線路板的中英文對(duì)照8

1、線路板的中英文對(duì)照c-10顯 影(Developing )c-11去膜(Stripping )D.壓 合Laminationd-1黑 化(Black Oxide Treatment)d-2微 蝕(Microetching)d-3鉚釘組合(eyelet )d-4迭板(Lay up)d-5壓 合(Lamination)d-6后處理(Post Treatment)d-7黑氧化( Black Oxide Removal )d-8銑靶(spot face)d-9去溢膠(resin flush removal)(Copper Reduction)薄化銅(Copper Reduction) (Horizon

2、tal Electrolytic Plating)水平電鍍(Horizontal Electro-Plating) (Panel Plating)錫鉛電鍍( Tin-Lead Plating ) (Pattern Plating)低于1 mil ( Less than 1 mil Thickness ) f-4高于1mil ( More than 1 mil Thickness)砂帶研磨(Belt Sanding)微切片( Microsection) (Plug Hole)印刷( Ink Print )表面刷磨(Scrub)h-9 UV烘烤(UV Cure)h-10文字印刷( Printing

3、 of Legend )h-12印可剝離防焊(Peelable Solder Mask)第 1*Process Module說(shuō)明: A.下料( CutLamination)a-1裁板( Sheets Cutting)B.鉆孔(Drilling)b-1內(nèi)鉆(Inner Layer Drilling )b-3二次孔(2nd Drilling)a-2b-4原物料發(fā)料(Panel)(Shear material to Size)b-2一次孔(Outer Layer Drilling )雷射鉆孔(Laser Drilling )(Laser Ablation )b-5盲(埋)孔鉆孔(Blind &

4、; Buried Hole Drilling) C.干膜制程( Photo Process(D/F)c-1c-3c-5c-7c-9前處理(Pretreatment)曝 光(Exposure)蝕銅(Etching)初檢( Touch-up)選 擇 性 浸 金 壓 膜(Selective Gold Dry FilmLamination)c-2c-4c-6c-8壓 膜(Dry Film Lamination)顯 影(Developing)去膜(Stripping)化學(xué)前處理,化學(xué)研磨( Chemical Milling )E.減銅e-1F.電鍍f-1 f-2 f-3f-5 f-7G.塞孔g-1 g-

5、3f-6剝錫鉛( Tin-Lead Stripping)預(yù)烤(Precure)后烘烤(Postcure)g-2g-4H.防焊(綠漆): (Solder Mask)C面印刷(Printing Top Side)靜電噴涂(Spray Coating)預(yù)烤(Precure)顯影(Develop)h-1h-3h-5h-7h-2h-4h-6h-8S面印刷(Printing Bottom Side)前處理(Pretreatment)曝光(Exposure)后烘烤(Postcure)h-11噴砂( Pumice)(Wet Blasting)第2頁(yè)I .鍍金Gold platingi-1金手指鍍鎳金( Gol

6、d Finger )i-3浸鎳金( Immersion Ni/Au) (Electroless Ni/Au)J.噴錫(Hot Air Solder Leveling)j-1水平噴錫(Horizontal Hot Air Solder Leveling) j-2垂直噴錫( Vertical Hot Air Solder Leveling)j-3超級(jí)焊錫(Super Solder )K.成型(Profile)(Form)k-1撈型(N/C Routing ) (Milling)k-3板面清洗烘烤(Cleaning & Backing) k-5金手指斜邊( Beveling of G/F)N

7、.雷射鉆孔(Laser Ablation)N-1雷射鉆Tooling孔(Laser ablation Tooling Hole)N-2雷射曝光對(duì)位孔(Laser Ablation Registration Hole)N-3雷射Mask制作(Laser Mask)N-4雷射鉆孔(Laser Ablation)N-5 AOI檢查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7除膠渣(Desmear) A/W(artwork)底片abrade粗化

