銅箔基板材料技術(shù)課件

INTRODUCTIONOF

COPPERCLADLAMINATENANYAPLASTICSCORPORATION銅箔基板技術(shù)處江澤修1INTRODUCTIONOF

COPPERCLADL1、銅箔基板生產(chǎn)技術(shù)2、銅箔基板原料及品質(zhì)管理3、銅箔基板技術(shù)發(fā)展Content(內(nèi)容)21、銅箔基板生產(chǎn)技術(shù)Content(內(nèi)容)2

全球印刷電路市場應(yīng)用領(lǐng)域(表一)3全球印刷電路市場應(yīng)用領(lǐng)域(表一)3

全球印刷電路市場應(yīng)用領(lǐng)域(表二)4全球印刷電路市場應(yīng)用領(lǐng)域(表二)4何謂銅箔基板?CCL?Cu--------良好導(dǎo)體Core------絕緣體Cu--------良好導(dǎo)體

物性要求5何謂銅箔基板?CCL?Cu--------良好導(dǎo)體電路板基板材料種類基板材料細分類紙基材銅箔基板紙基材酚醛樹脂銅箔基板(非耐燃板、XPC)紙基材酚醛樹脂銅箔基板(耐燃板、FR-1)紙基材聚酯類銅箔基板紙基材環(huán)氧樹脂銅箔基板複合基板Composite銅箔基板(CEM-1)Composite銅箔基板(CEM-3)玻纖布銅箔基板玻纖布含浸耐燃氧樹脂銅箔基板(FR-4)耐熱性玻纖環(huán)氧樹脂銅箔基板(FR-5)玻纖布含浸Polyimide樹脂銅箔基板玻纖布含浸Teflon(PTFE)樹脂銅箔基板軟/硬板PolyesterBase銅箔基板(軟板)PolyimideBase銅箔基板(軟板)Polyester或Polyimide銅箔基板(軟硬板)陶瓷基板氧化鋁基板、氮化鋁基板、碳化矽鋁基板低溫?zé)Y(jié)基板金屬基板金屬Base基板、Metal-Core基板熱塑性基板耐熱性熱可塑性樹脂銅箔基板PTEE類基板Aramid聚亞醯胺銅箔基板6電路板基板材料種類基板材料細分類紙基材銅箔基板紙基材酚醛樹脂印刷電路板之種類7印刷電路板之種類7PCB多層板結(jié)構(gòu)Why?1.6mmThicknessismajor雙面板四層板六層板厚度→?載component?插卡8PCB多層板結(jié)構(gòu)Why?1.6mmThicknCCLPRODUCTIONFLOW9CCLPRODUCTIONFLOW9厚度玻纖布經(jīng)(緯)紗玻纖布緯(經(jīng))紗(環(huán)氧)樹脂

薄基板厚度控制研討一、銅箔基板厚度組成→玻璃纖維布樹脂+厚度決定因素1.玻纖布體積→1.玻纖布密度(DENSITY)2.樹脂體積2.玻纖布穩(wěn)定的重量3.樹脂與玻纖布密實度3.樹脂含量4.WETABILITY10厚玻纖布經(jīng)(緯)紗玻纖布緯(經(jīng))紗(環(huán)氧)樹脂

薄基板厚度二、製程控制........熱板Cushion(PADor牛皮紙)鋼板基板orPCB鋼板Cushion(PADor牛皮紙)熱板PRESSUREHEATFLOWHEATFLOW1.

