電路板PCB工程師英文EQ整理

1、1基本信息(1)問(wèn)題：the board thick ness(2.36+/-0.05mm) is too hard to control for us 對(duì)我們來(lái)說(shuō)，板厚 2.36+/-0.05mm 太難管控Can we control the finished board thickness as 2.4+/-10%mm ? Pleasecomfirm!(2)comfirm!(2)(3)(4)(3)(4)請(qǐng)確認(rèn)我們可否控制完成板厚為2.4+/-10%mm ?問(wèn)題： As show in figure, manu facturi ng requireme nts specificati on,

2、 using 17 um (1/2 oz) based copper, fini shed surface copper: 46 um (0.00181 ); it is differe nt from what shows 1oz for stackup.如下圖所示，制作說(shuō)明要求使用17um基銅，完成銅厚46um.這跟疊構(gòu)中的1OZ銅厚不符.建議：Use 1 oz based copper, fini shed surface copper: 46 um (0.00181 )使用1oz基銅，完成銅厚 46um.問(wèn)題： As show in the below figure, outer co

3、pper is 1 oz.We can make sure whether the fini shed surface copper is 1 oz.如下圖所示，外層銅厚為1OZ，我們不能確定完成銅厚是否為1OZ.建議： Using Hoz base copper, fini shed surface 1 oz copper;使用H oz基銅，成品銅厚為1oz.問(wèn)題:The stack-up your company provided did not conform the requireme nts of impeda nee, and the inner layers n eed to u

4、se 3 Pre-preg.貴司提供的疊構(gòu)不符合阻抗要求，且層需要用3pp建議： Adjust the thickness of the Pre-preg and the core 。See below.調(diào)整芯板和PP的厚度，見(jiàn)下圖問(wèn)題：The make-up like as the attachment( 12PCS/PNL)， in order to savethe cost ing ,please confirm if can accept 3 X-OUT per pan el?如附件所示拼版(12pcs/PNL)，為了節(jié)約成本，請(qǐng)確認(rèn)可否接受每個(gè)拼版建議： Accepted 3 X-O

5、UT per pan el,but not exceed 5% of order qua ntity.A ndpack them separately whe n shipp ing.接受每拼版出3個(gè)打叉板，但不超過(guò)總訂單數(shù)的 5%,且出貨時(shí)把打叉板分開(kāi)包裝.(6) 問(wèn)題： As show in figure, Your compa ny requireme nts accord ing to level 3 sta ndard con trols, this requireme nt is too hard to con trol for us如下圖所示，貴司要求按3級(jí)標(biāo)準(zhǔn)管控，我們較難管控

6、.建議： Con trolled by level 2 sta ndard producti on.按2級(jí)標(biāo)準(zhǔn)管控生產(chǎn).(7) Please confirm the attached panel draw ing.請(qǐng)確認(rèn)附件拼版圖（8）Above is our suggested stackup , please con firm.上圖為我司建議疊構(gòu)，請(qǐng)確認(rèn)（9）問(wèn)題：Your company have not provided the toleranee of board thickness , please confirm whether we could con trol it as 1

7、.6mm+/-10%？貴司沒(méi)有提供板厚公差，請(qǐng)確認(rèn)我司可否按1.6mm+/-10%來(lái)管控？（10）問(wèn)題： We cant find the finish copper thickness and solder mask color in spec ,please provide.我們?cè)谡f(shuō)明書(shū)中找不到完成銅厚和防焊顏色，請(qǐng)?zhí)峁┙ㄗh： Finish copper thick ness:1oz,SM color: matte gree n完成銅厚1OZ防焊顏色：?jiǎn)」饩G色（11 ）問(wèn)題：Please see Fig1,the numberin gerber is differentfromHIT-20

8、-001200-001 in spec.請(qǐng)看圖一，gerber中的料號(hào)跟說(shuō)明書(shū)中的HIT-20-001200-001不相符.建議： We will ignore this differe nee and follow the gerber file to produce this board.我們將忽略這個(gè)不同點(diǎn)，然后按照gerber來(lái)制作.（12）問(wèn)題： The customer requires use FR - 402 material, but we have not this kind of sheet material .客戶(hù)要求使用 FR-402板材，但我們沒(méi)有這種板材.建議：

