文稿講稿plasma etch等離子

LeadershipLeadershipinAllPrintedCircuitProduct/MarketPurchasedbyNordsoninEstablishedinAdvancedPlasmaSystemsCompanyCompanyMarchPlasma=March+AdvancedPlasmaCompanyEastandWestCoastFlorida&CaliforniaFloridaProduction

ApplicationsupportStPetersburgMaastrichtConcordWWSalesandTechnicalMarchPlasmaSystemsIntroductionofPlasmaIntroductionofPlasmaGasPhaseMixtureConsistsof:Neutral,PhysicallyActiveandChemicallyReactive

Plasma:What,Why,,應(yīng)用ByPhysicalBombardmentandChemicalReactionRemoveContamination臟物（污染物）清Activate 表面活 蝕ImprovesYieldsandEnhancesReliabilityofICImprovesAdhesionofWireBonds,DieAttach,andEaseofUse,EnvironmentallyWhatisa 等離子體的產(chǎn)GeneratingaWhatisaFourthStateofComponentsofa氧離子（負離子4thStateofWhatisa4thStateofReactiveGases反應(yīng)氣

ReactiveIonHydrogenPlasmaChemicalProcessOxideRemoval

OxygenPlasmaChemicalProcessOrganicRemoval O

ArgonPlasmaPhysicalProcess

H H 化 工 化 工 物 工AdvantagesofPlasmaVeryEffectiveforSurfaceCleaning,Activation,andEtchingEnvironmentallyFriendly-LowGasFlowNoAqueousChemicals nelExposuretoChemicalsThreeDimensionalTreatmentCapabilityLowCostOfOwnershipMinimalMaintenanceEaseofUse-AutomatedHighUniformityandPCBDriversforPlasmaReactionSurfaceSputteringviaionByproductphysicallydislodgedfromGas:solidchemicalGasphasereaction,byproductsPhysicalvs.ProcessPlasmaApplicationsforComplexandsophisticatedboardswitheverincreasinglayercountsandcircuitdensitiesDescumDesmear/CarbonRemoval去膠渣/碳化Etchback回BlindVias盲 活SurfacePreparation表面處PlasmaReactionProcessActiveArgonOxygenPhysicaland/orIons,Radicals,SurfaceOxygenPhysicaland/orIons,Radicals,OxygenandTetraflouride(O2+PhysicalIons,Radicals,ArgonDeposition/VaporizedRadicals,Desmear/CarbonRemovalBlindTeflonActivationSurfacePreparation??????ComplexandsophisticatedboardswitheverincreasinglayercountsandcircuitdensitiesPlasmaApplicationsforSingle-stepO2 3DescumDescumDescum:PhotoresistRemovalPlasmaApplicationsforPCBPCB板加蝕刻（除膠渣灰蝕等廢棄物清Panelheatup(O2/N2)Etching(CF4/N2/O2)Ash/Fluorineremoval???3-StepProcessRemovalofresinsmearfromaftermechanicaldrilling鉆孔后孔內(nèi)膠渣去DesmearPlasmaApplicationsforPlasmaPlasmaApplicationsforViaandPadViaandPadLaserformedvia:BeforeplasmaresinandcarbonareAfterplasmatheholeisCopperDrillEtchback:BeforePlasmaApplicationsforCopperEtchedEtchback:AfterPlasmaApplicationsforBreakBreakdownresinCarbonremovalBlind3BlindVia1.52Two-StepRemovalofcarbonresiduefromcapturepadafterlaserBlindPlasmaApplicationsforBlindAfterAfterBeforeandAfterPlasmaPlasmaApplicationsforBlindBeforeBeforeandAfterPlasmaPlasmaApplicationsforBlindPlasmaApplicationsforSurfaceTeflon?Activation:Activatestheholewallsforplatingo BsmadewithaTeflonmaterialPureblendsuseone-stepprocessFillersusetwo-stepprocesswith(CF4/O2)infirstSurfacePreparation:Surfacetreatmentofinnerlayersonrigid/flexPCBspriortolaminationOne-stepprocesswithLegendAdhesion:PreparationofsoldermasksurfacepriortoapplyingcomponentOne-stepprocesswithCriticalCriticalMaterial–TemperatureeffectsetchrateandRF–PowereffectsetchrateandpanelGasFlowrateand–AvailabilityofgaseffectstheetchOperating–PressureeffectstheamountofactivegasandthedirectionoftheionflowLCPPlasmaTreatmentResults:EngineeringReport106ProcessProcess:GasO2/N280/20%:Pressure:Power8.5KWTemp95°C:GasFlow:Time(as:GasCF4/O2/N210/80/10% :Pressure240mTorrPower4.0KWTemp95°C:GasFlow2slm:Time:GasO2100%:Pressure:Power4.0KW:Temp :GasFlow2.0:TimePCB2800PCB2800整機結(jié)構(gòu)介–Multiplegasports(多氣 ProvenelectrodeEqualizedRFpowerUniformplasma(均勻的等離子分布Completetemperature(完全的溫度控制Verticalpanelprocessing(垂直的面板處理PCBPCBSeriesProductTru-TempThoroughTemperatureGascrossUniformgasGasflowMultipleRFfeed-UniformCompeteSuperiorPumpandBlowerumumprocesscontrol(alarmLowgasConductancemodecontrol(massflow,fixedPlasmaProcessControllerandInformationManager(P2CIM)SoftwarePCBPCBSeriesProductPCB2800Vacuum兩級真空泵FumeFumeScrubberFumeScrubber酸堿洗滌塔：等離子機生產(chǎn)過程使用CF4后產(chǎn) N2GeneratorAirProducts