封裝考核評(píng)估資料匯編

1、1 、 Purpose目的This document provides templates for recording package qualification data for RFMD product and instructions for complying with Materials Declaration.提供記錄RFMD產(chǎn)品考核認(rèn)證所需信息資料的模板, 及遵從物質(zhì)申明的說(shuō)明2 、 Scope 范圍Apply to RFMD package qualification適用于 RFMD考核認(rèn)證產(chǎn)品3 、 Instruction說(shuō)明3.1 Materials Declaration

2、:The Subcontractor Assembly house is required to submit MaterialsDeclaration forms listing the required banned, banned with acceptable threshold level, reportableor othermaterialsrequiredby RFMD QAL-21-1028forassembliesmanufacturedforRFMD.These arerequiredfor currentand newassembliesandmustbe update

3、d whenever materialchanges occur or whenever a new substrate process development or assembly qualification begins.The supplierwillbe requiredto provideproof ofcompliancywitha chemical analysis.SeeQAL-21-1028 for details on requirements, reporting structure, and reporting format.物質(zhì)申明 :外包封裝廠需要提交物質(zhì)聲明書，

4、列明禁用材料，禁用但可接受門限的材料、需告知的或其他由RFMD QAL-21-1028文件規(guī)定的用于 RFMD封裝制造產(chǎn)品的材料 . 這些規(guī)定適用于現(xiàn)有及未來(lái)新的封裝產(chǎn)品 ,當(dāng)材料變更 ,新基板工藝流程的開(kāi)發(fā)或開(kāi)始封裝考核認(rèn)證時(shí)都要提交該聲明書. 供應(yīng)商還需要提供化學(xué)分析作為依據(jù) . 參考 QAL-21-1028文件中的詳細(xì)要求 , 報(bào)告的結(jié)構(gòu)和格式。3.2 Add lines, insert tables, embed objects at each applicable process step to capture pertinentprocess data.各工序可根據(jù)需收集的相關(guān)信息

5、資料增加表格的行數(shù), 插入新的表格和對(duì)象3.3 Compresspictures onceallapplicableprocessinformationhasbeen inserted.Goto viewtoolbars, select pictures. Go to pictures toolbar and compress pictures, OK.完成相應(yīng)的所有工序的信息資料后壓縮圖片 . 在視圖工具欄中選擇圖片后壓縮或在圖片工具欄欄中壓縮圖片4 、 Reference 參考CSR-CM012（PKG-21-1013）Subcontractor Assembly Specificatio

6、n for ModulesCSR-CM029（ QAL-21-1028）Banned Substances List and RFMD Green Definition5 、 Qualification Data考核評(píng)估資料擬制：審核：批準(zhǔn)：Qualification DataPart NumberQual Lot NumberTrace CodePackage TypePackage SizeThicknessWafer SizeThickness(list all die)Lead CountPO NumberMSL Target LevelAssembly LocationBonding

7、 Diagram Part NumberBOM Part NumberBranding Diagram Part NumberPrepared ByExecutive SummaryYield SummaryLot #1Lot #2Lot #3Total YieldSMT YieldLot #1Lot #2Lot #3Total YieldAssy YieldLot #1Lot #2Lot #3Total YieldFinal YieldData Summary All Lots combinedProcessTestCriteriSSMaxMinAvgStdCpka±SMTSMTS

8、MTDie AttachDie AttachPaste Thickness Component Shear force per each SMD size) Flux Thickness Placement X Placement Y(gramProcessTestCriteriSSMaxMinAvgStdCpka±Die AttachShear (each die)Die AttachRotationFlipChipShear (each die size)AttachFlipChipPlacementAttachFlipChipStand offAttachWire BondPu

9、lls Die to SubWire BondPulls Die to DieWire BondPulls Sub to SubWire BondPulls RSSBWire BondLoop HeightWire BondSpanWire BondPlacement XWire BondPlacement YWire BondBall Shear >71um BPOWire BondBall Shear >60 <=71um BPOWire BondBall Shear >52 <=60um BPOWire BondSSB Shear >71um BPOW

10、ire BondSSBShear>60<=71umBPOWire BondSSBShear>52<=60umProcessTestCriteriSSMaxMinAvgStdCpka±BPOWire BondBall shear on substratePlatingThicknessPlatingCompositionBall attachBall ShearBall attachBall HeightSolder BumpBump DiameterSolder BumpBump CompositionSolder BumpBump HeightSolder

11、BumpBump ShearSolder BumpBump Co-planarity on waferSolder BumpBump Co-planarity on DieSingulatioSize XnSingulatioSize YnSingulatioSize ZnSingulatioRegistration XnProcessTestCriteriSSMaxMinAvgStdCpka±SingulatioRegistration YnSingulatioCoplanaritynTrim/ForTip to TipmTrim/ForStandoffmTrim/ForCopla

