數(shù)字電路與無線通信系統(tǒng)電磁兼容技術(shù)發(fā)展與應(yīng)用

1、1高速數(shù)字電路與無線通信系統(tǒng)之電磁兼容技術(shù)發(fā)展與應(yīng)用Outline2Introduction to EMI and RFI for High-Speed SystemsTrend of Wireless Communications and Automotive DevelopmentPlatform Noise Impact on ThroughputEMI Analysis of Key Components in Mobile DeviceApplication of Noise Budget and Analysis Model for System IntegrationConclu

2、sion2What is EMI and EMC?EMI干擾源(敏感設(shè)備)信號源 信號接收器耦合路徑Natural Sources: Lightning, Electrostatic Discharge (ESD)- Artificial Noise: EFT、dV/dt 、di/dt3Calculations:EMI vs. RF Interference4High Speed Digital System TrendsMore complex designs, more power on chip, andmore susceptibleRFMCUDSPMemoryADCDACMost p

3、owerful EM sourcesBus controlTestMost susceptible parts5Problems by Power/Ground Noise6Challenges in High Speed Digital Design78Triangle of EMC related IssuesEMCNormal Mode RadiationCommon Mode RadiationInterferenceSI (Signal Integrity)Delay/Timing ControlReflection NoiseCrosstalk NoiseEye Opening J

4、itterPI (Power Integrity)PWR/GND Plane ResonanceSSNPWR Supply ImpedanceDecoupling8Outline9Introduction to EMI and RFI for High-Speed SystemsTrend of Wireless Communications and Automotive DevelopmentPlatform Noise Impact on ThroughputEMI Analysis of Key Components in Mobile DeviceApplication of Nois

5、e Budget and Analysis Model for System IntegrationConclusion9The mobile communication and trend toward higher data bandwidth101011Evolution of Wireless Devices4G-5GApplications InnovationIP-LBS-HD Resolution, .1Ganalog voice communication2Gdigital services2.5Gquicker data access (384kbps)3Ghigher sp

6、eed connectivity (2Mbps)high speed Broadband (20Mbps)RFSAROTATP？11Antenna Near Field and Far Field1212Whats the OTA Measurement?13OTA: Over-the-AirThe purpose is to measure the 3-dimensions (X, Y, Z) antenna pattern for transmit power and receiver sensitivity for wireless devices.(Regulation)13(CTIA

7、)LTE14What is On-Board Self Jamming?Lots of on-board antennas/wireless modules in Modern Mobile Phone !Amateur RadioTowerCellular phoneAviation RadarBroadcastingProtection ofreceiverEV 充電環(huán)境傳統(tǒng)道路環(huán)境15車輛EMC環(huán)境Advanced Driver Assistance Systems (ADAS)16Complex Automobiles Electronic17當(dāng)車輛使用電源線與AC電力網(wǎng)路連線進行充電

8、時，則須符合AC電網(wǎng)EMC相關(guān)規(guī)範(fàn)。使用範(fàn)圍多廣，須依政府法令規(guī)定。使用範(fàn)圍多深，視車廠品質(zhì)確保程度而定。Outline18Introduction to EMI and RFI for High-Speed SystemsTrend of Wireless Communications and Automotive DevelopmentPlatform Noise Impact on ThroughputEMI Analysis of Key Components in Mobile DeviceApplication of Noise Budget and Analysis Model

9、for System IntegrationConclusion18Figure of Merit for MIMO Systems - Throughput19De-Sense represented by Noise PDF at different channel19Hybrid: OTA + ConductionFull Anechoic RF Chamber with fixed multi-path & in-line programmable attenuation between the AP & DUT to simulate changing RF conditionsNO

10、TE:A phase shifter (Butler matrix) is used to emulate multi-pathUnless otherwise requested, channels used by default (Ch. 11 20MHz or Ch. 161 40MHz)Traffic type used by default (TCP)iperf commands:Sender: iperf c -w 256K l 1470 P4 fm i1 tReceiver: iperf s w 256K20Setup for Throughput Measurement(AP)

