入門級專業(yè)英文詞匯

1、PCB入 門 級 專 業(yè) 英 語 詞 匯編制: 工程MI組日期:2013-11-15物料篇Laminate 層壓板Base material 基材CCL (Copper-clad laminate) 覆銅板PP ( Prepreg ) 膠片,預浸或半固化片,常用的有1080/2113/2116 /7628等.Resin, Epoxy Resin 樹脂,環(huán)氧樹脂Woven glass fabric 玻璃纖維布Core 芯板Copper foil 銅箔,主要使用的銅箔有HOZ/1OZ等.Rolled copper foil 壓延銅箔THE 銅箔( High temperature elongati

2、on electrodeposited copper foil) 高延展性電解銅箔Kraft Paper 牛皮紙Peelable mask 蘭膠Kapton tape 高溫膠Carbon ink 碳油Solder mask/Solder resist ink 阻焊油墨Thermosetting type ink 熱固化油墨Silkscreen/Component mark/Legend 字符Solder, Tin/Lead solder 焊料,鉛錫焊料Drill bit, Rout bit /milling cutter 鉆咀,鑼刀,銑刀Chemical 化學的Dry film 干膜,是一種能

3、感光,顯像,抗電鍍,抗蝕刻之阻劑TG (Temperature of Glass Transition) 玻璃態(tài)轉(zhuǎn)換溫度CTE( Coefficient of Thermal Expansion) 熱膨脹系數(shù)CTI( Comparative Tracking Index ) 相對漏電指數(shù)Anti-CAF( conductive anodic filament ) 耐離子遷移Dielectric constant 介電常數(shù)(DK/Er)TD( Temperature of Decompose) 熱裂分解溫度RoHS( Restriction of Hazardous Substances Dir

4、ective )危害性物質(zhì)限制指令 (Lead鉛 , Mercury汞 , Cadmium鎘 , Chromium (VI)六價鉻 , Polybrominated biphenyls ( PBBs)多溴聯(lián)苯, Polybrominated diphenyl ethers ( PBDEs)多溴聯(lián)苯醚) 工藝篇Laminate cutting 開料,裁板Baking 烤板Desmear 除膠渣PTH( Plated-Through-Hole) 鍍通孔,也指沉銅Plasma cleaner 等離子清洗Panel plating 全板電鍍,也叫整板電鍍Pattern plating 圖形電鍍Imag

5、e transfer 圖形轉(zhuǎn)移Tin Stripping 褪錫Etching 蝕刻Under cut 側(cè)蝕SES 褪膜-蝕刻-褪錫連線(堿性蝕刻線)DES 顯影-蝕刻-褪膜連線(酸性蝕刻線)Etching factor 蝕刻因子(蝕刻系數(shù)),主要用來衡量側(cè)蝕量的大小,蝕刻 因子=2*銅厚/(下線寬-上線寬)Solder mask printing 印阻焊Exposure 曝光UV cure UV固化(ultraviolet)LPI( Liquid Photo Image) 液體感光成像Developing 顯影Silkscreen stencil 絲印鋼網(wǎng)，簡稱絲網(wǎng)Aluminum sheet

6、 鋁片Scrubbing 磨邊DI water 純水,去離子水( Deionization),由樹脂對無物理大顆粒的水體進行陰陽離子的吸附,常見的有鈣離子/氯離子/鎂離子等 HASL (Hot Air Soldering Level) 噴錫,熱風整平LF-HASL (lead free-hot air soldering level) 無鉛噴錫ENIG/Immersion gold沉金(沉鎳金, Electroless Nickel/Immersion Gold )ENEPIG ( electroless nickel electroless palladium immersion gold

7、)沉鎳鈀金HDI( High Density Interconnector )高密度互連 Flash gold 水金(電薄金)Hard gold 厚金Immersion Tin 沉錫OSP / Entek (Organic Solderability Preservatives) 有機保焊劑,防氧化處理Immersion silver 沉銀Pressing process 壓合工藝Brown oxidation 棕化Layer up 疊層,預疊板Lamination structure 壓合結(jié)構LASER (Light Amplification by Stimulated Emission