12、naritymConclusions and RecommendationsBOMQual Lot #1 (repeat for qual lot 2 and 3)Build DateTrace codeWafer Lot NumbersSolder Bump Manf(if applicable)Part NumberLot NumberAlloySubstrate or Lead frame ManfPart NumberLot NumberMaterial Set or AlloyFlip Chip Flux ManfPart NumberLot NumberSolder Paste M

13、anfPart NumberLot NumberAlloyDie Attach ManfPart NumberLot NumberWire ManfPart NumberLot NumberLid ManfPart NumberLot NumberShield Epoxy ManfPart NumberLot NumberShield ManfPart NumberLot NumberAlloyMold Comp ManfPart NumberLot NumberTablet SizeSolder Ball ManfPart NumberLot NumberAlloyManufactureDi

14、eDescriptionPadOpeningPadPitchDieSizeDieThicknessD1D2D3D4D5ManufactureThicknessFlipChipDieDescriptionPadOpeningBumpPitchDieSizeDieD1D2D3D4D5Passive Components (Use if applicable)ManufactureDescriptionValueTypeCapacitorResistorInductorBackgrind (Use if Applicable)Equipment Make and Model numberBlade

15、TypeFeed RateSpindle SpeedWater TypeWater ResistivityWafer Saw (Use if Applicable)Equipment Make and Model numberBlade TypeFeed RateSpindle SpeedWater TypeWater ResistivitySMT (Use if Applicable)SMT Line Number or individual equipment numbersProvide Reflow Profile Graph of Qual lot (repeat for quali

16、fication lot 2 and 3).Profile to beobtained pre lot for all qual lots.Provide data:Time above LiquidousPeak TemperatureTime to 150°CTimeabove 150°CReflow profile nameNitrogen oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMFlux Printing (for Flip Chip use if applicable)Attach samp

17、le picture for each die.Flux Stencil Parameters:Stencil ThicknessStencil MaterialApertureOpeningDesign (Specialdesignand % of solder mask or metal opening)Flux Print Process Parameters:Bladetype(plastic&hardness/metal)andAngleBlade ForceBlade SpeedSeparation speed & distanceSolder Stencil Pa

18、rameters:Stencil ThicknessStencil MaterialApertureOpeningDesign (Specialdesignand % of solder mask or metal opening)ForFlipChip RecessZ depth& openingX,Y distance(s)Paste Print Process Parameters:Bladetype(plastic&hardness/metal)andAngleBlade ForceBlade SpeedSeparation speed & distancePr

19、ovide sample picture of solder paste print.Flux Thickness (if applicable), (repeat for lots 2 and 3)12345678910Min MaxAvgST1Paste Thickness, (repeat for lots 2 and 3)12345678910MinMaxAvgST10402 Component Shear gram force, (repeat for lots 2 and 3)12345InductorsCapacitorsResistorsMinMaxAvg0201 Compon

20、ent Shear gram force, (repeat for lots 2 and 3)12345InductorsCapacitorsResistorsMinMaxAvg01005 Component Shear gram force, (repeat for lots 2 and 3)12345InductorsCapacitorsResistorsMinMaxAvgAddrowsorcolumnsforanyothersize/shapesurfacemountcomponentnotlisted.Perform same quantity of shears and listed

21、 data gathering requirements.Flange Packages (if applicable)Pre Flange Flatness Measurement Data per ten flangesMeasure five locations per flange, center and four corners.Flange Flatness, (repeat for lot 2 and 3)12345MinMaxAvgF1F2F3F4F5F6F7F8F9F10Die AttachEquipment Make and Model numberAttach Metho

22、dParametersDie Placement, (repeat for lot 2 and 3)12345678910MinMax AvgD1xD1yD2xD2yD3xD3yD4xD4yD5xD5yDie Shear, (repeat for lot 2 and 3)12345678910MinMaxAvgD1D2D3D4D5Die Rotation in Degrees, (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Flip Chip Attach (if applicable)Equipment Make and Mod

23、el numberProvide Reflow Profile Graph of Qual lot (repeat for qualification lot 2 and 3) if different fromSMT reflow profile.Profile to be obtained pre lot for all qual lots.Provide data:Time above liquidousTime to 150 °CTime above 150°CReflow profile nameNitrogen Oven O2 ppmZone SettingsZ

24、1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMAttach MethodParametersNeedle (per die) :Provide image of push up pin configuration.Provide sample picture of back side of die.Provide sample picture of bumps after die placement (per die).Remove die from board.Manual die peeling after reflow.Five samples and attach a