11、(Server)090180270(DUT)11021OTA Test SetupConduction Test Setup22CH01 TXTotal Attenuation (dB)AP2AP3AP2-AP36545.91743.8452.0727543.15541.6961.4598034.85633.0461.818133.732.0021.698823230.9881.0128329.50428.9430.5618427.42526.0881.3378524.99523.1251.878624.62423.161.4648723.84922.6751.1748822.06620.54

12、21.5248916.82516.7380.0879016.37215.740.6329116.0514.9721.0789213.29712.4570.849312.85211.3821.479412.09810.3231.7759511.57610.5810.995968.8868.3720.514977.9257.7730.152986.2275.920.307994.0123.8220.191003.7693.6460.1231013.0532.6920.3611023.3182.5930.725Throughput(Mbps)403530252015105080 81 82 83 8

13、4 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105Total Attenuation(dB)802.11n TX (20MHz)5045AP2AP3AP2 & AP3 -CH 01 (Tx mode)2223CH01 RXTotal Attenuation (dB)AP2AP3AP2-AP36548.55346.8191.7347548.00146.3131.6888048.05646.6271.4298147.7946.0861.7048247.99645.9812.0158347.69345.5182

14、.1758447.09145.5371.5548546.5343.6022.9288640.97539.7251.258740.73439.0881.6468840.62138.4512.178939.61837.4052.2139035.69332.9952.6989134.18632.022.1669230.72829.5531.1759324.94124.1440.7979423.76123.5390.2229521.28221.594-0.3129612.99218.457-5.4659710.85910.0020.8579810.8710.1920.6789910.5059.9490

15、.5561009.2069.633-0.4271015.3558.266-2.9111024.1795.116-0.937Throughput(Mbps)403530252015105080 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105Total Attenuation(dB)802.11n RX (20MHz)5045AP2AP3AP2 & AP3 -CH 01 (Rx mode)2324CH06 TXTotal Attenuation (dB)AP2AP3AP2-AP3654

16、6.2844.12.187545.39644.241.1568040.11438.771.3448138.32737.2111.1168235.50334.3261.1778335.41734.3861.0318433.35432.1391.2158527.31127.2120.0998627.01226.5410.4718727.24626.1551.0918826.63725.7580.8798925.95725.310.6479024.05123.8890.1629118.19317.8370.3569218.20217.6170.5859317.36316.890.4739413.73

17、313.5650.1689512.89713.035-0.1389612.76713.254-0.4879711.76312.177-0.414988.8819.01-0.129998.4458.484-0.0391006.0177.27-1.2531016.0674.3381.7291025.0914.0950.996Throughput(Mbps)403530252015105080 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105Total Attenuation(dB)802

18、.11n TX (20MHz)5045AP2AP3AP2 & AP3 -CH 06 (Tx mode)2425CH06 RXTotal Attenuation (dB)AP2AP3AP2-AP36548.43546.8891.5467548.23646.6721.5648048.53746.7431.7948148.49246.5331.9598248.31346.5981.7158347.10646.2560.858441.52143.528-2.0078541.2439.9271.3138639.29138.5960.6958734.76736.178-1.4118833.66532.49

19、81.1678933.51732.2841.2339031.68732.018-0.3319126.6425.6540.9869225.75525.2090.5469323.52624.399-0.8739420.1921.883-1.6939518.25217.5710.6819618.03517.8050.239716.18117.242-1.0619812.55815.511-2.953997.3211.889-4.5691008.0127.440.5721018.0087.7590.2491027.3267.673-0.347Throughput(Mbps)40353025201510

20、5080 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105Total Attenuation(dB)802.11n RX (20MHz)5045AP2AP3AP2 & AP3 -CH 06 (Rx mode)2526CH11 TXTotal Attenuation (dB)AP2AP3AP2-AP36545.83344.051.7837545.20544.4230.7828038.43739.222-0.7858135.66738.407-2.748234.57537.558-2.9