8、absorption吸收N-8微蝕(Microetching )Ablation燒溶(laser),切除abrasion resistance耐磨性ACC ( accept ) acceleratedcorrosion test accelerated testacceleration acceleratoracceptable activator active workin process adhesion允收 加速腐蝕 加速試驗(yàn) 速化反應(yīng)加速劑 允收 活化液 實(shí)際在制品 附著力i-2電鍍軟金(Soft Ni/Au Plating)j-4.印焊錫突點(diǎn)(Solder Bump)k-2模具沖(P

9、unch)k-4 V型槽( V-Cut)(V-Scoring)(Electrical Testing) (Continuity & Insulation Testing)L.短斷路測(cè)試l-1 AOI光學(xué)檢查( AOI Inspection)l-3泛用型治具測(cè)試(Universal Tester)l-5飛針測(cè)試(Flying Probe)M.終檢( Final Visual Inspection) m-1壓板翹( Warpage Remove) m-3包裝 及出貨(Packing& shipping) m-5清洗 及烘烤( Final Clean &Baking) m-7

10、離子殘余量測(cè)試m-8冷熱沖擊試驗(yàn)l-2 VRS目檢(Verified & Repaired)l-4專(zhuān)用治具測(cè)試(Dedicated Tester)m-2 X-OUT印刷(X-Out Marking)m-4目檢( Visual Inspection) m-6護(hù)銅劑(ENTEK Cu-106A)(OSP)(IonicContaminationTest)(CleanlinessTest)(Thermal cycling Testing)m-9焊錫性試驗(yàn)( Solderability Testing )第3頁(yè)adhesive method airinclusion air knifeamorp

11、hous change amountamylnitrite analyzer backlighting back-up bankedwork in process basematerial baselineperformance batch betabackscattering bevelingbiaxial deformationblack-oxide blank controllerblank panel blanking blipblister blistering blow holeboard-thickness errorbonding plies bow ; bowingbreak

12、 out bridging BTO(Build To Order) burning黏著法氣泡風(fēng)刀不定形的改變總量硝基戊烷分析儀回火環(huán)狀墊圈;孔環(huán)陽(yáng)極泥 陽(yáng)極處理 自動(dòng)光學(xué)檢測(cè) 引用之文件 允收水平抽樣 液態(tài)光阻 縱橫比（厚寬比）到貨時(shí) 背光 墊板 預(yù)留在制品 基材 基準(zhǔn)績(jī)效 批貝他射線照射法 切斜邊;斜邊 二方向之變形 黑化 空白對(duì)照組 空板 挖空 彈開(kāi) 氣泡;起泡 氣泡 吹孔 板厚錯(cuò)誤 黏結(jié)層 板彎 從平環(huán)內(nèi)破出 搭橋;橋接 接單生產(chǎn) 燒焦anneal annular ring anode slime(sludge) anodizingAOI ( automatic optical insp

13、ection )applicable documentsAQL sampling aqueous photoresistaspect ratioAs received第4頁(yè)毛邊（毛頭）一體型攝錄放機(jī)碳化物 定位梢 載運(yùn)劑 催化 陰極濺射法隔板;鋼板 校驗(yàn)系統(tǒng)之各種要求 中心光束法 集中式投射線 認(rèn)證倒角（金手指）切斜邊;倒角 特性阻抗 電量傳遞過(guò)電壓 網(wǎng)框 棋盤(pán) 蟹和劑 化學(xué)鍵 化學(xué)蒸著鍍 圓周性之孔破 包夾金屬 無(wú)塵室 間隙鍍外表 防焊覆蓋錯(cuò)誤 熱澎脹系數(shù) 冷焊點(diǎn) 金屬粉末冷焊 顏色顏色錯(cuò)誤 補(bǔ)償 競(jìng)爭(zhēng)力績(jī)效 錯(cuò)化物 錯(cuò)化物 零件孔 零件面 同心 密貼性 消費(fèi)性產(chǎn)品burr camcorde

14、r carbide carlson pincarriercatalyzingcatholicsputteringcaulplatecalibrationsystem requirements center beammethodcentralprojectioncertificationchamferchamferingcharacteristicimpedancechargetransferoverpotentialchasecheckboardchelatorchemicalbond chemical vapor depositioncircumferentialvoidcladmetalc

