疊層片式通用磁珠spec mggb

1、仕樣書(shū)NO.: QW-QA-342 REV1.2日期DATE:納入仕樣書(shū)SPECIFICATION產(chǎn) 品 名 稱(chēng) PRODUCT NAME:疊層片式通用磁珠Multilayer Chip Ferrite Beads貴司 料 號(hào) YOUR PART NO.:敝司 料 號(hào) OUR PART NO.:MGGBSer ies本納入仕樣書(shū)共 20 頁(yè)MANUFACTURING NAMESHENZHEN MICROGATE TECHNOLOGY CO.，.：86-755-28085000FAX：86-755-28085605CFMD.批準(zhǔn)CHKD.審核DSGD.擔(dān)當(dāng)接受 RECEPTIONTHE SPEC

2、IFICATION HAS BEEN ACCEPTED.該納入仕樣書(shū)已被我司接受日期:DATE：公司：COMPANY：批準(zhǔn)CFMD審核CHKD接收RCVD目錄 CATALOG適用范圍 Scope12345678910111213141516333456791112141617171717Product Identification品名形狀、尺寸和材料 Appearance, Dimens and Material測(cè)試條件 Testing Conditions標(biāo)稱(chēng)值 Rating電氣特性 Electrical Performance信賴(lài)性試驗(yàn) Reliable Performancemended

3、 Soldering Conditions焊接條件條件 Cleaning Conditions包裝 Packaging裝箱及標(biāo)志 Packings and marking保存 Storage澳素系難燃劑的使用情況 Usage of Nonflammable Material ODS 的使用情況 Usage of ODS阻燃級(jí)別 Flammability Class注意事項(xiàng) NoteAPPENDIX A納入仕樣書(shū)改定履歷18Modify History of Specification地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811021適用范圍 Scope本納入仕

4、樣書(shū)適用于 MGGB 系列疊層片式通用磁珠。This specification apps to the MGGB series of multilayer chip ferrite bead.2品名Product IdentificationMGGB1608M101HT -LF 產(chǎn)品系列Product Symbol MGGB:普通磁珠 產(chǎn)品尺寸Dimens(見(jiàn) 3) 基本材料代碼 Material Code（鐵氧體材料 M.E.D 等） 阻抗值 Impedance Value100:10，101：100，102：1000 特性代碼Characteristic 包裝方式（B：散裝；T：盤(pán)裝）P

5、ackaging Style (B: Bulk; T: T 環(huán)保標(biāo)識(shí) Lead Free& Reel)3形狀、尺寸和材料 Appearance, Dimens and Material地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：5181103Type型號(hào)Dimens (mm) inchL長(zhǎng)W寬T高a1, a2100504021.000.150.040.0060.500.150.020.0060.500.150.020.0060.250.100.010.004160806031.600.150.0630.0060.800.150.0310.0060.800.150.031

6、0.0060.300.200.0120.008201208052.000.200.0790.0081.250.200.0490.0080.850.200.0330.0080.500.300.020.012321612063.200.200.1260.0081.600.200.0630.0080.900.200.0350.0080.500.300.020.0124測(cè)試條件 Testing Conditions除非另有規(guī)定，否則在以下條件下測(cè)試 溫度 Temperature濕度 Humidity: Ordinary Temperature: Ordinary Humidity( 5 to 35)(

7、25 to 85% RH)當(dāng)對(duì)測(cè)量結(jié)果有疑問(wèn)時(shí)溫度 Temperature濕度 Humidity大氣壓強(qiáng) Atmospheric Pre: 202: 60 to 75% RHre: 86 to 106 kPa地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：5181104材料Material供應(yīng)商Comitionr1基本材料Base Material鐵氧體FerriteJapan2內(nèi)導(dǎo)體ernal Conductor銀AgJapan3端電極Terminal Electrode銀AgJapan4端電極Terminal Electrode鎳-錫Ni-SnUSA5標(biāo)稱(chēng)值 Rat i