9、We will use our com mon material product ion，Please confirm ！ LikeKB6160 or equivale nt in stead of FR-402.我們將使用常用的板材生產(chǎn)，請(qǐng)確認(rèn).像KB6160或同等級(jí)的板材來(lái)代替 FR-402.（13）問(wèn)題：In order to avoid the panel board scraped in process, we would like tocha nge the sharp corner to round an gle as R1.0mm.為了避免板子在生產(chǎn)過(guò)程中刮花，我們將尖的角倒角

10、為R1.0mm的角.（14）問(wèn)題： See below figure ，50 Ohm impeda nee is con trolled in the gerber, butthein dicated that had no con trolled impeda nce;Actually, the calculati on also cannotreach 50 Ohm impeda nee values .不用做阻抗控制。事實(shí)上也達(dá)不到見(jiàn)下圖，gerber中要求做50ohm阻抗控制，但中說(shuō)明50ohm阻抗值.建議：Ignore the impeda nee con trol.忽略阻抗控制.（

11、15）問(wèn)題： There is no 60mil core on our store ， we will adjust the stackup as below fig. B show.我們倉(cāng)庫(kù)沒(méi)有60mil的芯板，我們將調(diào)整疊構(gòu)，如圖B所示.(16) 問(wèn)題：It is too hard to keep con ductor widths and spaci ng with in 15% of data forUS.要將線寬距控制在+/-15%，對(duì)我們來(lái)說(shuō)太難了建議： We suggest to relax it as +/-20% to process .我們建議放寬到+/-20%(17)

12、問(wèn)題：You do not specify the incept standard. We will follow IPC-A-600G Class2and IPC-6012B Class2 to build this board.貴司沒(méi)有指明驗(yàn)收標(biāo)準(zhǔn)，我們將根據(jù)IPC2級(jí)標(biāo)準(zhǔn)來(lái)生產(chǎn)板子.(18) 問(wèn)題:It doesn specify thickness of Ni and Au.沒(méi)有說(shuō)明鎳和金的厚度.建議：We will control as : Ni: 3-6um min and Au 0.05um 我們將管控為：鎳最少 3-6um，金0.05um(19) 問(wèn)題: We can inpu

13、t the four files(see below fig. ) by our software用我們的軟件打不開(kāi)下圖的4個(gè)文件.建議： We will ignore the four files. 我們將忽略這4個(gè)文件.(20) 問(wèn)題： We are not sure the surface finish of this board , because the requirement of two files are different. (See below pictures.)我們不能確定這個(gè)板的表面處理，因?yàn)?個(gè)文件的要求不同.(見(jiàn)下圖)建議： We will follow imme

14、rsio n gold to produce.( Au:0.05um(mi n),Ni:3-6um)我們將按沉金制作.(金厚最少0.05um，鎳厚3-6um(21) 問(wèn)題：Please see below picture, the dimension between the gerber and thedrawing is different.請(qǐng)看下圖，圖紙和 gerber的尺寸不一樣.建議： We will follow gerber file to produce.我們將依gerber制作.(22) 問(wèn)題: We don know the usage of these file ,and

15、we think them havenothing to do for PCB manufacture. 我們不知道這些文件的用處，我們認(rèn)為他們對(duì)PCB生產(chǎn)沒(méi)有影響.建議：We will ignore it.我們將忽略他們.(23) 問(wèn)題： We dont have the standard of the BS EN0249-2-12:1994 in hand.我們沒(méi)有” BS EN0249-2-12:1994的標(biāo)準(zhǔn)控制.建議： We will ignore this standard and follow IPC-4101B standard to produce.我們將忽略這個(gè)標(biāo)準(zhǔn)，然后按

16、IPC-4101B標(biāo)準(zhǔn)來(lái)生產(chǎn).(24) 問(wèn)題：In the future, for the same series, if we meet the same questions likeas above, we will use the an swer directly后續(xù)問(wèn)題中，如有類(lèi)似以上問(wèn)題，我們將直接使用這次的回復(fù)來(lái)生產(chǎn)2文字（1）問(wèn)題： Some fonts are close to pads, into holes or outside of the board outli ne. 一些文字太靠近pad，進(jìn)孔或到了板外.建議： We will move them if possib

17、le, otherwise well clip them, please con firm.如果可能，我們將文字移動(dòng)，否則我們會(huì)修剪文字，請(qǐng)確認(rèn)（2）問(wèn)題：We will add the UL,including our logo and date code（WWYY） at free area onthe top silkscreen layer.我們將在頂層文字的空曠位置添加UL,包括我們的標(biāo)記和周期.（3）問(wèn)題：In order to ide ntify the board easily, we would like to add our internal partnu mber on