平坦度—熱板平坦度、平行度護板、鋼板平坦度及厚度分佈CUSHION材的緩衝能力2.樹脂動態(tài)黏度

昇溫速度

PRESSURECUSHION11二、製程控制..熱板鋼板PRESSUREHEATFLOWH熱壓原理12熱壓原理12銅箔基板一般物性要求●耐(難)燃性─UL94V0、V1●耐熱性─288℃×30”↑●板翹、板扭─●銅箔拉力強度─●抗麻斑─●蝕刻特性─VOID、雜質(zhì)●板厚─●尺寸安定性─●彎曲強度─●Tg─●吸水率─●電氣性質(zhì)─絕緣阻抗、Df、Df13銅箔基板一般物性要求●耐(難)燃性─UL9常用玻纖布種類布種組成YARN/IN絲種類(經(jīng)×緯)絲種類(g×M2)762844×33ECG75×ECG75208150647×46ECE110×ECE110164211660×58ECE225×ECD225107211360×56ECE225×ECE45078211240×40ECE225×ECE22570108060×48ECD450×ECD4504810656×56ECD900×ECD90024E：ElectronicgradeC：ContinuousfiberG.D.E：YarnDiamter9μm、7μm、5μm75=7500Yards/lb14常用玻纖布種類布種組成GlassCompositionGeneralProperties15GlassCompositionGeneralPropeGlassClothpropertiesBaseweight：±2.5%L.O.I：±0.04%Pick/in：±2Tensilestrength：-Treatment：SilaneVisual：-16GlassClothpropertiesBasewei7628P/PGTVSVISCOSITY177628P/P17一般布開纖布18一般布開纖布18EPOXYRESINFUNCTION19EPOXYRESINFUNCTION19TypicalEpoxyResin(Difunction)TetrafunctionEpoxyResinMultifunctionEpoxyResin20TypicalEpoxyResin(DifunctioHARDER(DICYADIAMIDE)TWO-DimensionalDifunctionalEpoxyTetraMulti-functionalEpoxy21HARDER(DICYADIAMIDE)TWO-DimenSilane與玻纖表面反應(yīng)機構(gòu)22Silane與玻纖表面反應(yīng)機構(gòu)22銅箔生產(chǎn)流程圖製造流程：溶解→生箔製造→銅箔處理→裁檢→包裝23銅箔生產(chǎn)流程圖製造流程：溶解→生箔製造→銅箔處理→COPPERFOIL壓延銅箔電解銅箔電解銅箔剝面圖24COPPERFOIL壓延銅箔電解銅箔剝面圖24銅箔常用規(guī)格25銅箔常用規(guī)格25銅箔SEM圖26銅箔SEM圖26CopperFoilpropertiesBaseweight：±8%Tensilestrength：-Elongation：-Peelstrength：-Solderability：-Roughness：-Thermalresitance：-Chemicalresistance：-Oxidationresistance：-27CopperFoilpropertiesBasewei28282929ELECTRICALPRODUCTTREND30ELECTRICALPRODUCTTREND30ICPACKAGETECHNICALTREND31ICPACKAGETECHNICALTREND31WORLDPRINTEDCIRCUITFORECAST32WORLDPRINTEDCIRCUITFORECAST印刷電路板市場應(yīng)用及物性要求33印刷電路板市場應(yīng)用及物性要求33銅箔基板技術(shù)發(fā)展34銅箔基板技術(shù)發(fā)展34ItemsMax.TechnicalPerformanceMassproductionLinewidth/PitchInnerlayerFor1oz3mil/3mil5~6mil/5~6milFor0.5oz2mil/2mil4~5mil/4~5milOuterlayerPositivemethod(%)4mil/4mil5mil/5milNegativemethod(%)4mil/4mil6mil/6milMinholediameterbeforeplatingLaserdrilling4mil5~9milMechanicaldrilling9.8mil13~16milAspectRatio6:14:1SMDpadwidth/pitch8~10mil/8~10mil11~20mil/11~20milLayersofMLBOnesteplamination14Layer6~8LayerStepbysteplamination16~18Layer6~8LayerMin.thicknessofinnercore2mil4milPanelsize20“×24”20“×24”RegistrationforsoldermaskRegistrationforlayertolayer＜2mil＜3mil＜3~4mil＜3~4milPCBPROCESSCAPIBILITY35ItemsMax.TechnicalPerformancPCT(120℃,2atm)WaterAbsorption36PCT(120℃,2atm)WaterAbsorptioPeelstrengthinlongtermthermalaging(177℃)ThermalPerformance37PeelstrengthinlongtermtheDifferenceinZ-axisC.T.E(×10-6)BetweenHalogen-FreeFR-4andStandardFR-4ThermalPerformance

38DifferenceinZ-axisC.T.E(×1Expansion,PPM/℃FR-4NPGX-CTEY-CTE15~1815~1811~1411~14Z-CTE,BeforeTgZ-CTE,AfterTg6730130175ThermalExpansionPropertiesThermalPerformance39Expansion,PPM/℃FR-4NPGX-CTE15PeelStrengthinLong-TermAging(177℃)40PeelStrengthinLong-TermAgiRelativeSignalPropagationSpeedofVariousMaterialsV=c/(Dk)1/2(cm/ns)41RelativeSignalPropagationSp

高頻基板之市場應(yīng)用範(fàn)圍42高頻基板之市場應(yīng)用範(fàn)圍42A:CrosssectionofIVHB:SEMofMicroviaC:CrosssectionofIVH&THCrossSection43CrossSection43Holetohole

HoletopatternLinetolineLayertolayerCAF=ConductiveAnodicFilamentWhat’sCAF44HoletoholeHolet1.CuCu2++2e-(Copperdissolvedatanode)H2OH++OH-2H++2e-

H2

2.Cu2++2OH-Cu(OH)2(coppermovefromanodetocathode)

Cu(OH)2CuO+H2O3.Cu2++2e-Cu(Copperdepositedatcathode)

