PCB工程部專業(yè)英語(yǔ)詞匯

PCB工程吾傳業(yè)英文詞Iz詞匯.板料：material.最低限度：minimLlm或者min。.最大限度：maximum或者max..基準(zhǔn)點(diǎn)（零點(diǎn)） datumpoint5,周期DateCOde6.V-cut余厚 V—cutremainthickness7,搶電銅皮（假銅）dummycopper.實(shí)物板actualboard,外形及尺寸錯(cuò)誤dimensionerror.異常情形errordatafile.焊錫面與零件面對(duì)位偏差misregistration.孔塞plughole.要求requirement.缺少miss.偏公差uneventolerance.補(bǔ)償compensation.表面處理surfacetreatment.無鉛噴錫LeadfreeHAL.金手指斜邊bevelofG/F.制程能力processcapability.建議，暗示suggest.確保ensure.滿足,達(dá)到meet.為了inorderto.交貨期deliverydate.綠油橋soldermaskbridge或者soldermaskdam.根據(jù)accordingto.單邊3milperside3mil.直徑diameter30,半徑radius.小于3millessthan3mil.高于3milmorethan3mil.壓合結(jié)構(gòu)stackingstructure或者stack_up.附件Zttachedfile.樣品：sample.文檔：Document.答復(fù)：answer；reply.規(guī)格:spee.與???同樣的：thesameas.前版本：previousversion(oldversion).生產(chǎn)：production.確認(rèn)：confirm.再次確認(rèn)：confirmagain.工程問題Engineeringquery(EQ).盡快：assoonaspossible.生產(chǎn)文件：productionGerber.聯(lián)系某人：contactsomebody.提交樣板：submitsample.交貨期:deliVerydate.電測(cè)成本：ET(electricaltest)cost.通斷測(cè)試：Openandshorttesting.參考：referto.IPC標(biāo)準(zhǔn)：IPCStandard.IPC二級(jí)：IPCCIaSS2.可接受的：acceptable.允許:permit.制造：manufacture或者fabricate.修改：revision.公差:toleranee.忽略：ignore.工具孔：toolinghole.安裝孔：mountinghole.元件孔componentholeι.槽孔：slothole.郵票孑L：SnaPoffhole或者stamphole.導(dǎo)通孔：viahole.盲孔：blindviahole.埋孔：buriedviahole.金屬化孔：PTH(platedthroughhole).非金屬化孔：NPTH(noplatedthroughhole).孔位：holelocation.避免：avoid.原設(shè)計(jì)：OriginaldeSign.修改:moeHfy.按原設(shè)計(jì)寸oil。Wuporiginaldesign.附邊：wastetab,wastearea?1?^breakawaytab77,銅條：copperstrip.拼板：paneldrawing.板厚：boardthickness.冊(cè)IJ除:remove(delete).肖U銅：shavethecopper.露銅：copperexposure或者exp。SedCoPPer.光標(biāo)點(diǎn)：fiducialmark.不同:becHfferentfrOm(differfrom).內(nèi)弧:insideradius.焊環(huán)：annularring.單板尺寸：singlesize.拼板尺寸：panelsize.銃，鑼：routing.銃刀:router或者Routingbit.楔形掏槽V-cut或者Vscoring.啞光：matt.光亮的:glosSy.錫珠：solderball(solderplugs).阻焊：soldermask(solderresist).阻焊開窗：soldermaskopening.單面開窗:singlesidemaskopening.補(bǔ)油：touchupsoldermask.補(bǔ)線：trackweldsιoo.毛刺：burrsιoι,去毛刺：deburr.鍍層厚度：platingthickness.清潔度：cleanliness.離子污染：ioniccontamination.阻燃性等級(jí)：flammabilityretardantrating.黑化：blackoxidation.棕化：brownoxidation.紅化：redoxidation.可焊性不良：poorsolderabilityno,焊料：solderin.包裝：packaging112,角標(biāo)：cornermark.特性阻抗：characteristicimpedance.正像：positive.