25、 sample picture of die and board.Die Height, (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Die Shear, (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Bump Shear, (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Bump wetting to substrate pad, (repeat for lot 2 and 3)Attach X-ray

26、 of 5 samplesDie Attach CureEquipment Make and Model numberPeak TemperatureRamp Time upDwell TimeRamp Time DownPlasma or UV (Use if Applicable)Make and Model numberPowerTimeGas MixtureWire BondMake and Model numberCapillary Manf Part NumberStd Bond ParametersDie 1Die 2Die 31st bond2 nd bond1st bond2

27、 nd bond1 st bond2 nd bondVelocityTimePowerForcePre Heat TempBond Site TempRSSB Bond ParametersDie 1Die 2Die 3Bump1st bond2 nd bondBump1 st bond2nd bondBump1 st bond2 nd bondVelocityTimePowerForcePreHeatTempBondSiteTempSubstrate to Substrate Bond Parameters1st bond2 nd bondVelocityTimePowerForcePre

28、Heat TempBond Site TempAdd Bonding Diagram (complete layout drawing)Wire Pulls, Die to Substrate, non RSSB (repeat for lot 2 and 3)12345678910MinMaxAvgD1D2D3D4D5Wire Pulls, Die to Substrate, RSSB (repeat for lot2 and 3)12345678910MinMax AvgD1D2D3D4D5Wire Pulls, Die to Die (repeat for lot 2 and 3)123

29、45678910MinMax AvgD1D2D3D4D5Wire Pulls, Substrate to Substrate (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Loop Heights, (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Wire Span, (repeat for lot 2 and 3)12345678910MinMax AvgD1D2D3D4D5Wire Placement, (repeat for lot 2 and 3)1234567

30、8910MinMaxAvgD1xD1yD2xD2yD3xD3yD4xD4yD5xD5yBall Shear, Measure >71um Pad Opening, (repeat for lot 2 and 3)12345678910Min Max AvgD1D2D3D4D5Ball Shear, Measure 10 balls >60um <=71um Pad Opening, Minimum 2 Strips (repeat for lot2 and 3)12345678910MinMaxAvgD1D2D3D4D5Ball Shear, Measure 10 balls

31、 >52um <=60um Pad Opening, Minimum 2 Strips (repeat for lot2 and 3)12345678910MinMaxAvgD1D2D3D4D5Stitch Stud Bump (SSB) Shear, Measure >71um Pad Opening, (repeat for lot 2 and 3)12345678910MinMaxAvgD1D2D3D4D5Stitch Stud Bump (SSB) Shear, Measure 10 balls >60um <=71um Pad Opening, Mini

32、mum 2Strips (repeat for lot 2 and 3)12345678910MinMaxAvgD1D2D3D4D5Stitch Stud Bump (SSB) Shear, Measure 10 balls >52um <=60um Pad Opening, Minimum 2Strips (repeat for lot 2 and 3)12345678910MinMaxAvgD1D2D3D4D5Ball Shear on substrate, Measure 10 balls >52um <=60um Pad Opening, Minimum 2 S

33、trips(repeat for lot 2 and 3)12345678910MinMaxAvgBSSWedge Bond Shear (if applicable), Measure 10 balls >65um <=80um Pad Opening, Minimum10 units (repeat for lot 2 and 3)12345678910MinMaxAvgD1D2D3D4D5Plasma or UV (Use if Applicable)Make and Model numberPowerTimeGas MixtureLid Attach B-stage or

34、Solder (if applicable)Make and Model numberCure TimeCure Temperature & ToleranceTransfer SpeedStage 1 Start Positionmm/sStage 1 Start Positionmm/sMoldCureTimeFlange Packages (if applicable)Post Flange Flatness Measurement Data per ten flangesMeasure five locations per flange, center and four cor

35、ners.Flange Flatness, (repeat for lot 2 and 3)12345Min Max AvgF1F2F3F4F5F6F7F8F9F10MoldMake and Model of machine:Mold Compound Transfer Program:Position of plunger at startmm:(mm Pellet Height, PS (PS = PositionStart):Speed of plungermm/sec:(mm/sec from start to next position, PS to P1):Position of

36、plunger for next positionmm:(mm P1):Speed of plungermm/sec:(mm/sec from P1 to P2):mm:Position of plunger for next position(mm P2):Speed of plunger(mm/sec from P2 to P3):mm/sec:Position of plunger for next position(mm P3):mm:Speed of plunger(mm/sec from P3 to P4):mm/sec:Position of plunger at final end position(PE = Position End):mm:*Cull Height setting& actualmm (actual is measuredmm:mm:withmicrometer):mm:Positive cull value (distance above bottom mold die):PSI Setting:PSI Actual:Transfer Pressure setting & actual PSI:Sec:Transfer Time(time from PS to PE):oC Settin