8、 ng使用溫度范圍操作溫度范圍 Opera t i ng Tempera ture Range :-55to+125保存溫度范圍StorageTempera ture Range : -55 to +125MGGB1005 SeriesMGGB1608 Series5Part No.Impedance ()25%Z Test Frequency (MHz)Rdc ()maxRated Current (mA)maxMGGB1608M050H51000.051000MGGB1608M070H71000.051000MGGB1608M110H111000.051000MGGB1608M190H19

9、1000.051000MGGB1608M310H311000.05500MGGB1608M600H601000.12300MGGB1608M800H801000.16200MGGB1608M121H1201000.20200MGGB1608M181H1801000.30200MGGB1608M221H2201000.30200MGGB1608M301H3001000.35200MGGB1608M501H5001000.45200MGGB1608M601H6001000.50200MGGB1608M751H7501000.55150MGGB1608M102H10001000.60100Part

10、No.Impedance ()25%Z Test Frequency (MHz)Rdc () maxRated Current (mA)maxMGGB1005M050H51000.05500MGGB1005M070H71000.05500MGGB1005M110H111000.05500MGGB1005M190H191000.05300MGGB1005M310H311000.20300MGGB1005M600H601000.30200MGGB1005M800H801000.30200MGGB1005M121H1201000.40150MGGB1005M181H1801000.50150MGGB

11、1005M301H3001000.65100MGGB1005M501H5001000.80100MGGB1005M601H6001001.00100MGGB2012 Series地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：5181106Part No.Impedance ()25%Z Test Frequency(MHz)Rdc () maxRated Current (mA)maxMGGB2012M070H71000.052200MGGB2012M110H111000.052000MGGB2012M190H191000.052000MGGB2012M260H26100

12、0.051500MGGB2012M310H311000.051500MGGB2012M360H361000.051500MGGB2012M600H601000.051000MGGB2012M700H701000.081000MGGB2012M800H801000.101000MGGB2012M101H1001000.121000MGGB2012M121H1201000.15800MGGB2012M151H1501000.15800MGGB2012M181H1801000.20600MGGB2012M221H2201000.20600MGGB2012M301H3001000.25500MGGB2

13、012M501H5001000.30500MGGB2012M601H6001000.35500MGGB2012M751H7501000.35300MGGB2012M102H10001000.45300MGGB2012M122H1200500.50200MGGB2012M152H1500500.65200MGGB2012M202H2000500.80200MGGB2012M222H2200501.50200MGGB2012M252H2500501.50200MGGB3216 Series地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：5181107Part No.Impeda

14、nce ()25%Z Test Frequency(MHz)Rdc () maxRated Current (mA)maxMGGB3216M190H191000.052000MGGB3216M260H261000.052000MGGB3216M310H311000.052000MGGB3216M360H361000.052000MGGB3216M600H601000.081000MGGB3216M800H801000.081000MGGB3216M101H1001000.101000MGGB3216M121H1201000.10600MGGB3216M151H1501000.15600MGGB

15、3216M181H1801000.15600MGGB3216M301H3001000.20600MGGB3216M391H3901000.20600MGGB3216M501H5001000.30600MGGB3216M601H6001000.30600MGGB3216M751H7501000.30600MGGB3216M102H1000500.40500MGGB3216M122H1200500.50300MGGB3216M152H1500500.60200MGGB3216M202H2000500.70200MGGB3216M252H2500500.70200MGGB3216M302H30005

16、01.002006 電氣特性 Electrical Performance6.1阻抗值 Impedance按表 1 所列條件測(cè)量時(shí)，阻抗值應(yīng)符合條款 5。Impedanhall meet item 5 when measureTable 1the condition of Table 1.6.2直流電阻 DC按表 2 所列條件測(cè)量時(shí)，直流電阻應(yīng)符合條款 5。D.CTable 2shall meet item 5 when measurethe condition of Table 2.6.3額定電流 Rated current當(dāng)施加允許電流（見(jiàn)條款 5）時(shí)，磁珠表面溫度升高 20。Chip s