負(fù)片:negative.鏡像：mirror.線寬：IineWidth或者tracewidth.線距：linespacing或者tracespacing.做樣：buildsample.按照：accordingto.成品：finished.做變更：makethechange.相類似：similarto.規(guī)格:spee用CatiOn.下移：shiftdown.垂直地：VertiCaily.水平的：horizontally.增大：increase.縮小：decrease130,表面處理：SurfaceFinishing.波峰焊：wavesolder.鉆孔數(shù)據(jù)：drillingdata.標(biāo)記：Logo.Ul標(biāo)記:ULlOgo,或者UlMarking.蝕刻標(biāo)記：etchedmarking.周期：datecode.翹曲:bowandtwist138,夕卜層：outerlayer或者externallayer.內(nèi)層：innerlayer或者internallayer140,頂層toplayer.底層:bottomlayer142,元件面：componentside.焊接面：solderside144,阻焊層:soldermaskIayer145,字符層：legendlayer(silkscreenlayeroroverlayer).蘭膠層：peelableSMlayer.貝占片層：pastemasklayer.碳油層：carbonlayer149,夕卜形層:outlinelayer(profilelayer).白油：whiteink.綠油：greenink.噴錫：hotairleveling(HAL).電金，水金：flashgold154,插頭鍍金：platedgoldedge—boardcontacts.金手指：Gold—finger156,防氧化：Entek(OSP)157,沉金：ImmerSiOngold(chem.Gold).沉錫ImmersionTin(Chem.Tin).沉銀ImmersionSilver(chemosilver).單面板：singlesidedboard.雙面板：doublesidedboard.多層板：multilayerboard.剛性板：rigidboard.撓性板：fieXibleboard165,剛撓板：flex-rigidboard.銃：CNC(mill,routing).沖：punching.倒角beveling169,斜面：chamfer.倒圓角：fillet.尺寸：dimension.材料：material.介電常數(shù)：Dielectricconstant.菲林:film.成像:lmaging.板鍍PanelPlating.圖鍍：PatternPlating.后清洗：FinalCleaning.疊層stackingstructure(stack—up).污染焊盤：contaminatepad.分孔圖：drillchart或者drillmap.度數(shù)degree.被...覆蓋：becoveredwith.負(fù)公差：minustolerance.標(biāo)靶盤：targetpad.外形公差：routingtolerance.芯板：core.半固化片PrePreg.阻抗線：impedancetrace.評(píng)估estimate.玻纖顯露FiberExposure.底銅basecopper.工作搞workingGerber.原稿Originalartwork195,放寬relax.挖空blanking或者cut-out.一般性阻焊油墨generalresistink.孔位錯(cuò)誤misholelocation.壓合周期presscycle.毛邊serratededges.跳印skipprinting.氣泡blistering.隔離焊盤isolatedpad.淚滴teardrops.箭頭arrows.力口大Enlarge.壓合周期presscycle.毛邊serratededges.跳印,漏印skipprinting.寬度與厚度的比值width—to—thicknessratio2iι.調(diào)整adjust.銅箔基板coppercladedlaminates.線路露銅copperexposure.孔內(nèi)異物dirtyhole.橢圓形ellipticalset.纖維突出fiberprotrusion.填充料filler.互相連通interconnection.改善方案implementation.板料使用率materialusefactor.回路,網(wǎng)絡(luò)network.缺口nick.氧化oxidation.剝離（錄U落）peelingoff.補(bǔ)線不良poortouch-up.品質(zhì)等級(jí)qualityclassification.對(duì)位孔registration.拒收rejectable229,樹脂含量resincontent.排列電阻resistOrnetWOrk231,鑼刀（銃刀）routingbit.孔內(nèi)沾文字S/Lonhole.孔內(nèi)綠漆S/Monhole234,線路沾錫solderontrace.金手指沾錫solderonG/F.廢框scrap.封孔處理sealing.間是巨不足spacingnon-enough239,靶位孑Ltargethole.