柏盛合金線-IC篇

1、Company ProfileEstablished in Nov. 2008 with dedicated mission of offering competitive alternative wire solution. We believe in fulfilling customers demand & satisfaction to drive us forward. We commit in continuous cost-down efforts.We has solutions for a variety of fine metal wire like Au, Ag,

2、 Cu, Al, Ni, etc., alloy and coating micro metal material on fine wire surface.Physical Properties of Metal Good Electrical Property softer hardness for better bondability369251215MN/m2Vickers Hardness3.02.72.5-Mohs Hardness386234130J/Kg KSpecific Heat 401429316W/mKThermal Conductivity 1.691.632.3cm

3、Resistivity, 20 8.9610.519.3g/cm3Density, 20 256722123080BP Temperature 1083961.91064.4MP Temperature 3.61474.08624.0785ALattice Constant fccfccfccCrystral Structure 294779Atomic Number CuAgAuAtomic Symbol Copper Silver Gold Unit MetalMetalPhysical Properties of Alloy WireWire Diameter ()mil0.8 0.9

4、1.0 1.2 1.5 2.0 m20 123 125 130 138 250 2Mechanical Property(Room Temperature)Breaking Load (gf)5-108-1411-1714-2224-3245-55Elongation (%)2-102-102-102-102-102-12HAZ Length FAB=2WD (m)70-11070-11080-12080-12090-13090-130Hardness (HK)(Knoop,HK,100g load)Ball36-38Wire56-58Resistivity R.T. (cm)5.0HAZ T

5、emp.(Recrystallization Temp )400450Fusion Current L=10 mm (A)0.400.480.620.771.301.60Looping Height (m)Min. 60Min. 60Min. 60Min. 60Min. 70Min. 70Looping Length (mm)Max. 7Max. 7Max. 7Max. 7Max. 7Max. 7PAD Temperature ( )Min. 100Shelf Life RH50%, Temp.4N(Balls)20Ball ShearAvg.28.02Max29.84Min25.42Spec

6、.(gf)12N(Balls)20Bonding Parameter ComparisonResults of DOE CheckAll check result are within spec. with acceptable.Good IMC percentage and no cratering.Reworkable, similar to Au bonding parameters.1000hrs Reliability Test ConditionTEST ITEMTEST CONDITIONAC/RE1.Precondition TestBaking(125+5-0, 24 hou

7、rs) THT(30, 60%RH, 192 hours) Reflow: (260+0/-5,3times0/12.Pressure Cooker Test(PCT)Ta=121 , 100%RH , 2atm1000 Hrs0/13.Temperature Cycling Test(TCT)Ta=-65150(air to air)1000 Cycles0/14.Temperature&Humidity Test (THT)Ta=85 , 85%RH , no bias1000 Hrs0/15.High Temperature Storage Test (HTST)Ta=15010

8、00 Hrs0/16. Solderability test Stem aging / 93 , 8 hrs ,Soldering dip / 245 , 5 Sec.0/1KH Alloy Wire Reliability TestWireTypeN2 GasPackageAlloyKHYesDDRII BGAS/SPreconditionTCTPCTHASTHTSSolderabilityTest22ea192 hrsPass1000 cycPass1000 hrsPass300 hrsPass1000hrsPassPassCross Section ResultPackage Infor

9、mationCustomer: “B”Package: TSOP48Device: NAND 8G x 2Pad opening:70 x75umPad pitch:120umWire count: 47 wiresWire length: .80mmCapillary:KNS 414FC-3416-R35 Wire: 1.0 mil KH alloy wire Pull & Push test result and spec: PASSWire PullAvg.14.63Max15.92Min13.04Spec.(gf)8N(Balls)20Ball ShearAvg.36.02Max42.71Min34.50Spec.(gf)20N(Balls)20KH Alloy Wire DOE CheckAlloy wire (87.09%)Ball SizeAvg56.20Max59.84Min51.26Spec.(m)528N(Balls)20KH Reliability TestPreconditionHTS: 125c, 20hrsTHS: 96hrs, 30C/70% RH