18、the breakaway rails. （ or n ear our compa ny UL ）為了更好地區(qū)分板子，我們想要在工藝邊上添加我司料號(hào).（或在我司UL附近）（4）問(wèn)題： We turn the logo to BLDT D-B on the bottom silkscreen or not?Pleaseconfirm.請(qǐng)確認(rèn)我們可否將底層文字的UL改為BLDT D-B ？（5）問(wèn)題：You request to add UL and date code （ WWYY）on the appo in ted positi on ,but the draw ing without ap

19、po in ted positi on。We will add our compa ny UL and datecode （ WWYY） on bottom silkscreen layer as below fig.貴司要求在指定位置添加UL和周期（WWYY），但圖紙上沒(méi)有標(biāo)出指定的位置.我們將在底層文字添加我司UL和周期（WWYY），見(jiàn)下圖.（6）問(wèn)題： Some White oil block are printed on the pads, it will affect the solderability of the pads. 一些白油塊在 pad上，這會(huì)影響 pad的焊接性能.建

20、議： We will modify the lege nd to avoid them expos ing on the pads.我們將修剪文字來(lái)避免他們上pad.（7）問(wèn)題： Some fonts are too close to the outline,it may cause the fonts to be in complete after manu facturi ng.一些文字太靠近外形線，這可能會(huì)導(dǎo)致加工后文字出現(xiàn)殘缺建議： Reduce the font size to accommodate the tight space if possible， otherwise ac

21、cept the in complete fon ts.如果可能的話(huà)，縮小文字到一個(gè)小空間，否則就接受文字殘缺（8）問(wèn)題：Tthere is no eno ugh space for add ing the UL and date code on the topsilkscreen layer頂層文字不夠空間添加UL.和周期建議： A： We will add them on the bottom silkscreen layer.B: We will add them on the top soldermask layer.A :在底層文字添加B:在頂層防焊添加（9）問(wèn)題： Some leg

22、e nd are not mirrored on the bottom sides.在底層中，有一些文字沒(méi)有鏡像建議：A: we will follow geber to produce and accept the lege nd are in verse.B:we will mirror it.A :我們將依gerber生產(chǎn)，要接受反字.B:我們將鏡像制作.（10）問(wèn)題：The lege nd is very close to dummy copper pads in the work ing gerber.在工作稿中的文字太靠近焊盤(pán).建議： A:We will shave the dum

23、my copper pads to avoid the illegible lege nd.B: Follow worki ng gerber to build,a nd the illegible lege nd is acceptableA :我們將削銅粒來(lái)避免文字模糊.B:依工作稿制作，接受文字模糊 .（11）問(wèn)題：In order to avoid the silkscree n is miss ing, we will add the check patter nson the breakaway rail.為了防止漏印文字，我們將在工藝邊添加測(cè)試圖案3防焊（1）問(wèn)題：Spaci n

24、g betwee n IC pads are 6.7mil and 7.5mil. We n eed 7.8mil to keep the solde rmask dam.Becausethe solder mask ink are blue color which is out of our capability to build the blue solder mask dam.IC之間的距離是6.7和7.5mil，我們需要7.8mil的距離來(lái)做防焊橋.因 為防焊顏色為藍(lán)色，這樣距離的藍(lán)油橋超出我們的制程建議： We suggest can celi ng the solder mask

25、dam where the IC spaci ng is less tha n 7.8mil and make gang relief. Please confirm is that acceptable.我們建議在小于7.8mil的地方取消做防焊橋，然后按開(kāi)通窗制作.請(qǐng)確認(rèn)是否接受.（2）問(wèn)題：Spaci ng between the BGA PAD and via hole is only 9.8mil, and theres solder mask dam. The spaci ng is too small to keep dam.BGA到過(guò)孔的距離只有 9.8mil，而且要做防焊橋.