測(cè)試線路testcircuit.熱應(yīng)力試驗(yàn)thermalstress.厚度分布thicknessdistribution.薄基板，內(nèi)層板thincore.線路缺口及針孔tracknick&pinhole245,裁切線trimline246,真平整trueleveling247,真正位置的孑Ltrueposition.萬(wàn)用型LlniVerSal.氣化室vaporizer.倉(cāng)庫(kù)warehouse.契尖角wedgeangle.線名田 widthreduce.良率 yield.滲銅,滲入，燈芯效應(yīng)WiCking.允收acceptable.試樣點(diǎn)couponlocation.經(jīng)核準(zhǔn)的，被認(rèn)可的approved.超越勝過,超過其他exceed.牛皮紙kraftpaper.孔壁破銅Holevoid.孔位破出HolebreakoutPCB生產(chǎn)-經(jīng)典流程一英文培訓(xùn)教程Ao開料(CutLamination)a-1裁板(SheetsCutting)a—2原物料發(fā)料(Panel)(ShearmaterialtoSize)B.鉆孔(Drilling)b-1內(nèi)鉆(InnerLayerDrilling)b—2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b—4雷射鉆孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鉆孔(Blind&BuriedHoleDrilling)C.干膜制程(PhotoProcess(D∕F))c—1前處理(Pretredtment)c-2壓膜(DryFilmLamination)c—3曝光(EXPOSUre)c-4顯影(DeVelOPing)c-5蝕銅(Etching)c-6去膜(StriPPing)c—7初檢(Touch-up)c—8化學(xué)前處理,化學(xué)研磨(ChemicalMilling)c—9選擇性浸金壓膜(SeleCtiVeGoldDryFilmLamination)c—10顯影(DeVelOPing)c—11去膜(StriPPing)Developing,Etching&Stripping(DES)D0壓合LarninatiOnd—1黑化(BIdCkOXideTredtment)d—2微蝕(MiCrOetChing)d—3鉀釘組合(eyelet)d—4疊板(Ldyup)d—5壓合(LaminatiOn)d—6后處理(POStTredtment)d—7黑氧化(BlackOxideRemoval)d-8銃靶(spotface)d—9去溢膠(resinflushremoval)Eo減銅(COPPerReduction)e-1薄化銅(COPPerRedUCtiOn)F。電鍍(HOriZOntalElectrolyticPlating)f-1水平電鍍(HOriZOntdlElectro—Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)f—3彳氐于1mil(Lessthan1milThickness)f—4高于1mil(Morethan1milThickness)f-5砂帶研磨(BeItSanding)f—6剝錫鉛(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PIUgHole)g-1印刷(InkPrint)g-2預(yù)烤(PreeUre)g—3表面刷磨(SCnJb)g-4后烘烤(POStCUre)H0防焊(綠漆/綠油)：(SOlderMaSk)h—1C面印屈IJ(PrintingTopSide)h—2S面印屈IJ(PrintingBottomSide)h—3靜電噴涂(SPrdyCoating)h-4前處理(Pretredtment)h—5預(yù)烤(Precure)h—6曝光(Exposure)h-7顯影(DeVelOP)h-8后烘烤(POStCUre)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h—11噴砂(Pumice)(WetBlasting)h-12印可剝離防焊(PeeIdbleSolderMask)I.鍍金GOIelplatingi-1金手指鍍銀金(GoldFinger)i-2電鍍軟金(SoftNi/AuPlating)i-3浸銀金(ImmersionNi/Au)(ElectrolessNi/Au)J。噴錫(HotAirSolderLeveling)j—1水平噴錫(HOriZOntalHotAirSolderLeveling)j—2垂直噴錫(VerticalHotAirSolderLeveling)j—3超級(jí)焊錫(SuperSolder)j—4.印焊錫突點(diǎn)(SOIderBump)K.成型(PrOfiIe)(FOnTl)k-1撈型(N∕CRouting)(Milling)k-2模具沖(Punch)k—3板面清洗烘烤(Cledning&Backing)k-4V型槽(V-CUt)(V-Scoring)k-5金手指斜邊(BevelingofG∕F)L.開短路測(cè)試(EleCtriCalTeSting)(Co