8、of Radiation) 鐳射 ,激光Registration 對準，對位OPE (Optiline Post Etch)內(nèi)層蝕刻對位沖孔機Rivet 鉚釘/鉚合Fusion 熱熔X-ray, X射線CCD( Charge Coupled Device ) 電荷耦合器件 X-Y dimension machine 二次元Label, Barcode label 標簽,條碼標簽V-cut / V-score 刻槽Rout 鑼槽,鑼板Routing 布線(route的ing形式) ,也指鑼槽,鑼板Punch 沖板/啤板AOI (Automated Optical Inspection) 自動光學

9、檢查Fly-probe test 飛針測試Ultrasonic Cleaning 超聲波清洗Microetching 微蝕Aspect Ratio 縱橫比,厚徑比,一般指板厚與最小孔孔徑的比值工程篇Gerber data: Gerber 資料 Original Gerber 原稿Working Gerber 工作稿，生產(chǎn)稿Specification 規(guī)格,規(guī)范Fabrication drawing 制作圖紙Purchasing order 定單Technical card / form 技術卡/表單Pad 焊盤Isolation pad 孤立焊盤Ground layer 接地層Power la

10、yer 電源層Signal layer 信號層Dielectric 介質(zhì)層Impedance 阻抗Single-end impedance / Characteristic impedance特性阻抗Differential impedance 差分阻抗Copper circuits 線路Solder mask opening 阻焊開窗Solder dam / solder mask bridge 阻焊橋Thermal Via 導熱孔,散熱孔Teardrop 淚滴Annular ring 焊環(huán)Beveling 斜邊Chamfer 斜邊,倒角Clearance 清除(通常在內(nèi)層指隔離環(huán)clear

11、ance land,在阻焊指開窗solder mask clearance)Via holes 導通孔Component holes 元件孔BGA( Ball Grid Array) 矩陣式球墊表面裝組件 IC (Integrated Circuit) 集成電路器Pitch 節(jié)距,比如IC的節(jié)距, 就是IC pad的中心距離VIP,Via in Pad,盤中孔SMD (Surface Mount Device) 表面貼裝組件(零件)SMT (Surface Mounting Technology ) 表面貼裝技術THT( Through hole technology) 通孔插裝技術Artwo

12、rk 底片,菲林Break-away area / panel rail 工藝邊Panel / Set / array 套板Panelization 排版Component side 元件面Solder side 焊接面Soldering / Assembly 裝配Fiducial mark 光點,定位光學點,用于裝配時定位Slot 槽FPC (Flexible Printed Circuits) 軟性電路板(軟板)撓性印制板 Rigid PCB 硬板Rigid-Flex PCB 軟硬結(jié)合板Semi-Flex PCB 半撓性板FR-4 (Flame Resistant Laminates) 耐

13、燃性積層板材Gold fingers 金手指Connector 連接器Press-fit hole 壓接孔,一般孔徑公差要求嚴,插件的腳一般不需要焊接Stamp hole / thread hole / mouse bite 郵票孔Blind hole 盲孔Buried hole 埋孔Tooling hole 工具孔,一般為NPTHX-out 打X板,即有缺陷的板Counterbore 沉頭孔Countersinking 錐型擴孔，嗽叭孔Drill map/Drill drawing/Hole chart 孔圖 SPC (Statistical Process Control) 統(tǒng)計制程管制G

14、reen 綠色gloss green 光亮綠色matte green / dull green 啞光綠色Compensate 補償品質(zhì)篇Tolerance / out of tolerance 公差/超出公差Dimension 尺寸Delamination 分層,多指多層板的金屬層與樹脂之間的分離而言Dent 凹痕/凹陷Wrinkle 皺褶/起皺Hole breakout 孔破Void 空洞Nick 缺口Pin hole 針孔Wicking 燈芯效應Cleanliness 清潔度Ion Cleanliness 離子清潔度Etchback 凹蝕Negative Etchback 負凹蝕燈芯效應E

15、lectrical test 電測試Roughness of hole wall 孔壁粗糙度Shelf life 保質(zhì)期(沉金,噴錫板12個月,OSP,沉銀,沉錫6個月)Inspection 檢查visual examination 目視檢查Thermal shock test 熱沖擊測試Solderability test 可焊性測試Edge dip test 浸錫測試 Solder float test 浮錫測試 Wave solder test 波峰焊 測試Wetting Balance 濕潤平衡Conductor width 導體寬度(線寬)Conductor spacing 導體間距(線距)Bow and twist 板彎板翹Scratch 刮痕,刮傷 Measling 白斑Split 裂紋Repair / rewor