【能力素質(zhì)】飛針測(cè)試輸出——Probot手動(dòng)輸出.ppt

1、飛針測(cè)試輸出 -Probot手動(dòng)輸出,天馬行空官方博客： ；QQ:1318241189；QQ群：175569632,輸入Gerber數(shù)據(jù). 數(shù)據(jù)要求： 1、信號(hào)（Signal layer）； 2、鉆孔文件（Drill files）； 3、綠油層（ Solder mask layers）；,天馬行空官方博客： ；QQ:1318241189；QQ群：175569632,將鉆孔層由“a01”改為“r01”,定義為鉆孔，注意需要改變所有的孔層，包括盲、埋孔。（Change the Drill layer from “a01” to “r01”, it means it is DRILL. Change

2、 all drill layers, includes the blind drill or buried drill.）,檢查孔層數(shù)據(jù)是否正確，如果不正確或沒有孔徑大小不正確，請(qǐng)重新讀取孔層數(shù)據(jù)或手動(dòng)修改孔層數(shù)據(jù)。,將頂層綠油層改為負(fù)片，即有“+”改為“-”；（Change the solder mask layer from “+” to “-”，Change the top solder mask.）,將底層綠油層改為負(fù)片，即有“+”改為“-”； （Change the solder mask layer from “+” to “-”，Change the bottom solder

3、mask.）,進(jìn)入到物理層設(shè)置，（Go to “Setup Physical Layer”.）；,孔層僅僅需要是電鍍孔（PTH），Only put the drill layer to the PTH；在設(shè)置物理層時(shí)，如果是埋、盲孔，必須設(shè)置將其與信號(hào)層一起設(shè)置與相應(yīng)的物理層之中。（Since layer 2 is Blind drill, which connecting layer 3 disable traces.,Click in Net Point Type click box.,While pressing Ctrl key, select T and I,to highlight

4、 tps and isolated points. Exit both screens with OK.,Hit Q and Query Table will denote all testpoints by a T in the text box.,Next Step: Create Output,Note: In Net Point Type screen, C=covered point; E=endpoint; I=isolated point; L=loop point; M=midpoint; T=testpoint,Check Testpoint List,Modify Test

5、 Points?,No,Next Step: Create tp files,Yes,Create Testpoint Files,Start,Edit-enable top circuit layer (p. 45),Use Selective Mark to highlight pads of Net Point Type T and I,Edit/copy highlighted points to buffer; edit/paste to unused layer,Repeat for bottom layer,Edit newly-created tp files as neede

6、d,Drill holes 125 mls?,Save Changes,Next Step: Create Output,Yes,No,Use Selective Mark to highlight round pads with x .125,Edit/offset highlighted points in y direction,Start,Select “Write Direct” from File menu,Select “Probot” from Write Direct screen,Set “Fixture Data” to “Isolated points and tps”

7、,Select path and name for Probot Output,Specify plated drill layer and blind vias,Generally 3 alignment points chosen, single-sided,Specify top and bottom circuit layers,OK,Create Output (p. 233),Note: See “Write Direct” topic in Online Help for additional info.,Separate test point files created?,No

8、,Yes,Specify top and bottom test point files as top and bottom circuit layers,Set “Fixture Data” to “All”,Useful Hotkeys,Restore All: F7 Save All: F6 Load layers: CTRL + L Unload layers: CTRL + SHIFT + L View Extents: CTRL + SHIFT + = Order Layers: F8 Jump (to a point): J Query: Q Mark: M Unmark: CTRL + SHIFT + M Selective Mark: F9 Mark Connected: CTRL + F9 Copy to buffer: C,Cut to buffer: CTRL + DEL Paste: CTRL + INS Paste to: CTRL + SHIFT + F5 Compare Layers: = Copy Layers: F5 Control Draw: D Convert Sketched Pads: CTRL + K Set up Physical Layers: CTRL + SHIFT + P Set up Layers: CTRL +