AC焊接不良下降(ppt 30)

Division:YOOWON品質(zhì)部G/BName:------王王劍A/C焊接不良下下降通過(guò)確保最最佳條件達(dá)達(dá)成目標(biāo)柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTD?焊接不良率率高→修理數(shù)多，，生產(chǎn)性低低下?焊接不良高高→資材浪費(fèi)多多，生產(chǎn)成成本上升,公司競(jìng)爭(zhēng)爭(zhēng)力下降?焊接不良高高→現(xiàn)場(chǎng)5S不不良，品質(zhì)質(zhì)不良易發(fā)發(fā)生PROJECT促進(jìn)進(jìn)背景現(xiàn)在的問(wèn)題題VOB?顧客客不不良良多多,影影響響公公司司形形象象,造造成成銷銷售售數(shù)數(shù)下下降降,公公司司利利潤(rùn)潤(rùn)下下降降?焊接接不不良良高高→生產(chǎn)產(chǎn)性性低低下下,作作業(yè)業(yè)者者加加班班多多,作作業(yè)業(yè)者者疲疲勞勞度度增增加加,缺缺勤勤率率上上柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICAMD?蒸發(fā)發(fā)器器、、冷冷凝凝器器是是通通過(guò)過(guò)焊焊條條把把銅銅管管、、U型型管管、、銅銅配配管管焊焊接接而而成成組組成成的的回回路路，，在在焊接接過(guò)過(guò)程程中中，，因因各各種種因因素素，，會(huì)會(huì)產(chǎn)產(chǎn)生生焊焊漏漏，，從從而而造造成成組組裝裝空空調(diào)調(diào)時(shí)時(shí)制制冷冷劑劑外外泄泄，，空空調(diào)不不能能正正常常工工作作Define?社外外品品質(zhì)質(zhì)不不良良多多，，對(duì)對(duì)公公司司的的產(chǎn)產(chǎn)品品產(chǎn)產(chǎn)生生不不信信任任?社外外品品質(zhì)質(zhì)不不良良多多→顧客客CLAIMProblemStatement:VoiceOfCustomer柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICAMDPROJECT對(duì)對(duì)象象選選定定柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTD測(cè)定定時(shí)時(shí)間間:2004.1月月-11月月工程程不不良良中中焊焊接接不不良良所所占占比比例例最大,選選定焊接接不良進(jìn)進(jìn)行改善善ICAMDMissionStatementBaselineSAVINGGOALCOPQ焊接接不良率10894ppm4894ppm減少6000ppm萬(wàn)元/年5.90萬(wàn)元利潤(rùn)潤(rùn)增加萬(wàn)元/年σ水準(zhǔn)3.8σ向上0.2σ4.0σ柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTD?COPQ改善金金額-以以樹(shù)立立好的的改善善計(jì)劃劃為基基礎(chǔ)，，節(jié)減減計(jì)劃劃定為為減少少萬(wàn)元元，?改善前前COPQ=(5,500*746,886臺(tái)臺(tái))*元元/1,000,000=元/年?改善目目標(biāo)COPQ=(1000*746,886臺(tái))*元元/1,000,000=元/年?改善結(jié)結(jié)束日日-2005年2月05日止止促進(jìn)進(jìn)結(jié)束束ICAMDProjectTeam金來(lái)洙副總生產(chǎn):金在中技術(shù):盧寶寶國(guó)品質(zhì):王劍張文龍經(jīng)理柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDProjectSchedulePlanDoingDEFINEMEASUREANALYZEIMPROVECONTROL04.12.0112.2101.0501.2002.05ICAMD柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDMeasureICADMProject.Y.的定義選定改善LINE：生產(chǎn)制品：柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICADM檢測(cè)系統(tǒng)分析析(計(jì)數(shù)型)對(duì)象測(cè)定工具具：水壓檢漏漏計(jì)數(shù)型GageR&R檢測(cè)日期：姓名：產(chǎn)品：2004.12.17李洪波熱交換器結(jié)論：檢查者者及測(cè)試儀器器間有95%的信賴性，，本系統(tǒng)適用用柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICADMProcessCapability數(shù)據(jù)收集期間間:現(xiàn)在工程能力力:3.65Sigma柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTD詳細(xì)ProcessMap(PFD)inputoutputBaseCu-pipe.al-foil.plateAssyin.assyoutU-bend.