17、urface temperature rise just 20 against chip surface temperature when the allowable current(which is mentioned in item 5) is appTable 3d.地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：5181108測(cè)量設(shè)備Measuring Equipment電源、電流表、溫度計(jì)Electricerr, Electric Current Meter, Thermometer測(cè)量設(shè)備Measuring EquipmentLCR 測(cè)量表HP4263A 或其他

18、Leter HP4263A or equivalent測(cè)量設(shè)備Measuring Equipment阻抗分析儀 HP4291 或其他Impedanceyzer HP4291 or equivalent測(cè)量頻率Measuring Frequency見(jiàn)條款 5(see item 5)測(cè)量信號(hào)Measuring signal level50mV7 信賴(lài)性試驗(yàn) Reliable Performance地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：5181109NO.Item 項(xiàng)目Specifications 規(guī)范Test Methods 測(cè)試方法1Solder- Ability可

19、焊性Moren 90% of termination should be covered with new solder.端電極焊錫覆蓋率為 90%以上Solder 焊錫: Sn 純錫Temperature 焊錫溫度: 255+5/-0 Flux 助焊劑: rosin 松香Duration 浸漬時(shí)間: 3.50.5s2Leaching耐焊性Moren 75% of termination Should be covered with new solder.端電極焊錫覆蓋率為 75%以上Solder 焊錫: Sn 純錫Temperature 焊錫溫度: 270+2/-0 Flux 助焊劑: ro

20、sin 松香Duration 浸漬時(shí)間: 100.5s3Bending Strength彎曲試驗(yàn)No mechanical damage should be noticed不應(yīng)見(jiàn)機(jī)械損傷When thcurve to 2mm(0.079 inches)當(dāng)板彎曲撓度達(dá) 2mm 時(shí)：SizeA(mm)10050.516080.720121.032161.04Body Strength抗壓強(qiáng)度No mechanical damage should be noticed不應(yīng)見(jiàn)機(jī)械損傷App d specified pull strength in axial direction在軸向上施加拉力如下：S

21、izeA/mmP/N10050.74.916081.04.920121.49.832161.49.85Terminal Strength端頭強(qiáng)度The terminal and body should be no damage端頭和瓷體不應(yīng)見(jiàn)損傷App d specified pull stren在軸向上施加拉力如下：gth in axialSizePull StrengthTime (s)10053 N5116085 N51201210 N51321610 N51地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811010NO.Item 項(xiàng)目Specification

22、s 規(guī)范Test Methods 測(cè)試方法6Drop跌落N(xiāo)o mechanical damage shall be noticed外觀無(wú)可見(jiàn)機(jī)械損傷Impedanhall be within 30% of the initial value阻抗變化率30%Drop 10 times on a concrete floor from a height of 1m.從距混凝土地面 1m高度落下，重復(fù) 10 次7Vibration振動(dòng)Frequency 頻率: 10 to 55Hz Amplitude 振幅: 1.52mm Direction and time 方向及時(shí)間:X, Y and Z di

23、rections for 2 hours each.8Humidity耐潮濕Test condition 試驗(yàn)條件 Temp. 溫度: 602 Humidity 濕度: 90%95%Test time 試驗(yàn)時(shí)間: 1000 hMeasurement method 測(cè)量條件:The component should be stabilized at normal condition for 24 hours before test.試驗(yàn)后常溫常濕環(huán)境中放置（242）小時(shí)后測(cè)量9High temperature耐高溫Test condition 試驗(yàn)條件App d rated current 施加

24、額定電流Temp. 溫度: 1252Test time 試驗(yàn)時(shí)間: 1000 hMeasurement method 測(cè)量條件:The component should be stabilized at normal condition for 24 hours before test.試驗(yàn)后常溫常濕環(huán)境中放置（242）小時(shí)后測(cè)量10Low temperature耐低溫Test condition 試驗(yàn)條件Temp. 溫度: -552Test time 試驗(yàn)時(shí)間: 1000 hMeasurement method 測(cè)量條件:The component should be stabilized

