode and Effect Analysis第一次試模Failure RateGeneral AssemblyGauge Repeatability and ReproducibilityGeometrical Dimensioning & Tolerancesground reference planeGauge Repeatability and ReproducibilityHuman Body ModelHuman Body Mo

12、del - discharge typehorizontal coupling planeHighlight selectedHong KongWarehousing and Shipping functionality locationIntegrated Circuit Design ReviewsIC Design ReviewIndustrial DesignIFR IMDIME IMLIML IPQCIPR ISO jk JR&D KCRKO LA la LABLCLLL LRVPLSL LSSE M&OM/C M3MAR MAR s MatCoMaMC MD MDF

13、 MDFsME MECHMFI MIS MMMOR MOSSMPL MPL / M MPL/MPM MPMMR MRPMSIntrinsic Failure RateInsert Mold DecorationInject Mold EquipmentInsert Mold LabelingIN MOLD LABELINGIn Process Quality ControlIntellectual Property RightsInternational Standardization Organization Jyv?skyl?Joint Research and developmentKe

14、y Component ReviewKick OffLicense AgreementLos AngelesLabelLower Control LimitLesson LearnedLong Range Volume PlanLower Specification LimitLight SW Subcontractor EvaluationMechanics & OutsourcingmachineGlobal quality databaseMechanics Acceptance ReportMechanical Acceptance Report sMeasuring Cent

15、reMechanics DesginMaterial Data Formmaterial data formsManufacturing EngineerMechanicsMelt flow indexMachine Model - discharge typeMonthly Operation ReviewVisual Quality Criteria s procedureMaterial Project LeaderMaterial Project Leader / ManagerMaterial Project Leader/ ManagerMaterial Project Manag

16、erMeasurements ReportManufacturing SolutionsMSMilestoneMSAMeasurement System AnalysisMSIDMoisture-Sensitive IdentificationMSMMechnical Supplier ManagementMSMMechanics Sourcing ManagerMTOMake TO OrderMTSMechanical Technology SourcingMULTIL.PRODUCTSCeramic powder manuf, Sheet forming, Cutting,Printing

17、, FiringNCnon connectNCTNDANon Disclosure AgreementNETNokia NetworksNETNetworksNGPNokia Global ProcessesNGSNokia Global StandardsNGSWNokia Global Supplier WebNMPNokia Mobile Phones LtdNOSSNokia Supplier Status databaseNPINokia Product IntegrationNPINew Product IntroductionNPSQSNokia Part Specific Qu

18、ality StandardsNRTNokiaRapid ToolingNSLNokiaSubstance ListNSMNokiaSupplier ManualNSRNokiaSupplier RequirementNTPNormal temperature and pressure, see laboratoryenvironmentOAPOriginal Accessory PartnerOCAPOut-of-Control Action PlanOCVOpen Circuit VoltageODMOriginal Design ManufacturerODMOriginal Desig

19、n done by Partner independentlyOEMOriginal Equipment ManufactureOEMOriginal Design done by NokiaOPLOperations Project LeaderOQCOutgoing Quality ControlORSOperating Resource SourcingOTOver timeOTDOn time deliveryouOuluPAProcessAssessmentPAProduct AgreementPCProduct CreationPCPCBAPCNPCNsPCQEPCQMPDPDMP

20、DMPDMPDTPE production) PFMEA PGP PIPIRPLMPLPPLRMPMPMPMPM/MPPMAPMCPMMPMTPOPOKA-YOKEPOPPop-PortPOWER AMPSPp, PpkPPAPPAPPPMppmPQPQGFPPQMPQPPQPPR1/2PolycarbonateProcess Change Noticeproduct change notification casesProgram Component Quality EngineerProgram Component Quality ManagerProduct DeliveryProduc

21、t Development ManagerProduct Data ManagementProduct Data Management SystemProject Development TeamProduct Engineering (used for product in massProcess Failure Mode and Effect AnalysisPretty Good PrivacyProduct ImplementationProduct Line ManagementProduct Lifetime ProfitabilityProgram Loading Road ma

22、pProduct ManagerPurchasing ManagerProject ManagerPartner Manufacturing/Manufacturing PartnerProject Manager AssistantProgram Portfolio ManagementProject Management TeamPurchasing OrderMistake ProofingPackage Operation ProcedureSystem connector in NOKIA mobile devicesMMIC and/or IC manufacturingProce

23、ss Performance IndicesProduct Purchase AgreementProduction Part Approval ProcessProduct Program ManagerParts per millionProcess QualificationPackage qualification guideline for programsProgram Quality ManagerProgram Quality PlanPackage Qualification ProcedurePTOPackage TO OrderPVProduct ValidationPV

24、DPhysical Vapor DepositionPWBPrinted Wire BoardQAquality assurenQBRQuarterly Business ReviewQCquality controlQEQuality EngineerQFDQuality Function DeploymentQMquality managementQSRQuality System RequirementQTEQuality Technician EngineerQTEQuality and Technology EngineerQTE / QTMQuality Technology En

25、gineer / ManagerQTE / QTMQuality Technology Engineer / ManagerQTMQualityand Technology ManagerQTYQuantityR&DResearchand DevelopmentR&RRolesand ResponsibilitiesR&TResearch and TechnologyRAMRandom Access MemoryRamp Up/SARECReconsiderRELRelated toRFPRequest For ProposalRFQRequest For Quotat

26、ionRIPSRecently Introduced Product SupportRMAReturn Material AuthorizationSASACsemi anechoic chamberSAW /BAW FILTERS, SAW DUPLEXERSDie wafer manufacturingSCPService Channel PreparationSEMScanning ElectronMicroscopeSGSave as groupSHOShowsiSingaporeSIDSIPStandard Inspection ProcedureSLISupply Line Implementation processSLMSupply Line ManagementSLPSupply Line Preparation processSOSolution OfferingSOPStandard Opera