ASM IHAWK教材 BSOB BBOS參數(shù)設(shè)定

本文格式為Word版，下載可任意編輯——ASMIHAWK教材BSOBBBOS參數(shù)設(shè)定ASMASMAdvancedProcessTraining–WBDevelopmentGroupTailBreakBSOB/BBOSControlBondStitchOnBall(BSOB)/BondBallOnStitch(BBOS)/ContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMASMAdvancedProcessTraining–WBDevelopmentGroupConceptandTheory?Applicationisveryusefultodietodiebonding?Improvedqualityandreliabilityondietodiebonding?EliminatescapillarymarkwhilepromotinggoodintermetallicbetweenballandsurfaceThebumpballformationprocessisalmostlikebondinganormalwire,including1stbond,loopingand2ndbondparameters.BSOBBBOSContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMASMAdvancedProcessTraining–WBDevelopmentGroupBallParametersforBSOBandBBOS?ScrubDistance–Thiscontrolsthehorizontalmovementofthecapillarywithascrubbingmotiontoweakenthewireattheneck.–Range5–30(*0.8um)ScrubDistanceContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMASMAdvancedProcessTraining–WBDevelopmentGroupWireParametersforBSOBandBBOS?2ndBondPtOffset–Wireoffsetparameterrequiredtoensuremaximumcontactareabetweenthestitchbondandtheball–Range10–30(*0.8um)2ndBond(wedge)StandoffballCapillaryPositionduringstitchbondContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMBondStitchOnBall-BSOB說明：主要使用在MCM或是Stackdie的產(chǎn)品上，其他需要較佳的Wirepull時(shí)也可以使用。2ndBond(wedge)1stBondDie1Die2BondBall圖1:BondStickOnBall(BSOB)5

ASMBondBallOnStitch(BBOS)/SecurityBond說明：BBOS是為了保證銲線的安全性，這個(gè)製程主要是在2nd點(diǎn)銲再植上一個(gè)球以確保銲著性。(圖2)1stDie1BondLeadBondBall2ndBond(wedge)圖2:BondBallOnStitch(BBOS)6ASMBSOB植球參數(shù)控制選單7ASM植球動(dòng)作順序：1.先在‘’Device2‘’上執(zhí)行燒球動(dòng)作‘’FAB2‘’。FAB2Device1Device28ASM2.針下降到鋁墊上：運(yùn)用1stBond植球的參數(shù)形成‘BallThickness’and‘BallSize’W/clamp‘打開’CapillaryDevice1Device2植球過程是運(yùn)用植球參數(shù)。9ASM3.瓷嘴上昇：瓷嘴上昇是設(shè)定LoopBase瓷嘴與測(cè)高點(diǎn)之間的距離是‘’Loopbase‘’。線夾‘open’接觸點(diǎn)LoopBase實(shí)際‘’Loopbase‘’=設(shè)定x10um假使Loopbase=2實(shí)際‘’Loopbase‘’=20umDevice1Device2建議設(shè)定=210

ASM4.XYtable移動(dòng)朝向1stBond或是2ndBond的方向：+值朝向2ndbond-值朝向1stbondW/clamp‘open’BallOffset設(shè)定參數(shù)=Settingx0.8um假使BallOffset設(shè)定=22實(shí)際的Balloffset數(shù)值=19.6umDevice1Device2建議設(shè)定參數(shù)=-ve3511ASM5.瓷嘴下降到金球上輸出2ndBond的參數(shù)：瓷嘴下降設(shè)定BallThickness輸出BOSB2ndbaseparameterW/clamp‘open’BallThicknessContactPt.Device1Device2※球厚度的距離時(shí)設(shè)定在測(cè)高點(diǎn)與瓷嘴Tip之間。※建議數(shù)值=212ASM6.瓷嘴水平移動(dòng)作刮擦的動(dòng)作扯弱球頸部的餘線：ScrubDistance的設(shè)定是針對(duì)瓷嘴的移動(dòng)一般會(huì)讓針頭移動(dòng)離開金球上刮擦?xí)r移動(dòng)離開金球W/clamp‘’打開’’實(shí)際刮擦的距離設(shè)定=設(shè)定數(shù)值x0.8um假使‘’Scrubdistant‘’=10實(shí)際移動(dòng)距離=8umDevice1Device213建議設(shè)定=8ASM7.瓷嘴上昇做tailheight：瓷嘴上昇設(shè)定Taillength。W/clamp‘’關(guān)閉‘’Device1Device2建議設(shè)定=3514ASM8.瓷嘴上昇與扯斷線尾，B/H移動(dòng)到燒球高度：W/c‘close’Device1Device215

ASM9.EFO燒球：FABBondBallDevice1Device216ASMBSOB銲線參數(shù)17ASM植球後銲線2ndBond：2ndBond(wedge)1stBondBondBallDevice1Device1Device218ASMnd2Bond銲線位置偏移魚尾位置瓷嘴針孔位置植球位置-值向著1stBond+值向著2ndBond19ASMBSOBBall植球控制參數(shù)的定義4.1)LoopBase這個(gè)參