FPC專業(yè)詞匯中英文對照

1、FPC名詞中英對照1.目的通過對行業(yè)標(biāo)準(zhǔn)的FPC工程名詞引用及我司標(biāo)準(zhǔn)的整合，旨在為我司FPC名詞的中英用語實現(xiàn)使用上的統(tǒng)一化2.適用范圍規(guī)范FPC相關(guān)工程上出現(xiàn)之不良項目，生產(chǎn)使用之材料、設(shè)備、治具以及可靠性試驗等中英文名3.定義類別一：FPC不良項目名詞工程類別不良名稱中文英文導(dǎo)線VisualInspection of Con ductors導(dǎo)線Con ductors開路Open短路Short缺口Nicks針孔Pin holes額外銅刺Extra neous Copper Betwee n Con ductors毛刺Sp urs結(jié)瘤Nodules蝕刻凹痕Etched Con cave導(dǎo)線分

2、層Con ductor Delam in ati on裂紋Cracks導(dǎo)線劃痕Scratches on Con ductor凹坑Dents變色Discolorati on基底薄膜VisualInspection of Base Film凹坑Den ts劃痕Scratches on Base Film覆蓋層和覆蓋涂層VisualInspection of Coverlay and Covercoat凹坑Dents on Coverlay and Covercoat劃痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalig n毛刺Co

3、verlay Burrs外來物導(dǎo)電性異物Con ductive Foreig n MattersForeig n Matters非電性異物Non-con ductive Foreig n Matters起泡和分層Blisteri ng and Delam in ati on覆蓋層粘結(jié)劑擠出Squeeze-out of Adhesive of Coverlay覆蓋涂層滲出Ooze-out of Covercoat覆蓋涂層跳漏Skipping of Con vercoat電鍍金屬或焊錫的 表面條件SurfaceCon diti on ofP lated Men tai and Solder鍍金Go

4、ld Plati ng鍍金層缺陷Gold Plat ing Defects鍍錫Tin Plat ing電鍍金屬或焊料的滲透Pen etratio n of P lated Metal or Solder變暗（變黑）Darke ned App eara nee (Blacke ningDiscolorati on)鍍銅孔內(nèi)鍍層空洞Plat ing Voids in P lated-though Hole鍍金粗糙Rough Gold鍍金白霧Gold Discolorati on鍍金變色Gold Discolorati on鍍金層龜裂Gold Crack鍍金針孔Gold Pin hole電鍍露銅P

5、lated Expose Wetti ng剝離P lated P eeled Off電鍍滲入P lated Wicki ng漏鍍No Plat ing表面?zhèn)跴I at ing Scratch電鍍粗糙Rough P lated藥水滲入Wicki ng外形和孔邊緣VisualInspection of Edges of Outli ne and Holes撕裂和缺口Tears and Nicks毛刺Burrs絲狀毛刺Thready Burrs彎曲、變形Warp age微連筋不良Poor Micro-jo int外形偏移Outli ne Misalig n外形漏沖No Outli ne反折偏位Be

6、nding Line Misalig n增強板VisualImp erfectio ns Related to Stiffe ner BondingFPC與增強板之間 的外來物Foreign Matter Between Flexible Printed Board and Stiffe nerFPC與增強板之間 的空洞Voids Betwee n Flexible Prin ted Board and Stiffe ner裂紋Cracks缺角Chi p-off劃痕Scratches變形Deformati on表面附著物AffixedSubsta nces on增強板貼偏移Stiffe ner

7、 Misalig n熱固膠Thermosett ing Adhesive焊劑殘渣Flux Residues金屬粉末殘渣Residue of Metal Po wdersthe Surface粘結(jié)劑殘渣Residue of Adhesive突起Protrusi ons凹坑Dents弓曲Bow扭曲Twist標(biāo)1記 Marking尺寸檢驗Dime nsional Inspections尺寸測量Measureme nt of Dime nsions外部尺寸Exter nal Dime nsions厚度Thick ness孔Holes元件孔Component Holes導(dǎo)通孔Via Holes導(dǎo)通孔偏移

8、Via Hole Misalig n安裝孔Moun ti ng Holes導(dǎo)線寬度Co nductor Widths導(dǎo)線之間的間距Cleara nces Betwee n Con ductors孔中心間距Dista nee Betwee n Hole Cen ters板邊和導(dǎo)線之間的 最小距離Minimum Dista nee Betwee n Board Edges and Con ductors標(biāo)記錯誤Wrong Marking字符不清晰Un clear Letter定位精度Po siti onalAccuracy孔的定位精度Po siti onal Accuracy of Holes孔與

9、焊盤的重合性Registrati on of Hole to Land覆蓋層與焊盤的重合性Registrati on of Coverlay (or Covercoat) to Land增強板與FPC的重 合性Registratio n ofStiffe ner to FPC孔的重合性Registratio n of Holes外形的重合性Registratio n of Outl ines沖外形與導(dǎo)線圖形 的重合性Registratio n of Pun ched Outl ine to Con ductor P atterns壓敏膠或熱固膠與FPC和增強板的重 合性Registratio

10、n of P ressure Sen sitive or Heat Activated Adhesives to FPC and Stiffe ner鍍通孔的鍍銅層厚 度PI ati ng Thick ness of Copper Pan ted-through Holes其它Other短裝Shortage混裝Mixed Stowage/Pack ing離型紙脫落Released Paper P eeled off材料錯誤Wrong Material類別二：PFC工程用語工程類別中文英文板Board Type單面板Sin gle Sided Flex Circuits單面雙接觸Double A