26、這個(gè)距離太小，不能做橋. 建議: We will remove the vias （not the BGA pads） openings 我們將移除過(guò)孔的開(kāi)窗（不是 BGA的開(kāi)窗）.（3）問(wèn)題： The 莎 29mil component holes without solder mask openings on bottom sides,the solder mask ink will flow into holes/ 29mil的元件孔在底面沒(méi)有開(kāi)窗，油墨會(huì)進(jìn)孔建議： A) We add solder mask ope nings for hole, Make sure the oil i

27、s not onthe PAD and not flow into the hole.B) We follow the GERBER to do ,Please confirm the solder mask ink will flow into holes are accepted.A:我們將為這些孔添加防焊開(kāi)窗，確保油墨不上 pad和油墨不進(jìn)孔. B：我們根據(jù)gerber制作，請(qǐng)確認(rèn)可接受油墨進(jìn)孔(4) 問(wèn)題:See below figure,there is one pad on the bottom paste layer, but it without soldermask open

28、ing on the bottom solder layer.見(jiàn)下圖.貼片層上有一個(gè) pad 沒(méi)有開(kāi)窗.建議： A: follow the gerber.B:Add soldermask ope ningthat is 8mil bigger tha n the pad.A：依gerber制作.B:加一個(gè)比pad大8mil的開(kāi)窗.(5) 問(wèn)題： The 1.0mm holes with soldermask opening on the top soldermask layer ,but the bottom layer.Please comfirm our suggesti on1.0mm的

29、孔在頂層有開(kāi)窗，但底層沒(méi)開(kāi)窗。請(qǐng)確認(rèn)我們的建議.建議： A: Follow the gerber to process. 按 gerber 生產(chǎn).B： Add the soldermask opening for the holes on the bottom layer , the size is the same as the top.在底層添加開(kāi)窗，大小跟頂層一樣(6) 問(wèn)題：The soldermask opening of dia.0.40mm holes is only 8mil bigger than the via holes.直徑0.40mm的孔防焊開(kāi)窗只比過(guò)孔大8mil.建

30、議： A: Can cel the soldermask ope ning of via holes , the via holes plugged with solder mask is accepted.取消過(guò)孔的防焊開(kāi)窗，接受過(guò)孔塞油.B： follow the gerber , and accept solder mask into the hole but no pluggi ng依gerber制作，接受油墨入孔，但不塞孔.(7) 問(wèn)題：The two dia.3.2mm holes are specified as PTH in drill chart .But the solde

31、rmask ope ning is less tha n the pads on bottom soldermask layers.分孔表上直徑3.2mm的孔是制作為PTH,但在底層防焊層里，開(kāi)窗比pad 小. 建議： We will follow gerber to produce , and allow the solder mask encroach onto these pads. 我們將根據(jù) GERBER生產(chǎn)，然后接受油墨上pad.(8) 問(wèn)題：Some solder mask opening for the fiducial mark is too big that it caus

32、ed n earbori ng trace exposed in the work ing gerber.一些光學(xué)點(diǎn)的開(kāi)窗太大，導(dǎo)致工作稿中他們鄰近的導(dǎo)線露銅建議： We will trim the solder mask opening to avoid the trace exposed.我們將修改防焊開(kāi)窗來(lái)避免銅線外露.(9) 問(wèn)題：There is no solder mask ope ning on one side for the via hole 16mil.16mil的孔有一面防焊沒(méi)開(kāi)窗.建議：A: Plug these via holes with solder mask i

33、nk.B: Add solder mask opening both sides for the via hole 16mil.A:塞孔制作.B：16mil的孔雙面開(kāi)窗.4線路(1) 問(wèn)題：Fab spec in dicates con trolled impeda nee, but does nt in dicate the trace width/gap and which layer(s).說(shuō)明書(shū)要求控制阻抗，但沒(méi)有指明阻抗線是哪層和線寬距建議： Please provide, or please confirm if we can ignore the impedanee reques

34、t請(qǐng)?zhí)峁?，或?qǐng)確認(rèn)我們是否可以忽略這個(gè)阻抗要求(2) 問(wèn)題： The fiducial marks are isolated so they can easily peel off duringproductio n.光學(xué)點(diǎn)是孤立的，所有生產(chǎn)時(shí)容易脫落建議： We will add the protective copper ring around them. Please confirm isthat acceptable.我們將在他們周?chē)砑颖Ｗo(hù)環(huán)。請(qǐng)確認(rèn)可否接受(3) 問(wèn)題： Vias to be covered per the additional requirement.過(guò)孔制作方式

35、按照特別要求.建議：there are 8mil, 10mil and 12mil holes, so we will treat all of them asvias, plug and cover them with solder mask by removi ng the solder mask ope nings on both sides if any, and leave the other holes (24mils and greater) solder mask as desig n, correct?我們把8mil, 10mil和12mil的孔定為過(guò)孔，在每一面通過(guò)去掉防焊

