半導(dǎo)體封裝制程與設(shè)備材料知識(shí)介紹-PPT

1、半導(dǎo)體封裝制程與設(shè)備材料知識(shí)簡介prepareby：williamguo2007.11update,半導(dǎo)體封裝制程概述,半導(dǎo)體前段晶圓wafer制程半導(dǎo)體后段封裝測試封裝前段（b/g-mold）封裝后段（mark-plant）測試封裝就是將前製程加工完成後所提供晶圓中之每一顆ic晶粒獨(dú)立分離，並外接信號(hào)線至導(dǎo)線架上分離而予以包覆包裝測試直至ic成品。,半導(dǎo)體制程,封裝型式(package),封裝型式,封裝型式,封裝型式,封裝型式,封裝型式,assemblymainprocess,diecure(optional),diebond,diesaw,plasma,cardasy,memorytest

2、,cleaner,cardtest,packingforoutgoing,detaping(optional),grinding(optional),taping(optional),wafermount,uvcure(optional),lasermark,postmoldcure,molding,lasercut,packagesaw,wirebond,smt(optional),半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分,半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分,常用術(shù)語介紹,sop-standardoperationprocedure標(biāo)準(zhǔn)操作手冊(cè)wiworkinginstruction作業(yè)指導(dǎo)書pmprev

3、entivemaintenance預(yù)防性維護(hù)fmea-failuremodeeffectanalysis失效模式影響分析spc-statisticalprocesscontrol統(tǒng)計(jì)制程控制doe-designofexperiment工程試驗(yàn)設(shè)計(jì)iqc/oqc-incoming/outingqualitycontrol來料/出貨質(zhì)量檢驗(yàn)mtba/mtbf-meantimebetweenassist/failure平均無故障工作時(shí)間cpk-品質(zhì)參數(shù)uph-unitsperhour每小時(shí)產(chǎn)出qc7tools(qualitycontrol品管七工具)ocap(outofcontrolactionpl

4、an異常改善計(jì)劃)8d(問題解決八大步驟)ecnengineeringchangenotice(制程變更通知)iso9001，14001質(zhì)量管理體系,前道,后道eol,wirebond引線鍵合,mold模塑,lasermark激光印字,lasercutting激光切割,evi產(chǎn)品目檢,sandiskassemblyprocessflowsandisk封裝工藝流程,dieprepare芯片預(yù)處理,ieattach芯片粘貼,waferiqc來料檢驗(yàn),plasmaclean清洗,plasmaclean清洗,sawsingulation切割成型,smt表面貼裝,pmc模塑后烘烤,smt（表面貼裝）-包

5、括錫膏印刷(solderpasteprinting),置件(chipshooting),回流焊(reflow),di水清洗(diwatercleaning),自動(dòng)光學(xué)檢查(automaticopticalinspection),使貼片零件牢固焊接在substrate上,dieprepare(芯片預(yù)處理)togrindthewafertotargetthicknessthenseparatetosinglechip-包括來片目檢(waferincoming),貼膜(wafertape),磨片(backgrind),剝膜(detape),貼片(wafermount),切割(wafersaw)等系列

6、工序,使芯片達(dá)到工藝所要求的形狀,厚度和尺寸,并經(jīng)過芯片目檢(dvi)檢測出所有由于芯片生產(chǎn),分類或處理不當(dāng)造成的廢品.,wafertape,backgrind,waferdetape,wafersaw,inlinegrinding2.bondingaccuracyx/y:25um;3.angleaccuracy:0.5degree;4.thindiepickupsolution:upto2mils(electromagnetic,上片(diebond),2.diebond相關(guān)工藝,上片(diebond),3.diebond相關(guān)材料asubstrate/leadframebdieattachf