焊條.Lpg.O2.水壓檢漏.Packingcase原材料1次半成品2次半成品3次半成品完成品STARTBASE投入入銅管.鋁箔投投入熱交換器投入入組立自動(dòng),手動(dòng)焊焊接校正及包裝泄漏檢查外觀檢查出廠返修VAVAVAVANVANVAVAAnalyzeICMDA柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDCause&EffectDiagram焊接泄漏人設(shè)備材料方法新員工焊槍焊嘴技能不好責(zé)任心不強(qiáng)焊接氣體焊接部品焊條焊條太細(xì)焊接順序火焰性質(zhì)焊接時(shí)間PALLET流水線焊接姿勢(shì)堵大培訓(xùn)不足氣體不純焊棒不純流動(dòng)性不好速度快速度慢文化低太重手感不好小太長(zhǎng)未預(yù)熱熱火焰大大小太長(zhǎng)太短有氧化化物間隙大大ICMDA未自檢檢未培訓(xùn)訓(xùn)未按標(biāo)標(biāo)準(zhǔn)壓力力低低太短短還原原焰焰作業(yè)業(yè)量量作業(yè)業(yè)量量多多反應(yīng)應(yīng)慢慢有油油預(yù)熱熱時(shí)時(shí)間間長(zhǎng)長(zhǎng)疲勞勞輕左式式右式式氧化化焰焰熔點(diǎn)點(diǎn)高高插入入深深度度太深深太淺淺靜止止運(yùn)動(dòng)動(dòng)柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDF.D.M(FunctionDeploymentMatrix)ICMDA柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICMDAAnalyzePhase№檢測(cè)項(xiàng)目問(wèn)題假設(shè)設(shè)定檢測(cè)條件檢測(cè)工具資料收集歸屬（Ho）對(duì)立（H1)DATATYPE樣品數(shù)擔(dān)當(dāng)記錄1流水線速度快流水線速度快影響焊接質(zhì)量流水線速度快慢不影響焊接質(zhì)量流水線速度快慢會(huì)影響焊接質(zhì)量T/T=20”T/T=17”焊接不良Data500臺(tái)（3000point)不良記錄sheet2配管間隙大配管間隙過(guò)大或過(guò)小會(huì)影響焊接質(zhì)量配管間隙過(guò)大或過(guò)小不會(huì)影響焊接質(zhì)量配管間隙過(guò)大或過(guò)小會(huì)影響焊接質(zhì)量雙邊間隙=0.2mm雙邊間隙＞0.2mm焊接不良Data300臺(tái)(1800point)不良記錄sheet3焊嘴不良焊嘴口徑過(guò)小會(huì)影響焊接質(zhì)量焊嘴口徑大小不會(huì)影響焊接質(zhì)量焊嘴口徑大小會(huì)影響焊接質(zhì)量焊嘴直徑=0.6mm焊嘴直徑≠0.6mm焊接不良Data300臺(tái)(1800point)不良記錄sheet4部品表面臟部品表面臟影響焊接質(zhì)量部品表面臟不會(huì)影響焊接質(zhì)量部品表面臟會(huì)影響焊接質(zhì)量部品表面有污染部品表面無(wú)污染焊接不良Data200臺(tái)(1200point)不良記錄sheet5焊條質(zhì)量差焊條流動(dòng)性差影響焊接焊條流動(dòng)性差不會(huì)影響焊接質(zhì)量焊條流動(dòng)性差會(huì)影響焊接質(zhì)量3%Ag焊條2%Ag焊條焊接不良Data600臺(tái)(3600point)不良記錄sheet柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICMDATwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16TEST#1:確認(rèn)流水水線速度度對(duì)焊接接泄漏的的影響度度?P-Value<0.05歸屬假設(shè)設(shè)(Ho)放棄,對(duì)立假設(shè)設(shè)(H1)采取?結(jié)果:焊接泄漏漏受流水水線速度度快慢的的影響.AnalysisTool:2-ProportionsHO:PT/T=20″=PT/T=17″″流流水線線速度對(duì)對(duì)焊接泄泄漏無(wú)影影響H1:PT/T=20″″≠PT/T=17″流流水線速速度對(duì)焊焊接泄漏漏有影響響Testand流流水線速速度f(wàn)orTwoProportionsSampleXNSamplepT/T=20″″530000.001667T/T=17″″1830000.006000Estimateforp(1)-p(2):-0.0043333395%CIforp(1)-p(2):(-0.00745862,-0.00120805)Testforp(1)-p(2)=0(vsnot=0):Z=-2.72P-Value=0.007柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICMDATwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16TEST#2:確認(rèn)配管間隙隙對(duì)焊接泄漏漏的影響度?P-Value<0.05歸屬假設(shè)(Ho)放棄,對(duì)立假設(shè)(H1)采取?