36、開(kāi)窗來(lái)使 他們?nèi)?，像設(shè)計(jì)那樣把其他的孔( 24mil或更大的)開(kāi)窗制作，正確嗎？(4) 問(wèn)題：3 tooling holes (3.2mm NPTH) to be added on rails per the additionalrequirement.按照特殊要求添加 3個(gè)3.2mmNPTH在工藝邊上.建議： We suggest adding tooling holes on all 4 corners of the rails to provide more flexibilities during PCB manufacturing and assembly, and add 3 f

37、iducials (1mm round pads, 3mm solder mask openings) on 3 corners to be fool-proof, is that acceptable?我們建議在工藝邊的4個(gè)角添加定位孔，來(lái)使更適合PCB生產(chǎn)和裝配.在3個(gè)角上添加3個(gè)光學(xué)點(diǎn)(1mm大小，3mm開(kāi)窗)來(lái)防呆，能接受嗎？we will remove the no-function(5) 問(wèn)題：In order to facilitated in product ion isolated pads on the inner layers.為方便生產(chǎn)，我們將刪除層里一些無(wú)功能的孤立p

38、ad.（6）問(wèn)題： Some solder mask ope nings are very big and expos ing the surroundingcopper pla nes.些防焊開(kāi)窗太大，會(huì)導(dǎo)致銅皮外露建議： We will reduce the solder mask openings to our default pad opening size, and if theres still a risk of exposing the surrounding copper, we will shave the copper pla ne a little to avoid e

39、xposure, is that acceptable?我們將會(huì)對(duì)不正常的防焊開(kāi)窗縮小，如果仍然有銅外露的風(fēng)險(xiǎn)，我們將會(huì)削一點(diǎn)銅皮來(lái)避免外露，能接受嗎？（7）問(wèn)題： Outer layers to be 2.1mil （1.5oz, we con sider it as nomin al） per providedstackup, but due to the tight spaci ng （5.8mil only） on this desig n we can only use 0.5oz base copper.所提供的疊構(gòu)中，外層銅厚為2.1mil （ 1.5oz，我們認(rèn)為這是近似值），

40、但由于設(shè)計(jì)上緊密的線距（只有 5.8mil），我們只能用0.5oz的基銅來(lái)制作.建議： We will use 0.5oz base copper and plate to minimum 1oz copper on outer layers, is that acceptable?我們將使用0.5oz底銅，然后外層最少電鍍到1oz銅厚，這能接受嗎？（8）問(wèn)題：Inner layers to be 2oz per provided stackup, but the spac ing on inner layers is tight, also we cant follow the provid

41、ed stackup on the dielectric thick ness un der outer layers because they are too thin for 2oz copper.根據(jù)所提供的疊構(gòu)，層要做 2oz，但是層的線太密，滿(mǎn)足外層的阻抗的條件 下，我們不能使用所提供的疊構(gòu).因?yàn)樵?oz的銅厚條件下，介電物質(zhì)太薄了.建議： Option A: to use 1oz copper on inner layers, and we dont need to change the stackup and impeda nee trace widths;Optio n B:

42、to use 2oz copper on inner layers, but n eed to cha nge the stackup and impda nee trace widths.建議A:層使用1oz銅厚，這樣我們就不需要調(diào)整疊構(gòu)和阻抗線的線寬建議B:層使用2oz銅厚，但需要調(diào)整疊構(gòu)和阻抗線的線寬.（9）問(wèn)題：The PAD is too closed to the outline, which will induce the copper exposed after process.Pad太靠近外形線，會(huì)導(dǎo)致加工后出現(xiàn)銅外露的現(xiàn)象建議： Shave the copper keep

43、to the outl ine 8mil to avoid the copper exposed. 削銅保持距離外形線 8mil，防止銅外露.（10）問(wèn)題： See your compa ny provide the SPC, we are not sure whether to n eed to in crease the fiducial mark on the breakaway rail.（Because the breakaway rail have not fiducial mark in the GERBER）根據(jù)貴司提供的說(shuō)明書(shū)，我們不確定是否需要在工藝邊上添加光學(xué)點(diǎn).（因?yàn)間

44、erber中的工藝邊上沒(méi)有光學(xué)點(diǎn)）建議：A） We will add the / 2.0mm fiducial mark and / 3.0mm solder mask opening of fiducial marks on breakaway rails （see fig ）.B） Do not need add fiducial mark on the breakaway rail,follow the gerber todo.A :我們將在工藝邊上添加/2.0mm的光學(xué)點(diǎn)，開(kāi)窗 3mm.（見(jiàn)圖）B：不需要再工藝邊上加光學(xué)點(diǎn)，按gerber制作.（11）問(wèn)題： We will add t