21、838332.49334.568-2.0758431.34833.467-2.1198527.1230.083-2.9638625.57126.302-0.7318725.17326.731-1.5588824.81425.759-0.9458921.24724.012-2.7659017.35619.619-2.2639117.42317.706-0.2839215.75317.425-1.6729313.39215.667-2.2759413.00113.341-0.349512.28212.961-0.679969.07411.646-2.572978.8989.086-0.188987

22、.3498.445-1.096994.8676.283-1.4161004.2654.412-0.1471013.3414.09-0.7491021.3852.669-1.284Throughput(Mbps)403530252015105080 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105Total Attenuation(dB)802.11n TX (20MHz)5045AP2AP3AP2 & AP3 -CH 11 (Tx mode)26CH11 RXTotal Attenu

23、ation (dB)AP2AP3AP2-AP36548.66146.6671.9947548.14846.7271.4218048.13946.6091.538147.88346.4681.4158247.99646.4751.5218347.75846.4771.2818447.47546.0881.3878547.4745.5221.9488646.71644.6922.0248741.3341.1590.1718840.73638.412.3268940.48237.782.7029038.85233.8824.979133.63132.2731.3589232.4330.911.529

24、329.88728.9580.9299425.34825.0140.3349521.71924.562-2.8439616.35824.043-7.6859710.42320.449-10.0269810.92512.793-1.8689910.61310.749-0.1361009.69310.772-1.0791018.40110.11-1.7091025.1028.101-2.999Throughput(Mbps)403530252015105080 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102

25、103 104 105Total Attenuation(dB)802.11n RX (20MHz)5045AP2AP3AP2 & AP3 -CH 11 (Rx mode)2713.3” Notebook: CH01(1/3)28實測衰減110deg (Ant 130cm) CH01實測衰減110deg (Ant 130cm) CH01CH01 86db86dbTxRxCH01 86db86dbTxRx衰減器A3904.3045.93衰減器A3904.3176.444衰減器C3930衰減器C393060609030.34833.9769025.56832.7831201201501501801

26、2.1918.5521807.19112.56521021024024027018.77224.20727018.01526.627300300330330Average16.403520.66625Average13.7727519.6047535302520151050050250300MpbsCH01 Tx4030201000100200300Mbpsdegree100150200degreeTx-Ap2Tx-Ap3CH01 RxRx-Ap2Rx-Ap328(AP-2)(AP-3)13.3” Notebook: CH06(2/3)29實測衰減110deg (Ant 130cm) CH06

27、CH06 86db86dbTxRx衰減器A37010.6246.775衰減器C3930609037.63434.18412015018016.37212.18121024027024.24925.642300330Average22.2197519.6955實測衰減110deg (Ant 130cm) CH06CH06 86db86dbTxRx衰減器A3709.70810.666衰減器C3930609038.02334.46812015018016.61816.70221024027025.70228.589300330Average22.5127522.6062540353025201510

28、50050100200250300Mbps150degreeCH06 TxTx-Ap2Tx-Ap34035302520151050050100200250300Mbps150degreeCH06 RxRx-Ap2Rx-Ap329(AP-2)(AP-3)13.3” Notebook: CH11(3/3)30實測衰減110deg (Ant 130cm) CH11CH11 86db86dbTxRx衰減器A3707.4568.043衰減器C3930609037.68234.97812015018015.90418.28921024027018.8624.769300330Average19.97552

29、1.51975實測衰減110deg (Ant 130cm) CH11CH11 86db86dbTxRx衰減器A3707.3399.695衰減器C3930609036.10433.41212015018015.54617.97921024027018.29223.777300330Average19.3202521.21575(AP-2)(AP-3)4035302520151050050200250300Mbps100150degreeCH11 TxTx-Ap34035302520151050050250300MbpsTx-Ap2CH11 Rx100150200degreeRx-Ap2Rx-Ap

30、33015” Notebook: CH01(1/3)31實測衰減110deg (Ant 105cm) CH01CH01 86db86dbTxRx衰減器A3905.0720.047衰減器C393060901.444012015018011.9152.07121024027010.0140.559300330Average7.111250.66925實測衰減110deg (Ant 105cm) CH01CH01 86db86dbTxRx衰減器A3903.270衰減器C393060901.247012015018010.5212.4612102402709.8920.603300330Average