CuO+H2OCu(OH)2Cu2++2OH-

CAFMechanism451.CuCu2++2e-HoletoHoleFailureCAFCrosssection

46HoletoHoleFailureCAFEDSAnalysisCopperwasdetectedontheglassfibers-resininterface47CAFEDSAnalysisCopperwasdetCAFTest

Design48CAFTestDesign48BeforeimprovementAfterimprovement49BeforeimprovementAfterimprovSYSTEMPRODUCTSOFNANYACCL50SYSTEMPRODUCTSOFNANYACCL5NanYaCCLQUALITYCONTROL

STABLECONSISTENT51NanYaCCLQUALITYCONTROL51INTRODUCTIONOF

COPPERCLADLAMINATENANYAPLASTICSCORPORATION銅箔基板技術(shù)處江澤修52INTRODUCTIONOF

COPPERCLADL1、銅箔基板生產(chǎn)技術(shù)2、銅箔基板原料及品質(zhì)管理3、銅箔基板技術(shù)發(fā)展Content(內(nèi)容)531、銅箔基板生產(chǎn)技術(shù)Content(內(nèi)容)2

全球印刷電路市場應(yīng)用領(lǐng)域(表一)54全球印刷電路市場應(yīng)用領(lǐng)域(表一)3

全球印刷電路市場應(yīng)用領(lǐng)域(表二)55全球印刷電路市場應(yīng)用領(lǐng)域(表二)4何謂銅箔基板?CCL?Cu--------良好導(dǎo)體Core------絕緣體Cu--------良好導(dǎo)體

物性要求56何謂銅箔基板?CCL?Cu--------良好導(dǎo)體電路板基板材料種類基板材料細分類紙基材銅箔基板紙基材酚醛樹脂銅箔基板(非耐燃板、XPC)紙基材酚醛樹脂銅箔基板(耐燃板、FR-1)紙基材聚酯類銅箔基板紙基材環(huán)氧樹脂銅箔基板複合基板Composite銅箔基板(CEM-1)Composite銅箔基板(CEM-3)玻纖布銅箔基板玻纖布含浸耐燃氧樹脂銅箔基板(FR-4)耐熱性玻纖環(huán)氧樹脂銅箔基板(FR-5)玻纖布含浸Polyimide樹脂銅箔基板玻纖布含浸Teflon(PTFE)樹脂銅箔基板軟/硬板PolyesterBase銅箔基板(軟板)PolyimideBase銅箔基板(軟板)Polyester或Polyimide銅箔基板(軟硬板)陶瓷基板氧化鋁基板、氮化鋁基板、碳化矽鋁基板低溫?zé)Y(jié)基板金屬基板金屬Base基板、Metal-Core基板熱塑性基板耐熱性熱可塑性樹脂銅箔基板PTEE類基板Aramid聚亞醯胺銅箔基板57電路板基板材料種類基板材料細分類紙基材銅箔基板紙基材酚醛樹脂印刷電路板之種類58印刷電路板之種類7PCB多層板結(jié)構(gòu)Why?1.6mmThicknessismajor雙面板四層板六層板厚度→?載component?插卡59PCB多層板結(jié)構(gòu)Why?1.6mmThicknCCLPRODUCTIONFLOW60CCLPRODUCTIONFLOW9厚度玻纖布經(jīng)(緯)紗玻纖布緯(經(jīng))紗(環(huán)氧)樹脂

薄基板厚度控制研討一、銅箔基板厚度組成→玻璃纖維布樹脂+厚度決定因素1.玻纖布體積→1.玻纖布密度(DENSITY)2.樹脂體積2.玻纖布穩(wěn)定的重量3.樹脂與玻纖布密實度3.樹脂含量4.WETABILITY61厚玻纖布經(jīng)(緯)紗玻纖布緯(經(jīng))紗(環(huán)氧)樹脂

薄基板厚度二、製程控制........熱板Cushion(PADor牛皮紙)鋼板基板orPCB鋼板Cushion(PADor牛皮紙)熱板PRESSUREHEATFLOWHEATFLOW1.