結(jié)果:焊接泄漏受配配管間隙的影影響.AnalysisTool:Chi-SquareTestHO:P間隙0.2=間隙0.3=間間隙0.4配管間間隙對(duì)對(duì)焊接接泄漏漏無(wú)影影響H1:P間隙隙0.2≠間間隙0.3≠≠間間隙0.4配管間間隙對(duì)對(duì)焊接接泄漏漏有影影響Chi-SquareTest:間間隙隙0.5,間間隙0.6,間間隙隙0.7Expectedcountsareprintedbelowobservedcounts間隙0.2間間隙隙0.3間間隙0.4Total不良品品312153010.0010.0010.00良品品17971788178553701790.001790.001790.00Total1800180018005400Chi-Sq=4.900+0.400+2.500+0.027+0.002+0.014=7.844DF=2,P-Value=0.020柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICMDATwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16TEST#3:確認(rèn)焊嘴嘴大小對(duì)對(duì)焊接泄泄漏的影影響度?P-Value＞0.05對(duì)立假設(shè)設(shè)(H1)放棄,歸屬假設(shè)設(shè)(Ho)采取?結(jié)果:焊接泄漏漏不受焊焊嘴大小小的影響響.AnalysisTool:Chi-SquareTestHO:P焊焊嘴嘴0.6=焊嘴嘴0.4=焊焊嘴0.7焊嘴大小小對(duì)焊接接泄漏無(wú)無(wú)影響H1:P焊焊嘴0.6≠焊嘴0.4≠≠焊焊嘴0.7焊嘴大小小對(duì)焊接接泄漏有有影響Chi-SquareTest:焊嘴嘴0.6,焊焊嘴0.4,焊焊嘴0.7Expectedcountsareprintedbelowobservedcounts焊嘴0.6焊焊嘴0.4焊焊嘴嘴0.7Total不良品675186.006.006.00良品17941793179553821794.001794.001794.00Total1800180018005400Chi-Sq=0.000+0.167+0.167+0.000+0.001+0.001=0.334DF=2,P-Value=0.846柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICMDATwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16TEST#4:確認(rèn)部品品表面污污染對(duì)焊焊接泄漏漏的影響響度?P-Value<0.05歸屬假設(shè)設(shè)(Ho)放棄,對(duì)立假設(shè)設(shè)(H1)采取?結(jié)果:部品表表面污污染對(duì)對(duì)焊接接泄漏漏有影影響.AnalysisTool:2-ProportionsHO:P有有污染染=P無(wú)無(wú)污污染PIPE有有無(wú)污污染對(duì)對(duì)焊接接泄漏漏無(wú)影影響H1:P有有污染染≠P無(wú)無(wú)污污染PIPE有有無(wú)污污染對(duì)對(duì)焊接接泄漏漏有影影響TestandPIPE有無(wú)無(wú)污染染forTwoProportionsSampleXNSamplep無(wú)污染染312000.002500有污染染1212000.010000Estimateforp(1)-p(2):-0.007595%CIforp(1)-p(2):(-0.0137988,-0.00120119)Testforp(1)-p(2)=0(vsnot=0):Z=-2.33P-Value=0.020柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDICMDATwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16TEST#5:確認(rèn)焊條含含銀量對(duì)焊焊接泄漏的的影響度?P-Value＞0.05對(duì)立假設(shè)(H1)放棄,歸屬假設(shè)(Ho)采取?