31、6.23250.766(AP-2)(AP-3)141210864200100200300MbpsdegreeCH01 TxTx-Ap2Tx-Ap332.521.510.500100200300MbpsdegreeCH01 RxRx-Ap2Rx-Ap33115” Notebook: CH06(2/3)32實測衰減110deg (Ant 105cm) CH06實測衰減110deg (Ant 105cm) CH06CH06 86db86dbTxRx衰減器A37010.180.464CH06 86db86dbTxRx衰減器C3930衰減器A37010.2250.46360衰減器C3930609010.

32、2510.281909.5560.30712012015015018020.5926.39418017.6455.35821021024024027020.1266.01527017.4714.365300300330330Average15.287253.2885Average13.724252.6232525201510500100200300MbpsdegreeCH06 TxTx-Ap3864200100200300MbpsdegreeTx-Ap2Ch06 RxRx-Ap2Rx-Ap332(AP-2)(AP-3)15” Notebook: CH11(3/3)33(AP-2)(AP-3)實

33、測衰減110deg (Ant 105cm) CH11CH11 86db86dbTxRx衰減器A3705.3650.229衰減器C393060904.9840.08112015018014.6295.22321024027017.9087.509300330Average10.72153.2605實測衰減110deg (Ant 105cm) CH11CH11 86db86dbTxRx衰減器A3705.0970.458衰減器C393060903.4810.16112015018014.7925.96821024027015.8958.066300330Average9.816253.6632520

34、151050050100200250300Mbps150degreeCH11 TxTx-Ap2Tx-Ap31086420050100200250300Mbps150degreeCH11 RxRx-Ap2Rx-Ap333Setup for Antenna Port Noise34 Back view34inside view Complete set up view35Platform Noise (WLAN_Main)2.352.382.412.52.532.442.47Frequency(GHz)-80-70-60-30-40-50WLAN_Main_LF15V-20-10dBmPlatfo

35、rm_noiseBackground Platform noise Main35Platform Noise(WLAN_AUX)362.352.382.412.52.532.442.47Frequency(GHz)-80-70-60-30-40-50WLAN_AUX_LF15V-20-10dBmPlatform_noiseBackground Platform noise AUX36Surface Scan to Locate Noise Source37 Front view37 Complete setupviewCurrent RFI Mitigation Practices3838屏蔽

36、材料對於雜訊抑制效果比較未加材料_Probe 0加入材料(石墨烯)_Probe 03939屏蔽材料對於雜訊抑制效果比較未加材料_Probe 90加入材料(石墨烯)_Probe 904040屏蔽材料對於雜訊抑制效果比較未加材料_Probe 0加入材料(石墨烯)_Probe 04141屏蔽材料對於雜訊抑制效果比較未加材料_Probe 90加入材料(石墨烯)_Probe 904242Throughput 量測量測場地示意圖實際量測場地DUTAntenna43APController43Throughput (Uplink)4444Throughput (Downlink)4545Throughput

37、 (Bidirectional)4646Outline47Introduction to EMI and RFI for High-Speed SystemsTrend of Wireless Communications and Automotive DevelopmentPlatform Noise Impact on ThroughputEMI Analysis of Key Components in Mobile DeviceApplication of Noise Budget and Analysis Model for System IntegrationConclusion4

38、7E & H Fields on StructureCapacitive CouplingInductiveCouplingRadiated Coupling(CM, DM)ConductiveCouplingPower distribution Signal distribution Ground loopInternal EMI SourcesFieldsConductionParasitic effectsFilteringSI, CrosstalkLayout and placementAperture/Resonant effectsShieldingSPDInduced Curre

39、nt & Charge on Structure or victim components48PCB, Chassis, Connectors, External CablesEstimating RF Interference Levels in Mixed Digital/RF Designs4949RFI/EMI Analysis for RF DevicesPossible coupling pathsRadiation through aperture in chassis and picked up by antenna.Direct field coupling inside c

