田中銀合金線AgSEA技術(shù)資料

1、Ag 合金線SEA型號(hào)Tanaka Denshi Kogyo K.K.Technical Department TANAKA DENSHI KOGYO K.K.半導(dǎo)體市場(chǎng)的發(fā)展趨勢(shì)小型化微間距低線弧的運(yùn)用縮減成本降低材料成本低成本提高生產(chǎn)力UPHMTBA參數(shù)范圍簡(jiǎn)單的參數(shù)設(shè)定客戶的要求: 低價(jià)格材料高生產(chǎn)力LED Device市場(chǎng)的發(fā)展趨勢(shì)小型化低線弧短弧長(zhǎng)縮減成本降低材料成本低價(jià)格材料提高生產(chǎn)力UPH參數(shù)范圍簡(jiǎn)單的參數(shù)設(shè)定高亮度高反射率客戶的要求:低價(jià)格材料高生產(chǎn)力高性能Yes (氣體配件No 資金總額Yes (N2-H2No 混合氣體芯片損傷第一焊點(diǎn)參數(shù)生產(chǎn)力(UPH etc 反鍵合第二焊

2、點(diǎn)參數(shù)材料成本銅線金線項(xiàng)目Ag 為主的鍵合線Yes (氣體配件Yes (N2銀線Au, Cu, 和Ag 合金線的比較(壞(好材料成本/ 接合性4 TANAKA新Ag合金線的命名命名:S E A序號(hào)Enhanced的英文首字母Silver的英文首字母SEA 型號(hào)的特點(diǎn)1. 材料成本低以銀為主,低材料成本的鍵合線2. 鍵合性SEA 型號(hào)能在金線打線參數(shù)下打線3. 微間距SEA 的壓著球真圓度良好5機(jī)械特性設(shè)備: 拉伸試驗(yàn)機(jī)UTM-拉伸速度: 10mm/min 試料長(zhǎng)度: 100mm 測(cè)定數(shù)= 10鍵合線: SEA(Ag 合金線TCA1(裸銅線CLR-1(鍍鈀銅線GFC(金線0.8 1.0 1.2

3、1.4 1.6Wire diameter (milB r e a k i n g L o a d (g f SEATCA1 (Bare CuCLR-1 (coated CuAu (GFC6電阻率SEA型號(hào)的電阻率比金線高測(cè)定方法根據(jù)直流4端子法,通過一定的電流,測(cè)定當(dāng)時(shí)的電壓。根據(jù)測(cè)定值計(jì)算電阻。R=V / I(R:電阻V:電壓I:電流根據(jù)右側(cè)公式,計(jì)算電阻率。= R×S/L(:電阻率S:橫截面積L:長(zhǎng)度99.99%Au 99.99%CuAg alloy GPG-2GPH GFCTCA1SEAR e s i s t i v i t y (u c m

4、 3N 4N7熔斷電流計(jì)算公式0.00.02.0 4.0 6.0Wire Length (mmF u s i n g C u r r e n t (A 0.7mil0.8mil 0.9mil 1.0mil0.02.0 4.0 6.0Wire Length (mmF u s i n g C u r r e n t (A 0.8mil SEA0.8mil Cu wire 0.8mil A u alloy 0.8mil 4N-AuSEA的熔斷電流與金合金線的一樣。在Eugene Loh技術(shù)報(bào)告中提到的公式:IEEE Trans.Comp.,Hybrids,Manu.Tech.,Vol6,no.2,P

5、.209,JUNE1983.報(bào)告的標(biāo)題是“Fussed-Open Bond Wires 物理分析資料”FAB形成性氣體流量的確認(rèn)8打線機(jī):UTC-3000 裝有氣體配件, 保護(hù)氣體:N21.0 l/min0.2 l/min0.4 l/min0.6 l/min0.8 l/min好901002003004005006005101520Deformation (um C o m p r e s s i o n L o a d (m N SEACoated Cu Bare Cu 4N-AuFAB 壓縮試驗(yàn)Flat tool FAB【FAB 制造條件】線徑:20um FAB:38m打線機(jī):Shinkaw

6、a UTC-1000氣體:N 2, 0.6l/min EFO 時(shí)間:0.36msEFO 電流:36mA(銀合金49mA(鍍鈀銅46mA(4N-金【測(cè)定設(shè)備】壓縮裝置:MCT-W500(SHIMADZU 【測(cè)定概圖】【測(cè)定條件】壓縮速度:23.5mN/sec 最大負(fù)荷:400mN 硬度比較軟Au wire >SEA > Cu wire 硬10第一焊點(diǎn)【Al-Splash】【Bonding condition 】Bonder:Shinkawa UTC-1000Gas :N2 0.6l/minDie-Pad:Al-0.5%Cu(t=0.8umCapillary :SPT SI (H:25