25、at normal condition for 24 hours before test.試驗(yàn)后常溫常濕環(huán)境中放置（242）小時(shí)后測(cè)量11Thermal shock 熱沖擊a. Test condition 試驗(yàn)條件Temp. 溫度: -55, time 時(shí)間: 303minTemp. 溫度: +125, time 時(shí)間: 303min 100 cyclesb. Measurement method 測(cè)量條件:The component should be stabilized at normal condition for 24 hours before test.試驗(yàn)后常溫常濕環(huán)境中放置（

26、242）小時(shí)后測(cè)量8焊接條件mended Soldering Conditions產(chǎn)品可用于波峰焊和回流焊Product can be appd to flow and reflow soldering.焊劑 Flux, Solder 使用松香助焊劑，Use rosin-based flux.使用鹵化物含量起過(guò) 0.2wt%的強(qiáng)酸性助焊劑。t use highly acidic flux with halide content exceeding 0.2wt% (chlorineconvervalue). 使用純錫焊料Use Sn solder.波峰焊條件 Flow soldering con

27、ditions 預(yù)熱時(shí)，產(chǎn)品表溫與焊料溫度的溫差最大不允許超出 150，焊接完后冷卻時(shí)，產(chǎn)品表溫與溶劑溫度之間的溫差最大不允許超出 100。預(yù)熱不足有可能產(chǎn)品表面裂紋，導(dǎo)致產(chǎn)品品質(zhì)下降。Pre-heating should be in such a wayt the temperature difference betn solder and productsurface is limited to 150 max. Coolingo solvent after soldering also should be in such a wayttemperature difference is l

28、imited to 100 max. Unwroughtpre-heatingmaycausecracksontheproduct, resultinghe deterioration of products quality. 標(biāo)準(zhǔn)波峰焊曲線 Standard soldering profile. 回流焊條件 Reflow soldering conditions地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811011Profile FeatureLead-Free AssemblyAverage Ramp-Up Rate ( Tsmax to Tp )3 C/se

29、cond max.PreheatTemperature Min (Tsmin)Temperature Max (Tsmax)Time ( tsmo tsmax) mo tsmax)150 200 60-180 seconds預(yù)熱 Pre-heating150,1 minute min最高溫度 Peak260,10 seconds maxNote 1: All temperatures refer to topside of the package, measurethe package body surface.標(biāo)準(zhǔn)回流焊曲線 Standard so lder ing prof i le 手工

30、返工Reworking with soldering iron當(dāng)使用電烙鐵進(jìn)行手工焊接時(shí)，以下條件必須嚴(yán)格遵守The following conditions must be strictly followed when using a soldering iron.地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811012預(yù)熱 Pre-heating150, 1 minute尖端溫度 Tip temperature280 max輸出功率 Soldering iron output20w max電烙鐵頭尖端尺寸 End of soldering iron1mm max

31、焊接時(shí)間 Soldering time3 seconds maxProfile FeatureLead-Free AssemblyTime ma ained above: Temperature (TL) Time (tL)217 60-150 secondsPeak/Classification Temperature (Tp) Peak/Classification Time (Tp)260 3-4 secondsTime within 5 C of actual Peak Temperature (tp)20-40 secondsRamp-Down Rate6C/second max.T

32、ime 25 C to Peak Temperature8 minutes max.9條件 Cleaning Conditions產(chǎn)品時(shí)應(yīng)遵循以下條件Products shall be cleanethe following conditions.溫度最高不超過(guò) 60。（若是氟化物類(lèi)和類(lèi)清潔劑，溫度最高不超過(guò) 40）Cleaning temperature shall be limited to 60 max.(40 max for fluoride and alcohol type cleaner.)為了避免印刷線路板及其上所安裝器件出現(xiàn)現(xiàn)象，在進(jìn)行超聲波時(shí)，應(yīng)嚴(yán)格遵循以下條件Ultraso