11、ccess or Back-bared Flex Circuits雙面板Double Sided Flex Circuits軟硬結(jié)合板Rigid-flex Circuits模具Die模具圖紙Die Drawi ng量產(chǎn)模具M(jìn)ass P roductio n Die樣品模具P rototy pe Die鋼模Steel Die刀模Die上模Top Die下模Bottom Die線切割Wire Cut外形模具Outli ne Cut保護(hù)膜模具Coverlay Die膠紙模具P ressure Sen sitive Adhesive Die補強模具Stiffe ner Die銀漿模具Silver Di

12、e導(dǎo)柱P ost沖頭Punch分割刀模Cutti ng Steel Rule Die銷釘Pin治具Jig( Fixture)貼合治具Lam in ati on Jig電測治具Electrical Check Jig假貼治具Tack ing Jig曝光治具Expo sure Jig絲印網(wǎng)框Scree n Printing Frame孔Hole曝光定位孔Guide Hole for Exp osure模具定位孔Guide Hole for Die假貼定位孔Guide Hole for Tack ing貼合定位孔Guide Hole for Adhesive電測定位孔Guide Hole for E

13、lectrical Test絲印定位孔Guide Hole for Scree n Prin ti ng孔環(huán)Lifted Land滲錫孔Sta nnize Hole裝配孔Fitti ng Hole制程Manu factureP rocedure下料Material Prep arati on鉆孔Drilli ng鍍銅Copper PI at ing化學(xué)銅leEletcroless Plati ng Copper貼干膜Sen sitive Dry Film絲印阻焊油墨Liquid Photose nsitive Soldermask曝光Expo sure顯影Devel oping蝕刻Etchi

14、ng脫膜Stri pping貼保護(hù)膜Tack ing Coverlay粗化Abrade層壓Lam in ati on原材料Material固化（烘烤）Curi ng黑孔Black Hole表面處理Surface Treatme nt循環(huán)水洗Cascade Rinse微蝕Micro-etch酸洗Acid Clea ning水洗Water Clea ning防銹處理An ti-corrosio n Treatme nt前處理P re-treatme nt刷板Brush ing干燥Dry up電鍍（金、錫、 鎳）(Gold、Solder、Nickel) Plating閃鍍(Gold ) Flash

15、Plat in g/Strike Plat ing局部電鍍P attern P late化學(xué)鎳金Immersio n Gold有機保焊膜Orga nic Solderability Preservatives (OS P)絲印字符Prin ti ng of Lege nd貼補強板Back Board Lam in ati on電性能測試Electrical Inspection貼膠紙Double Faced Adhesive Tape打孔Punching雷射切割Laser Cut自動光學(xué)檢驗Automatic Op tical Insp ecti on(AOI)表面貼裝Surface Mou

16、nting Techn ology( SMT外形沖切Punching沖孔Punching外觀檢查Final Insp ecti on目視檢查Visual Insp ecti on(Final Inspection)線路顯微鏡檢 驗（鏡檢）Con ductor Microsc ope Insp ecti on性能測試Reliability Test包裝Pack ing銅箔Copper Foil (CU)電解銅Electro-de posited Copper Foil (ED)壓延銅Rolled Ann ealed Copper Foil (RA)保護(hù)膜Coverlay (CVL)基材Base

17、Material撓性覆銅板Flexible Copper Clad Lami nate (FCCL)無膠基材Adhesiveless FCCL粘接劑（膠）Adhesives (Ad)壓克力Acrylic頂層補強Top Stiffe ner底層補強Bottom Stiffe ner頂層銀漿膜Top Silver P aste底層銀漿膜Bottom Silver P aste銀漿油墨Sliver InkOthers頂層線路Top Circuits/C on ductors底層線路Bottom Circuits/C on ductors半固化片Bo nding Film (BOD)聚酰亞胺Po ly

18、imide( PI)1聚酯P olyester Film (P ET)鋼片Sheet Steel玻璃纖維布Wove n Glass ClothFR4補強板Fiberboard液態(tài)感光油墨Liquid P hotoimageable Resist Ink壓敏膠P ressure Sen sitive Adhesive( PSA離型膜Release Paper導(dǎo)電膠Con duct ing Resin導(dǎo)電布Electric Fabric泡棉Foam導(dǎo)向?qū)щ娔zAn isotro pic Con ductive Film( ACF導(dǎo)電泡棉Con ductive/Electric Foam屏蔽膜Shie

19、ld Film（金屬）薄膜開 關(guān)Metal Dome ( DOME連接器Conn ector電容Cap acita nee ( C )電阻Resista nee ( R )集成電路In tegrated Circuit( IC)二極管Diode (D)靜電Electro-Static Discharge( ESD機械方向Machi ne Direction( MD垂直方向Tran sverse Direct ion(TD進(jìn)刀Feed進(jìn)刀量Chip Load轉(zhuǎn)速Sp eed焊接Solderi ng手工焊接Hand Solderi ng波焊Wave Solderi ng品質(zhì)允收標(biāo)準(zhǔn)Acce pta

20、ble Quality Level( AQL)菲林Film字符Legend烘箱Ove n溫度Temp erature濕度Humidity速度Sp eed壓力P ressure噴淋壓力Spo ut ing P ressure濃度Concen trati on原理圖紙Schematic Diagram線寬Line Sp ace線距Line Width線路間距Pitch引用標(biāo)準(zhǔn)：IPC/JP CA-6202單、雙面繞性印制板的性能手冊類別三：FPC可靠性測試項目中文英文電氣性能Testi ng of Electrical Performanee導(dǎo)線電阻Con ductor Resista nee表面層絕緣電阻Surface In sulati on Resista nee (SIR)表面介質(zhì)層耐電壓強度Dielectric Withsta nding Voltage of Surface Layers機械性能測試Testi ng of Mechanical Property剝離強度P eel Stre ngth孔