15、lean room clearance coat coatingerror coefficient of thermal coldsolder joint cold-weld color colorerrorcompensationcompetitiveperformancecomplexsaltcomplexorcomponentholecomponentsideconcentricconformance consumer productsexpansion (CTE)第5頁(yè)contact resistance接觸電阻continuous performance連續(xù)發(fā)揮效能contract

16、service協(xié)力廠controlled split均裂式conventional flow亂流方式conventional tensile test傳統(tǒng)張力測(cè)試法conversion coating轉(zhuǎn)化層convex突出coordinate list數(shù)據(jù)清單copper claded laminates (CCL)銅箔基板copper exposure線路露銅copper mirror鏡銅copper pad銅箔圓配copper residue (copper splash)銅渣c(diǎn)orrosion rate numbering腐蝕速率計(jì)數(shù)系統(tǒng)corrosion resistance抗蝕性co

17、ulombs law庫(kù)倫定律countersink喇叭孔coupon試樣coupon location試樣點(diǎn)covering power遮蓋力CPU中央處理器crack破裂;裂痕crazing裂痕;白斑cross linking交聯(lián)聚合cross talk呼應(yīng)作用crosslinking交聯(lián)crystal collection結(jié)晶收集curing聚合體current efficiency電流效率cut-outs挖空cutting裁板cyanide氰化物cycles of learning學(xué)習(xí)循環(huán)cycle-time reduction交期縮短date code周期deburring去毛頭ded

18、icated專(zhuān)用型degradation退變delamination分層第6頁(yè)dent / pin hole凹陷/針孔第7頁(yè)department of defense國(guó)防部designation字碼簡(jiǎn)示法de-smear除膠渣developing顯影dewetting縮錫dewetting time縮錫時(shí)間dimension error外形尺寸錯(cuò)誤dielectric constant介質(zhì)常數(shù)difficulty困難度difunctional雙功能dimension尺寸dimension stability尺寸安定性dimensional stability尺度安定性dimension and

19、 tolerance尺寸與公差dirty hole孔內(nèi)異物discolor hole孔黑;孔灰;氧化discoloration變色disposable eyelet method消耗性鉚釘法distortion factor尺寸變形函數(shù)double side雙面板downtime停機(jī)時(shí)間drill鉆孔drill bit鉆頭drill facet鉆尖切萷面drill pointer鉆尖重（研）磨機(jī)drilled blank board已鉆孔之裸板drilling鉆孔dry film干膜ductility延展性economy of scale經(jīng)濟(jì)規(guī)模edge spacing板邊空地edge-boa

20、rd contact ( gold finger )金手指efficiency能量效率electric test電測(cè)electrical testing電測(cè);測(cè)試electrochemical machine ECM電化學(xué)加工法electrochemical reactor電化學(xué)反應(yīng)器electroforming電鑄electroless plate化學(xué)銅electroless-deposition無(wú)電鍍electropolishing電解拋光第8頁(yè)電解精煉電解萃取 橢圓形 脆性 可達(dá)成績(jī)效 電鍍夾雜物 環(huán)氧樹(shù)酯 電位線 異常情形 蝕銅速率 蝕刻液 回蝕 評(píng)估用程序 曝光 外部插梢法 鉚釘孔 鉚眼 網(wǎng)布 故障 快速響應(yīng) 瑕庛;缺陷 纖維顯露纖維突出 光學(xué)點(diǎn),基準(zhǔn)記號(hào) 填充料 底片 過(guò)濾 成品 固著 電測(cè)夾具（治具）粹離 燃性等級(jí)喇叭形孔 并排電纜 回饋循環(huán)先進(jìn)先出 彈性制造系統(tǒng) 助焊劑foil distortion銅層變形fold空泡foreign include異物electrorefiningelectrowinning elliptical setembrittlement entitlementperformance entrapmentepoxy equipotential errordata file etch rate etchants