7、, T:130, CD:38, FA:8, OR:30Wire diameter :20umFAB diameter :38um鍍鈀銅線US-Power 260 US-Power 200SEA US-Power 170Search Level :120umSearch Speed :8.0mm/sSearch Force :40gfBond Force :40gfUS-Power :170230US-Mode :-2Pre US-Power :40Bond Time :6.0ms11第一焊點(diǎn)Squashed Ball & Shear Force【Bonding condition 】B

8、onder : UTC-3000Gas : N2 0.6l/min Die : Al-1.0Si-0.5Cu(t=0.8um Capillary : SPT SI Wire dia. : 20um FAB dia. : 38um S-Level : 150um S-Speed : 4mm/s Bond Time : 6ms Pre-US : 40N=24Ave. (Std.25320280240US Power203015Search Force & Bond Force (gfXYToolGap: 3um12樣品型號(hào): SEA,GFC 線徑: 18um觀察項(xiàng)目縱切面: FAB &am

9、p; HAZ 橫切面: FAB , Wire設(shè)備Focused Ion Beam (FIB : Hitachi FB2000A橫切面縱切面結(jié)晶觀察1399.99%Au (GFCSEA結(jié)晶觀察(縱切面14Wire SEA99.99%Au(GFCFAB結(jié)晶觀察(橫切面15第二焊點(diǎn)Wire Pull at 2nd Position【Bonding condition 】Bonder :Shinkawa UTC-1000Gas :N2 0.6l/minDie-Pad :Al-0.5%Cu (t=0.8um Capillary :SPT SI(H:25, T:130, CD:38, FA:8, OR:3

10、0Wire diameter :20umSearch Level :100um Search Speed :4.0mm/sSearch Force & Bond Force :52gf US-Power :440560Bond Time :6.0ms:2nd bond lift occurred.23456784204605005405802nd US-PowerP u l l F o r c e (g f TANAKA Ag alloy wire23456784204404604805005205405605802nd US-PowerP u l l F o r c e (g f E

11、rror bar is STD.Pd coated Cu wireN=3016可靠性【Migration Test】Pass SEA 0/22Sample-30 / 22Sample-30/22Sample-20 / 22Sample-20/220 / 21PassSample-14N-Au wireSample-1ResultFailure / sample size (pinTerminal distance : 30 50 umVoltage : DC 6VHAST Machine : PC-R8D (HIRAYAMAMetal : Al-0.5%Cu 0.6um 40umFAB siz

12、e 0.8mil Wire dia.Size :6mm ×6mm ×300um Device130deg C 85%RH 96hHAST ConditionsQFP200pinFrame UTC-1000 ( Shinkawa Bonder SEA / 4N-Au wire Wire DC 6V+-+-+-3050um1743 44 umTarget squashed ball 33um FAB diameter ElBL 3.0 %8.9 gf Mechanical Properties 19.0 um Wire diameter SEA Wire type Thickn

13、essMetallization GE-7470 / non halogen compound Mold Resin QFP-200pin / Ag plating Flame 0.8 umAl-1%Si-0.5%Cu DieK&S 414FF-2021-R35(H10 CD13 T28 OR5 FA11Capillary 0.6 l / minForming Gas Shinkawa UTC-3000 with Cu kit Bonding Machine 121 deg / 100% / 2 atmPCT conditionPCT (Pressure Cooker test18PC

14、T【1st Bonding condition 】Bonder :Sinkawa UTC-3000Cu-kit Gas :N2 0.6l/minDie-Pad :Al-1.0%Si-0.5%Cu (t=0.8um Frame :QFP200pin Resin :NITTO DENKOGE-7470(non halogen Capillary :K&S 414FF-2021-R35(H10 CD13 T28 OR5 FA11Wire diameter :19.0um FAB diameter :33umSpark Current : 30mASpark Time : 0.26msTarg

15、et of Squashed all size : 44umTail Length : 100umSearch Speed : 4mm/secBond Force :15-30gfUS Power : 180-320Bond Time : 10msec US Time : 8msecUS mode : 0【SEA1】Shear force: 6.2kgf/mm2Bond Force : 20gf, US : 180【SEA2】Shear force : 11.5kgf/mm2Bond Force : 20gf, US : 280【SEA3】Shear force: 12.7kgf/mm2Bond Force : 20gf, US : 320【Au wire 】Shear force : 10kgf/mm2up0.04.04.55.0020040060080010001200