40、hassis, heat-sink radiation, high speed signal trace radiation, etc.Coupling through power distribution system.Coupling through loop formed by chassis and ground planes50Far FieldNear Field50Near field Coupling Path Loss51Platform Noise is a problem today and will get worse if we do nothingPlatform

41、RF Interference severelyimpacts wireless performance.Getting worse for future platformsMore Victim RadiosLicensed Radios (more stringent reqs.)Higher GHz Sources (I/O & Components)UMD devices force noise closer to radios5253S/N Performance TIS (Sensitivity)RFData RateThroughputUser Scenario(Applicat

42、ion Layer)High Speed Digital (ICs/Modules)Platform Noise CouplingThe difference between wireless link rate, actual file transfer and web browsing speed53Webpage Loading(Physical Layer)quality of experience (QoE)Aspect of EMC stages54Critical industrial needs for EMC5555Development trends for new EMC

43、-strategiesproduct56Key Components for Wireless Devices57575858Link budget vs. Noise budgetLink Budget- Specify all the component- Specification like insertion loss, VSWR, NF, from antenna to I/Q demodulator.ANTENNA GAINDIPLEXER INSERTION LOSSMISMATCHING LOSSLNA GAINLNA NOISE FIGURESAW FILTER LOSSMI

44、XER CONVERSTION LOSSSAW FILTER LOSSI/Q CONVERSTION LOSSNoise Budget-Specify the Noise power Specification for different component at different locationNoise PowerCPUNORTH BRIDGE(LVDS DIRVER.)MEMORYLVDS SOKETLVDS FLAT FLEX CABLELCD PANEL (T-CON, BACKLIGHT)WEB CAMMINI COAXIAL CABLE FOR RFSOUTH BRIDGEO

45、utline59Introduction to EMI and RFI for High-Speed SystemsTrend of Wireless Communications and Automotive DevelopmentPlatform Noise Impact on ThroughputEMI Analysis of Key Components in Mobile DeviceApplication of Noise Budget and Analysis Model for System IntegrationConclusion59 Siemens Automotive

46、ToulouseMost of the time, EMC measurements are performed once the equipment is built.No improvements can be done at conception phase.Predict EMC performances IC, board, equipment optimizationsHowever, need of non-confidential IC models (black box models)Equipment designers want to predict EMC before

47、fabrication6061Application Concept of Noise BudgetInterference SourceInterference Frequencies Interference PositionCommunicationsPerformance61Predict system-level performance from component-level informationOld Approach: Put the components in a “typical” system and measurement the system performance

48、.62Better Approach: Fully characterize the components themselves, then model system behavior.ESD Waveform EFT Waveform EMI Spectrum63Magnetic ProbeTEM Cell BCI.Compatibility Analysis ModelGeneric StandardsBasic StandardsProduct Family StandardsProduct StandardsNLimit (dBm) =SM (dBm) + GA (dBi) SNR (

49、dB)Mechanisms for ICEM parasitic emissionthat can be used at the system level.Otherwise, they are mostly useless!64Couple through supply lines (PI)Couple through input/output lines (SI)Component measurements should characterize the source in order to build modelsDirect Radiated couplingStandard meth

50、ods for emission characterization of ICs6565Standard methods for immunity characterization of ICs6666Intra-System EMI and PCB level EMCSystem level EMC must be taken care at component level67Pre-Layout Placement DesignMajor players in this interference problemDigital IC Noise Source a library modelR

51、F Interference Coupling Path modeling or measurementRF antenna Victim a library model Noise voltage at RF receiver can be quickly estimated68Two Source Reconstruction ApproachesSource reconstruction based on TEM cell measurementTest PCBDipole extraction from TEM measurement-Correlation to far-field

52、measurementSource reconstruction based on near-field scanning measurementCalculation of equivalent dipolearray from near-field scanningReconstruction of fields atany location from dipole array.69Horizontal and vertical magnetic near field scan of a SoC70(Nexio from 2016 IEEE Electromagnetic Compatibility Magazine Volume 5 Quarter 1)(a) 2D horizontal scan70(b) Vertical scan plot from a full 3D near-field scan