45、he V-cut testi ng pads to avoid V-cut being missed.我們將添加 V-CUT測(cè)試pad來(lái)防止漏V-CUT.（12）問(wèn)題:In order to balance the plating electric current, we would like to adddummy copper foil （copper pads）on the breakaway rails. 為了平衡電鍍的電 流，我們想要在工藝邊上添加銅皮.（銅pad）（13）問(wèn)題：See below figure ，the copper is too close to the outl

46、ine，it would causethe copper exposed.見(jiàn)下圖，銅皮到外形線太近，這會(huì)導(dǎo)致銅皮外露建議： A: accept exposed copper.B： shaving the copper ，keep it 10mil from outline and 16mil from V-CUTline.A:接受露銅.B：削銅，使之距離外形線 10mil，距離V-CUT線16mil.（14）問(wèn)題：Inner and outer layers in the gerber have meanin gless line.Gerber的層和外層存在無(wú)意義的線.建議：A: follow

47、 the gerber. 依 gerber 制作.B： Delete the meaningless line刪除無(wú)意義的線.（15）問(wèn)題： This board is a bare board without copper.we will build withoutfiducials.這是一個(gè)光板，我們將不加光學(xué)點(diǎn)（1）問(wèn)題:In order to plate the gold on finger.We will add the leading plating line as the below picture.為了電金手指，我們將添加如下圖的電鍍線.（2）問(wèn)題： We found the

48、area of gold fin ger have solder mask dam in the Gerber.我們?cè)趃erber中發(fā)現(xiàn)金手指位置有阻焊橋.建議： To aviod the solder mask dam affects the function gold finger,we will cancel it and add the full solder mask ope ning for the area of gold fin ger.為了避免阻焊橋影響金手指的功能，我們將刪除阻焊橋和在金手指位置開(kāi)通窗.（3）問(wèn)題： No specify the depth tolera n

49、ce of gold fin ger bevel edge. We will buildgold fin ger bevel edge depthtolera nce as 0.2mm.沒(méi)有說(shuō)明金手指斜邊的公差，我們將按+/-0.2mm 制作.(4) 問(wèn)題： The gold fin ger is too close to the outl ine.lt will cause the copper exposed.金手指太靠近外形線，這會(huì)導(dǎo)致銅外露.建議:A:To clip gold fin ger to get 52mil (min) space to avoid copper expose

50、d.B: Follow Gerber to do, please accept copper exposed.A :修剪金手指，保證離外形最少有52mil的距離，防止銅皮外露B:依GERBER制作，請(qǐng)接收銅外露.(5)問(wèn)題:It does not specifythe bevel an gletolera nee.沒(méi)有說(shuō)明斜邊角度的公差.建議:The bevel angle as 5 to control.斜邊角度按+/-5 來(lái)管控(6)問(wèn)題： The gold fin ger outside is the breakaway rail ， we cant make the goldfin g

51、er chamfer.金手指邊沿是工藝邊，我們做不了金手指的斜邊建 議： A : Canel the breakaway on goldfin gerside.B: Dont make the gold fin ger bevel edge.A :在金手指那邊取消工藝邊.B:不做金手指斜邊.(1) 問(wèn)題：The 莎 0.35mm holes diameter toleranee :0.05mm is too hard to control.少0.35mm的孔公差+/-0.05mm 太難管控.建議： This kind of holes diamater toleranee : 0.076mm這

52、類(lèi)孔的公差為+/-0.076mm(2) 問(wèn)題: The quantity of holes are different between excel spec and gerber file.Excel文檔跟gerber的孔數(shù)不同.建議： We will follow gerber file to do and ignore the differenee我們將根據(jù)gerber來(lái)制作，忽略這個(gè)不同點(diǎn).(3) 問(wèn)題： some data cant measure in drawing , suggest to ignore it and follow the GERBER to do。圖紙上的一些數(shù)據(jù)測(cè)量不了，建議忽略他們，然后根據(jù)gerber來(lái)制作.(4) 問(wèn)題：Customer did not identify the V - CUT Angle, and the laminate remained : 0.5+ 0.127 /-0 mm and V-CUT can extend 30% into board max, we als