結(jié)果:焊條含銀量量對(duì)焊接泄泄漏無(wú)影響響.AnalysisTool:2-ProportionsHO:P3%銀焊條條=P2%銀焊條焊條含銀量量對(duì)焊接泄泄漏無(wú)影響響H1:P3%銀焊條條≠P2%銀焊條焊條含銀量量對(duì)焊接泄泄漏有影響響Testand焊焊條含含銀量forTwoProportionsSampleXNSamplep3%銀焊條條1236000.0033332%銀焊條條1536000.004167Estimateforp(1)-p(2):-0.00083333395%CIforp(1)-p(2):(-0.00365692,0.00199026)Testforp(1)-p(2)=0(vsnot=0):Z=-0.58P-Value=0.563柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDTwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16Analyze階段段開(kāi)開(kāi)始始的的重重要要因因子子(VitalFewXs)CMDIAImprove柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDTwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16CMDIANon-DOE因子改善PLAN1）對(duì)策樹(shù)立2）改善內(nèi)容柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDTwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16CMDIA3）危險(xiǎn)性評(píng)價(jià)價(jià)4）再現(xiàn)性試驗(yàn)驗(yàn)結(jié)果TestMethod:流流水線速設(shè)設(shè)定后,焊焊接泄漏是是否減少,適用2-Proporitiontest來(lái)驗(yàn)證HO:改善善前焊接泄泄漏不良=改善善后焊接泄泄漏不良H1:改善善前焊接泄泄漏不良＞＞改善善后焊接泄泄漏不良TestandCIforTwoProportionsSampleXNSamplep改善前5674400.007527改善后3190000.003444Estimateforp(1)-p(2):0.0040824495%CIforp(1)-p(2):(0.00177545,0.00638942)Testforp(1)-p(2)=0(vsnot=0):Z=3.59P-Value=0.000P-Value＜0.05歸屬假設(shè)(Ho)放棄,對(duì)策適用后后焊接不良良減少柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDTwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16CMDIANon-DOE因子改善善PLAN1）對(duì)策樹(shù)立2）改善內(nèi)容A=0.1mmA>0.1mm柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDTwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16CMDIA3）危險(xiǎn)性評(píng)價(jià)價(jià)4）再現(xiàn)性試驗(yàn)驗(yàn)結(jié)果TestMethod:配配管間隙控控制后,焊焊接泄漏減減少,適用用2-Proportions來(lái)驗(yàn)證證HO:改善善前焊接泄泄漏不良=改善善后焊接泄泄漏不良H1:改善善前焊接泄泄漏不良＞＞改善善后焊接泄泄漏不良TestandCIforTwoProportionsSampleXNSamplep改善前123120000.010250改善后85150000.005667Estimateforp(1)-p(2):0.0045833395%CIforp(1)-p(2):(0.00241755,0.00674911)Testforp(1)-p(2)=0(vsnot=0):Z=4.28P-Value=0.000P-Value＜0.05歸屬假設(shè)設(shè)(Ho)放棄,對(duì)策適用用后焊接接不良減減少柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDNon-DOE因子改改善PLAN1）對(duì)策樹(shù)立立2）改善內(nèi)容容CMDIA柳原電子（蘇州）有限公司YOOWONELECTRONICS（SUZHOU）CO.,LTDTwo-sampleTforT/T=20"vsT/T=17"NMeanStDevSEMeanT/T=20"10395.436.311T/T=17"10467.646.715Difference=muT/T=20"-muT/T=17"Estimatefordifference:-72.395%CIfordifference:(-111.9,-32.6)T-Testofdifference=0(vsnot=):T-Value=-3.87P-Value=0.001DF=16CMDIA3）危險(xiǎn)性評(píng)評(píng)價(jià)4）再現(xiàn)性