33、nic cleaning shall comply with the following conditions wivoiding the resonance phenomenon at the mounted products and P.C.B.功率er: 20W/t max頻率 Frequency: 40 kHz 以下時(shí)間 Time: 5 minutes max清潔劑 Cleanera)可選類(lèi)型 Alternative cleaner異丙基醇 Isopropyl alcohol (IPA)含水劑 Aqueous agentHCFC-225b)表面活性劑類(lèi) Surface Active A

34、gent Type (CLEANTHROUGH 750H)碳?xì)浠衔镱?lèi) Hydrocarbon Type高分子醇類(lèi) Higher Alcohol Type(TECHNOCLEANER 335)(PINE ALPHA ST-100S)堿性皂類(lèi) Alkali Saponification Type (*AQUACLEANER 240)后，產(chǎn)品上不應(yīng)有助焊劑和清潔劑駐留；若使用了含水劑，為了徹底洗去清潔劑，產(chǎn)品應(yīng)在去離子水沖洗后完全晾干或烘干。Thee shall be no residual flux and residual cleaner after cleaning.he case of u

35、sing aqueous agent,products shall be dried compley after rinse with de-ionized water in order to remove the cleaner.其他清潔方式 Other cleaning們 Please contact us.請(qǐng)地址：(市寶安區(qū)觀瀾鎮(zhèn)大道裕興路傳真(Fax)：)：(tcode)：5181101310包裝 Packaging 編帶尺寸Dimens of T:紙帶/塑帶 Pr / Emsed carrier t:Unit: mmT*：Product thickness 帶輪尺寸Dimens of

36、 ReelUnit: mmReel material: PS (Polystyrene)地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811014A1782B602C13.00.5D21.00.8E2.00.5W10.01.15t1.20.2R1.00.25Type32162012160810050603T*1.10.30.850.21.250.20.80.150.50.150.30.05PrEmsedPrEmsedPrPrPr carrier t carrier t carrier t carrier t carrier t carrier t carrier tA

37、2.00.22.00.21.50.151.50.151.050.150.650.150.40.05B3.60.23.60.22.50.22.50.21.90.151.30.150.70.05C8.00.38.00.38.00.38.00.38.00.38.00.38.00.3D3.50.053.50.053.50.053.50.053.50.053.50.053.50.05E1.750.11.750.11.750.11.750.11.750.11.750.11.750.1F4.00.14.00.14.00.14.00.14.00.12.00.052.00.05G2.00.052.00.052.

38、00.052.00.052.00.052.00.052.00.05H4.00.14.00.14.00.14.00.14.00.14.00.14.00.1J1.5+0.1/-01.5+0.1/-01.5+0.1/-01.5+0.1/-01.5+0.1/-01.5+0.1/-01.5+0.1/-0t(max)1.10.052.00.051.10.051.00.051.00.050.80.050.550.05 編帶抗拉強(qiáng)度 Pulling strength of ts 編帶簡(jiǎn)圖及拉伸方向 Tafigure and drawing direction編帶材料T基帶Base t蓋帶Cover tmate

39、rial: 紙帶cardboard: 聚乙烯polyethylene 蓋帶剝離強(qiáng)度 Peeling strength of cover t測(cè)試條件 Test condition:剝離角度peel angle: 165180 vs. carrier t剝離速度peel speed: 300 mm/min10%.地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811015蓋帶 Cover t0.30.7N (30gf70gf)載帶 Carrier t10N or more (1kgf or more)上蓋帶 Cover t5N or more (0.5kgf or more

40、)包裝箱盒尺寸 Box and case dimensUnit: mmL3LA 一盒六盤(pán)，一箱十盒 6 reels in a box.B 一盒十盤(pán)，一箱六盒 10 boxes in a case.包裝數(shù)量Packagingties11裝箱及標(biāo)志 Packings and marking 包裝文件PackingsPacking includes the following:a.b.Packing list.of compliance.裝箱合格Reel 盤(pán)上標(biāo)記Marking on reels: a 型號(hào) MICROGATE Part No.b 生產(chǎn)批號(hào) Lot numberLabelc 盤(pán)裝數(shù)量