平坦度—熱板平坦度、平行度護板、鋼板平坦度及厚度分佈CUSHION材的緩衝能力2.樹脂動態(tài)黏度

昇溫速度

PRESSURECUSHION62二、製程控制..熱板鋼板PRESSUREHEATFLOWH熱壓原理63熱壓原理12銅箔基板一般物性要求●耐(難)燃性─UL94V0、V1●耐熱性─288℃×30”↑●板翹、板扭─●銅箔拉力強度─●抗麻斑─●蝕刻特性─VOID、雜質(zhì)●板厚─●尺寸安定性─●彎曲強度─●Tg─●吸水率─●電氣性質(zhì)─絕緣阻抗、Df、Df64銅箔基板一般物性要求●耐(難)燃性─UL9常用玻纖布種類布種組成YARN/IN絲種類(經(jīng)×緯)絲種類(g×M2)762844×33ECG75×ECG75208150647×46ECE110×ECE110164211660×58ECE225×ECD225107211360×56ECE225×ECE45078211240×40ECE225×ECE22570108060×48ECD450×ECD4504810656×56ECD900×ECD90024E：ElectronicgradeC：ContinuousfiberG.D.E：YarnDiamter9μm、7μm、5μm75=7500Yards/lb65常用玻纖布種類布種組成GlassCompositionGeneralProperties66GlassCompositionGeneralPropeGlassClothpropertiesBaseweight：±2.5%L.O.I：±0.04%Pick/in：±2Tensilestrength：-Treatment：SilaneVisual：-67GlassClothpropertiesBasewei7628P/PGTVSVISCOSITY687628P/P17一般布開纖布69一般布開纖布18EPOXYRESINFUNCTION70EPOXYRESINFUNCTION19TypicalEpoxyResin(Difunction)TetrafunctionEpoxyResinMultifunctionEpoxyResin71TypicalEpoxyResin(DifunctioHARDER(DICYADIAMIDE)TWO-DimensionalDifunctionalEpoxyTetraMulti-functionalEpoxy72HARDER(DICYADIAMIDE)TWO-DimenSilane與玻纖表面反應(yīng)機構(gòu)73Silane與玻纖表面反應(yīng)機構(gòu)22銅箔生產(chǎn)流程圖製造流程：溶解→生箔製造→銅箔處理→裁檢→包裝74銅箔生產(chǎn)流程圖製造流程：溶解→生箔製造→銅箔處理→COPPERFOIL壓延銅箔電解銅箔電解銅箔剝面圖75COPPERFOIL壓延銅箔電解銅箔剝面圖24銅箔常用規(guī)格76銅箔常用規(guī)格25銅箔SEM圖77銅箔SEM圖26CopperFoilpropertiesBaseweight：±8%Tensilestrength：-Elongation：-Peelstrength：-Solderability：-Roughness：-Thermalresitance：-Chemicalresistance：-Oxidationresistance：-78CopperFoilpropertiesBasewei79288029ELECTRICALPRODUCTTREND81ELECTRICALPRODUCTTREND30ICPACKAGETECHNICALTREND82ICPACKAGETECHNICALTREND31WORLDPRINTEDCIRCUITFORECAST83WORLDPRINTEDCIRCUITFORECAST印刷電路板市場應(yīng)用及物性要求84印刷電路板市場應(yīng)用及物性要求33銅箔基板技術(shù)發(fā)展85銅箔基板技術(shù)發(fā)展34ItemsMax.TechnicalPerformanceMassproductionLinewidth/PitchInnerlayerFor1oz3mil/3mil5~6mil/5~6milFor0.5oz2mil/2mil4~5mil/4~5milOuterlayerPositivemethod(%)4mil/4mil5mil/5milNegativemethod(%)4mil/4mil6mil/6milMinholediameterbeforeplatingLaserdrilling4mil5~9milMechanicaldrilling9.8mil13~16milAspectRatio6:14:1SMDpadwidth/pitch8~10mil/8~10mil11~20mil/11~20milLayersofMLBOnesteplamination14Layer6~8LayerStepbysteplamination16~18Layer6~8LayerMin.thicknessofinnercore2mil4milPanelsize20“×24”20“×24”RegistrationforsoldermaskRegistrationforlayertolayer＜2mil＜3mil＜3~4mil＜3~4milPCBPROCESSCAPIBILITY86ItemsMax.TechnicalPerformancPCT(120℃,2atm)WaterAbsorption87PCT(120℃,2atm)WaterAbsorptioPeelstrengthinlongtermthermalaging(177℃)ThermalPerformance88PeelstrengthinlongtermtheDifferenceinZ-axisC.T.E(×10-6)BetweenHalogen-FreeFR-4andStandardFR-4ThermalPerformance

89DifferenceinZ-axisC.T.E(×1Expansion,PPM/℃FR-4NPGX-CTEY-CTE15~1815~1811~1411~14Z-CTE,BeforeTgZ-CTE,AfterTg6730130175ThermalExpansionPropertiesThermalPerformance90Expansion,PPM/℃FR-4NPGX-CTE15PeelStrengthinLong-TermAging(177℃)91PeelStrengthinLong-TermAgiRelativeSignalPropagationSpeedofVariousMaterialsV=c/(Dk)1/2(cm/ns)92RelativeSignalPropagationSp

高頻基板之市場應(yīng)用範(fàn)圍93高頻基板之市場應(yīng)用範(fàn)圍42A:CrosssectionofIVHB:SEMofMicrovi