7、ilmcwaferaftersawdmagazine彈夾,substrate,basicstructure:,substratebasicinformation,core：玻璃纖維+樹脂，0.1-0.4mm鍍銅層：25um+/-5um鍍鎳層：5.0-12.5um鍍金層：0.50-1.10umsoldermask：25um+/-5um總厚度：0.10-0.56mm,發(fā)料烘烤,線路形成(內(nèi)層),aoi自動(dòng)光學(xué)檢測,壓合,4layer,2layer,蝕薄銅,綠漆,線路形成,塞孔,鍍銅,deburr,鑽孔,鍍ni/au,包裝,終檢,o/s電測,成型,aoi自動(dòng)光學(xué)檢測,出貨,bga基板製造流程,(op

8、tion),上片(diebond),4.diebond輔助設(shè)備a銀漿攪拌機(jī)利用公轉(zhuǎn)自轉(zhuǎn)離心力原理脫泡及混合；主要參數(shù)有：mixing/deformingrevolutionspeed外加計(jì)時(shí)器；公轉(zhuǎn)用于去泡；自轉(zhuǎn)用于混合；,bcuringoven無氧化烤箱主要控制要素：n2流量；排氣量；profile溫度曲線；每箱擺放magazine數(shù)量；,cwafermapping應(yīng)用,wirebond(引線鍵合)dietopackageinterconnectshowadieisconnectedtothepackageorboard.-用金線將芯片上的引線孔和基片上的引腳連接，使芯片能與外部電路相連。在

9、引線鍵合前需要經(jīng)過等離子清洗(pre-bondplasmaclean)以保證鍵合質(zhì)量,在引線鍵合后需要經(jīng)過內(nèi)部目檢(ivi),檢測出所有芯片預(yù)處理,芯片粘貼和引線鍵合產(chǎn)生的廢品.,wirebondkballsize=y;area=(y/2)x/(y/2)=zg/mil,等離子工藝plasmaprocess,氣相-固相表面相互作用gasphase-solidphaseinteractionphysicalandchemical分子級(jí)污染物去除molecularlevelremovalofcontaminants30to300angstroms可去除污染物包括contaminantsremoved

10、難去除污染物包括difficultcontaminantsfingerprintsfluxgrosscontaminants,oxidesepoxysoldermask,organicresiduephotoresistmetalsalts(nickelhydroxide),plasmacleanmarchap1000,keytechnology:,1.argoncondition,nooxidation.2.vacuumpumpdustcollector.3.cleanlevel:blobtestangle8degree.,plasma,pcbsubstrate,die,+,+,+,+,+,

11、+,+,+,+,+,+,electrode,+,ar,wellcleanedwithplasma,8o,chip,ar,ar,noclean(organiccontamination),wellcleanedwithplasma,80o,8o,organiccontaminationvscontactangle,waterdrop,chip,chip,mold(模塑)tomoldstripwithplasticcompoundthenprotectthechiptopreventfromdamaged-塑封元件的線路，以保護(hù)元件免受外力損壞，同時(shí)加強(qiáng)元件的物理特性,便于使用.在模塑前要經(jīng)過等離

12、子清洗(pre-moldplasmaclean),以確保模塑質(zhì)量.在模塑后要經(jīng)過模塑后固化(postmoldcure),以固化模塑料.,塑封(molding),molding設(shè)備atowayps&y-seriesbasaomega3.8,機(jī)器上指示燈的說明：1、綠燈機(jī)器處于正常工作狀態(tài)；2、黃燈機(jī)器在自動(dòng)運(yùn)行過程中出現(xiàn)了報(bào)警提示，但機(jī)器不會(huì)立即停機(jī)；3、紅燈機(jī)器在自動(dòng)運(yùn)行過程中出現(xiàn)了故障，會(huì)立即停機(jī)，需要馬上處理。,機(jī)器結(jié)構(gòu)了解正面,機(jī)器結(jié)構(gòu)了解背面,cullbox用來裝切下來的料餅；outmg用來裝封裝好的l/f；配電柜用來安裝整個(gè)模機(jī)的電源和plc，以及伺服電機(jī)的servopack。,塑封(molding),2.molding相關(guān)材料acompound塑封膠bmoldchase塑封模具