41、ty per reeld 檢驗(yàn)員號(hào) Inspector No.以上內(nèi)容必須在上注明.All above shall be shown on marking label地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811016TypeThickness(mm)BulkTand reel32161.100.30-3000pcs20121.250.20-3000pcs0.850.20-4000pcs16080.80.15-4000pcs10050.50.15-10000pcs06030.30.05-15000pcs2L1TypeL1L2L3Boox

42、180218021202Case400240022002公司如下所示：MICROGATE marking label will be as following:MICROGATEMG PART NO公司生產(chǎn)如下列所示:MICROGAot number will be as per the following example:生產(chǎn)計(jì)劃序號(hào) Sequence Number生產(chǎn)計(jì)劃月份 Month生產(chǎn)計(jì)劃年份 Year生產(chǎn)性質(zhì)：F：鐵氧體料；H：表示陶瓷料；T：表示新產(chǎn)品試產(chǎn)F: FerriteH: CeramicT: New Trial-Production檢驗(yàn)合格后，檢驗(yàn)員在上蓋上合格章。合格章

43、如下所示：The eligible reels will be pressed a mark onto the surface. The mark will be as following:QC PASSED01BoxLabel 內(nèi)包裝盒標(biāo)記:Marking on inner boxa 型號(hào) MICROGATE Part No.b 每盒數(shù)量c 包裝日期 Date以上內(nèi)容必須在ty per box上注明（見(jiàn) 11.2 所示）。Above shall be shown on marking label (The marking label is shown in item 11.2). 外包裝箱標(biāo)

44、記 Marking on outer case:1) 制造商 Manufacturer: “MICROGATE” will be marke地址：市寶安區(qū)觀瀾鎮(zhèn)()：大道裕興路傳真(Fax)：(tcode)：51811017CUSTOMER:P. O. NOCUSTOMART NO:LOT NOMG PART NO:TYINSP. NO“中國(guó)制造” “Made in Shenzhen CHINA” will be marke2) 發(fā)運(yùn)標(biāo)記 Ship marking:“向上”“UP”, “輕放”“HAND CARE”, “防潮”“MOISTURE-PROOF” will be marke2).3

45、) 包裝包括以下內(nèi)容 Packing label include the following:CASEa.b.c.型號(hào) MICROGATE Part No總數(shù)量 Total包裝日期 Date;ty per case1)以上內(nèi)容必須在上注明。(見(jiàn) 11.2 所示)3)2)All above shall be shown on marking label.(The marking label is shown in item 11.2)2)12 保管 Storage 保管期限 Storage period距出廠檢驗(yàn)時(shí)間六個(gè)月內(nèi)，產(chǎn)品可以使用；檢驗(yàn)時(shí)間可以通過(guò)包裝外側(cè)標(biāo)記的檢驗(yàn)號(hào)確認(rèn)；若時(shí)間超出六個(gè)

46、月，應(yīng)檢查焊接性能后方可使用。Products which inspectedICROGATE over 6 months ago should be examined and used, which canbe confirmed with inspection No. marke exceeded. 保管條件 Storage conditionsthe container. Solder ability should be checked if this period is存放貨物的庫(kù)房應(yīng)滿足以下條件Products should be storagehe warehouse on the

47、 following conditions溫度 Temperature: -10 +40濕度 Humidity: 30 to 70% relative humidity不允許溫、濕度有極劇變化。No rachange on temperature and humidity將產(chǎn)品保管在腐蝕性物質(zhì)中，例如硫磺、氯氣或者酸，否則將引起端頭氧化，導(dǎo)致降低焊接性。t keep products in corrosive gasech alfur, chlorine gas or acid, or it may cause oxidizationof electrode, resulting in poor solder ability.為了避免受潮氣、灰塵等物質(zhì)的影響，產(chǎn)品應(yīng)保管于貨架上。Products should be storage on the palette for the prevention of the influence from humidity, dust and so on. 產(chǎn)品保管在庫(kù)時(shí)，應(yīng)避免熱沖擊，振動(dòng)以